公开(公告)号：US20230003788A1

公开(公告)日：2023-01-05

申请号：US17366316

申请日：2021-07-02

申请人： TESSANDRA ANNE SAGE ,  STANLEY KATSUYOSHI WAKAMIYA ,  JONATHAN FRANCIS VAN DYKE ,  KEVIN COLLAO ,  JOSHUA P. OSBORNE

发明人： TESSANDRA ANNE SAGE ,  STANLEY KATSUYOSHI WAKAMIYA ,  JONATHAN FRANCIS VAN DYKE ,  KEVIN COLLAO ,  JOSHUA P. OSBORNE

IPC分类号： G01R31/28 ,  G01R1/073

摘要： One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes at least one wafer prober configured to implement a test on a superconducting die of the plurality of superconducting die via a plurality of electrical probe contacts. The system further includes a wafer chuck actuator system confined within a second chamber. The wafer chuck actuator system can be configured to provide at least one of translational and rotational motion of the wafer chuck to facilitate alignment and contact of a plurality of electrical contacts of the superconducting die to the respective plurality of electrical probe contacts of the at least one wafer prober.

公开(公告)号：US11693047B2

公开(公告)日：2023-07-04

申请号：US17366316

申请日：2021-07-02

申请人： Tessandra Anne Sage ,  Stanley Katsuyoshi Wakamiya ,  Jonathan Francis Van Dyke ,  Kevin Collao ,  Joshua P. Osborne

发明人： Tessandra Anne Sage ,  Stanley Katsuyoshi Wakamiya ,  Jonathan Francis Van Dyke ,  Kevin Collao ,  Joshua P. Osborne

IPC分类号： G01R31/28 ,  G01R1/073

CPC分类号： G01R31/2849 ,  G01R1/07342

摘要： One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes at least one wafer prober configured to implement a test on a superconducting die of the plurality of superconducting die via a plurality of electrical probe contacts. The system further includes a wafer chuck actuator system confined within a second chamber. The wafer chuck actuator system can be configured to provide at least one of translational and rotational motion of the wafer chuck to facilitate alignment and contact of a plurality of electrical contacts of the superconducting die to the respective plurality of electrical probe contacts of the at least one wafer prober.