公开(公告)号：US20230013390A1

公开(公告)日：2023-01-19

申请号：US17680204

申请日：2022-02-24

Applicant: JTRON TECHNOLOGY CORP.

Inventor： CHEN-NAN CHEN

IPC: G01R31/28 ,  G01R1/073

Abstract: A detection apparatus and an anti-bending device thereof are provided. The detection apparatus includes a probe card circuit board, at least one probe, and the anti-bending device. The probe card circuit board has a first board surface and a second board surface on opposite sides thereof The at least one probe is mounted on the first board surface. The anti-bending device includes an anti-bending frame, at least one sensor, a processing circuit, and a transmission part. The anti-bending frame is mounted on the second board surface of the probe card circuit board, and the at least one sensor is disposed on the anti-bending frame or the probe card circuit board. The processing circuit is disposed inside the anti-bending frame. The transmission part is mounted on the anti-bending frame, and is electrically coupled to the processing circuit.

公开(公告)号：US12099083B2

公开(公告)日：2024-09-24

申请号：US17680204

申请日：2022-02-24

Applicant: JTRON TECHNOLOGY CORP.

Inventor： Chen-Nan Chen

IPC: G01R31/28 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/20 ,  G01R31/26

CPC classification number: G01R31/2808 ,  G01R1/07307

Abstract: A detection apparatus and an anti-bending device thereof are provided. The detection apparatus includes a probe card circuit board, at least one probe, and the anti-bending device. The probe card circuit board has a first board surface and a second board surface on opposite sides thereof. The at least one probe is mounted on the first board surface. The anti-bending device includes an anti-bending frame, at least one sensor, a processing circuit, and a transmission part. The anti-bending frame is mounted on the second board surface of the probe card circuit board, and the at least one sensor is disposed on the anti-bending frame or the probe card circuit board. The processing circuit is disposed inside the anti-bending frame. The transmission part is mounted on the anti-bending frame, and is electrically coupled to the processing circuit.