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公开(公告)号：US11693047B2
公开(公告)日：2023-07-04
申请号：US17366316
申请日：2021-07-02
申请人： Tessandra Anne Sage , Stanley Katsuyoshi Wakamiya , Jonathan Francis Van Dyke , Kevin Collao , Joshua P. Osborne
发明人： Tessandra Anne Sage , Stanley Katsuyoshi Wakamiya , Jonathan Francis Van Dyke , Kevin Collao , Joshua P. Osborne
CPC分类号： G01R31/2849 , G01R1/07342
摘要： One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes at least one wafer prober configured to implement a test on a superconducting die of the plurality of superconducting die via a plurality of electrical probe contacts. The system further includes a wafer chuck actuator system confined within a second chamber. The wafer chuck actuator system can be configured to provide at least one of translational and rotational motion of the wafer chuck to facilitate alignment and contact of a plurality of electrical contacts of the superconducting die to the respective plurality of electrical probe contacts of the at least one wafer prober.
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公开(公告)号：US11639957B2
公开(公告)日：2023-05-02
申请号：US17366337
申请日：2021-07-02
申请人： Kelsey McCusker , Stanley Katsuyoshi Wakamiya , Jonathan Shane Atienza , Jonathan Francis Van Dyke , Kevin Collao
发明人： Kelsey McCusker , Stanley Katsuyoshi Wakamiya , Jonathan Shane Atienza , Jonathan Francis Van Dyke , Kevin Collao
IPC分类号： G01R31/28
摘要： One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes a second chamber that is held at a non-cryogenic temperature and which comprises a wafer chuck actuator system configured to provide at least one of translational and rotational motion of the wafer chuck via mechanical linkage interconnecting the wafer chuck and the wafer chuck actuator system. The system further includes a radiation barrier arranged between the first chamber and the second chamber and through which the mechanical linkage extends, the radiation barrier being configured to provide a thermal gradient between the cryogenic temperature of the first chamber and the non-cryogenic temperature of the second chamber.
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公开(公告)号：US07866936B2
公开(公告)日：2011-01-11
申请号：US11797153
申请日：2007-05-01
申请人： Karl Lewis Schuck , Jacob L. Timm , Stanley Katsuyoshi Wakamiya , Patrick Cowgill , Stephanie Lauretano Miskiewicz , Charles Stewart Shaw
发明人： Karl Lewis Schuck , Jacob L. Timm , Stanley Katsuyoshi Wakamiya , Patrick Cowgill , Stephanie Lauretano Miskiewicz , Charles Stewart Shaw
IPC分类号： B65G57/00
CPC分类号： B65G65/00 , B65G2207/46
摘要： A system and method for transferring mail between containers in an orderly and secure manner. The system and method utilize ejection rods to lift mail from an input tray into a transfer box assembly that deposits the mail into an output tray in an orderly, stable and secure manner, ensuring that mail is not shuffled or lost during the transfer process.
摘要翻译： 一种用于以有序和安全的方式在邮箱之间传送邮件的系统和方法。 该系统和方法利用排出杆将邮件从进纸盘提升到传送箱组件中，该传送盒组件以有序，稳定和安全的方式将邮件存入输出托盘中，确保邮件在传送过程中不被洗牌或丢失。
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公开(公告)号：US10342151B2
公开(公告)日：2019-07-02
申请号：US16178259
申请日：2018-11-01
申请人： Martin Brokner Christiansen , Leonard George Chorosinski , H. Craig Heffner , Stanley Katsuyoshi Wakamiya
发明人： Martin Brokner Christiansen , Leonard George Chorosinski , H. Craig Heffner , Stanley Katsuyoshi Wakamiya
摘要： A method of maintaining a circuit card in a card rack and a circuit card rack system are disclosed. A card rack including a laterally oriented clamping slot is provided. The clamping slot is at least partially formed from a temperature-contractible material. A circuit card having a clamped side region is provided. At least a portion of the clamped side region is inserted into the clamping slot. A predetermined temperature differential is applied to the clamping slot to reduce a longitudinal dimension of at least a portion of the clamping slot. A compressive force is exerted on the portion of the clamped side region which is located longitudinally within the clamping slot, via thermal expansion of the clamping slot.
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公开(公告)号：US10159161B2
公开(公告)日：2018-12-18
申请号：US14943385
申请日：2015-11-17
申请人： Martin Brokner Christiansen , Leonard George Chorosinski , H. Craig Heffner , Stanley Katsuyoshi Wakamiya
发明人： Martin Brokner Christiansen , Leonard George Chorosinski , H. Craig Heffner , Stanley Katsuyoshi Wakamiya
摘要： A method of maintaining a circuit card in a card rack and a circuit card rack system are disclosed. A card rack including a laterally oriented clamping slot is provided. The clamping slot is at least partially formed from a temperature-contractible material. A circuit card having a clamped side region is provided. At least a portion of the clamped side region is inserted into the clamping slot. A predetermined temperature differential is applied to the clamping slot to reduce a longitudinal dimension of at least a portion of the clamping slot. A compressive force is exerted on the portion of the clamped side region which is located longitudinally within the clamping slot, via thermal expansion of the clamping slot.
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公开(公告)号：US09681533B2
公开(公告)日：2017-06-13
申请号：US14943337
申请日：2015-11-17
申请人： Martin Brokner Christiansen , Leonard George Chorosinski , H. Craig Heffner , Stanley Katsuyoshi Wakamiya , Keith R. Kirkwood
发明人： Martin Brokner Christiansen , Leonard George Chorosinski , H. Craig Heffner , Stanley Katsuyoshi Wakamiya , Keith R. Kirkwood
CPC分类号： H05K1/0204 , H01L23/445 , H05K1/00 , H05K5/0213 , H05K13/00
摘要： An apparatus for, and method of, providing a desired temperature-differential circuit card environment includes a plurality of card units. Each card unit comprises a first thermal plate having front and back first plate sides oriented in a lateral-longitudinal plane, the first thermal plate operating at a first plate temperature. A second thermal plate has front and back second plate sides oriented in the lateral-longitudinal plane, the second thermal plate operating at a second plate temperature. A coupler is oriented in the lateral-longitudinal plane and is connected to front and/or back first plate sides and to the front and/or back second plate sides to form a card unit. The card units are arranged in a transversely oriented stack with the front first and second plate sides of a second card unit being directly transversely adjacent the back first and second plate sides of the first card unit.
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公开(公告)号：US09648749B1
公开(公告)日：2017-05-09
申请号：US14943299
申请日：2015-11-17
申请人： Martin Brokner Christiansen , Leonard George Chorosinski , H. Craig Heffner , Stanley Katsuyoshi Wakamiya , Keith R. Kirkwood
发明人： Martin Brokner Christiansen , Leonard George Chorosinski , H. Craig Heffner , Stanley Katsuyoshi Wakamiya , Keith R. Kirkwood
CPC分类号： H05K1/181 , H05K1/0203 , H05K1/0271 , H05K1/0298 , H05K1/0306 , H05K1/115 , H05K3/303 , H05K3/46 , H05K2201/0338 , H05K2201/068 , H05K2201/09063 , H05K2201/09663 , H05K2201/09672 , H05K2201/09763
摘要： A circuit card assembly includes a substrate having longitudinally spaced first and second substrate end edges and transversely spaced top and bottom substrate surfaces. The top and/or bottom substrate surface has first, second, and third substrate regions. The first substrate region is directly laterally adjacent the first substrate side edge. The third substrate region is directly laterally adjacent the second substrate side edge. The second substrate region is located between the first and third substrate regions. At least one circuit trace is located on the selected substrate surface. The portion of the circuit trace in the first substrate region is made of only a first material. The portion of the circuit trace in the third substrate region is made of only a second material. The portion of the circuit trace in the second substrate region is made of both the first and second materials.
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公开(公告)号：US10438867B2
公开(公告)日：2019-10-08
申请号：US15916019
申请日：2018-03-08
申请人： Martin Brokner Christiansen , Leonard George Chorosinski , Harlan Craig Heffner , Stanley Katsuyoshi Wakamiya , Keith R. Kirkwood
发明人： Martin Brokner Christiansen , Leonard George Chorosinski , Harlan Craig Heffner , Stanley Katsuyoshi Wakamiya , Keith R. Kirkwood
摘要： An apparatus for providing immersion cooling in a circuit card environment includes a circuit card having first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, respectively, which are different from one another. A thermal energy transfer device is operatively connected to an area of the circuit card correlated with a selected one of the first and second circuit card subassemblies. The thermal energy transfer device at least partially induces the respective one of the first and second operating temperatures to the selected circuit card subassembly. The thermal energy transfer device transversely overlies at least a supermajority of the selected circuit card subassembly and is laterally spaced from the other circuit card subassembly. A system and method for providing immersion cooling are also provided.
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公开(公告)号：US20080271971A1
公开(公告)日：2008-11-06
申请号：US11797153
申请日：2007-05-01
申请人： Karl Lewis Schuck , Jacob L. Timm , Stanley Katsuyoshi Wakamiya , Patrick Cowgill , Stephanie Lauretano Miskiewicz , Charles Stewart Shaw
发明人： Karl Lewis Schuck , Jacob L. Timm , Stanley Katsuyoshi Wakamiya , Patrick Cowgill , Stephanie Lauretano Miskiewicz , Charles Stewart Shaw
IPC分类号： B65G11/04
CPC分类号： B65G65/00 , B65G2207/46
摘要： A system and method for transferring mail between containers in an orderly and secure manner. The system and method utilize ejection rods to lift mail from an input tray into a transfer box assembly that deposits the mail into an output tray in an orderly, stable and secure manner, ensuring that mail is not shuffled or lost during the transfer process.
摘要翻译： 一种用于以有序和安全的方式在邮箱之间传送邮件的系统和方法。 该系统和方法利用排出杆将邮件从进纸盘提升到传送箱组件中，该传送盒组件以有序，稳定和安全的方式将邮件存入输出托盘中，确保邮件在传送过程中不被洗牌或丢失。
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公开(公告)号：US06950724B2
公开(公告)日：2005-09-27
申请号：US10697033
申请日：2003-10-31
CPC分类号： B07C3/00 , B07C3/008 , B07C3/02 , Y10S209/90
摘要： The mail sorting systems and methods of the invention can be used to provide a mail carrier with a batch of mail that is arranged in delivery point order and separated by delivery point. Advantageously, the systems and methods employ an expandable, transportable container having a number of expandable compartments. Each expandable compartment holds the mail for a single delivery point.
摘要翻译： 本发明的邮件分类系统和方法可以用于向邮件承运人提供一批邮件，这些邮件按照递送点顺序排列并以交付点分隔。 有利地，系统和方法采用具有多个可扩展隔室的可扩张的可运输容器。 每个可扩展隔间将邮件保存在单个交付点。
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