公开(公告)号：US20070176281A1

公开(公告)日：2007-08-02

申请号：US11698884

申请日：2007-01-29

申请人： Ki-Don Kim ,  Jae-Seon An ,  Seong-Chul Choi ,  Seong-Eun Sim ,  Hyun-Kyu Lee ,  Su-Jin Lim

发明人： Ki-Don Kim ,  Jae-Seon An ,  Seong-Chul Choi ,  Seong-Eun Sim ,  Hyun-Kyu Lee ,  Su-Jin Lim

IPC分类号： H01L23/12

CPC分类号： H01L23/49827 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48235 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes a substrate having a plurality of through holes for interconnecting electrically conductive traces formed on upper and lower surfaces of the substrate. The through holes are classified into a first set of through holes and a second set of through holes. The second set of through holes is located exterior of the first set of through holes, and surrounds the first set of through holes. A die is mounted on the upper surface of the substrate and is connected electrically to the first set of through holes. A metal shield is disposed on the substrate for enclosing the die therein and is connected electrically to the second set of through holes. A molding resin encapsulates the metal shield, the die on the substrate and fills a gap confined between the metal shield and the die.

摘要翻译： 半导体封装包括具有多个通孔的衬底，用于互连形成在衬底的上表面和下表面上的导电迹线。 通孔分为第一组通孔和第二组通孔。 第二组通孔位于第一组通孔的外部，并且包围第一组通孔。 模具安装在基板的上表面上并与第一组通孔电连接。 金属屏蔽件设置在基板上，用于将管芯封装在其中并与第二组通孔电连接。 模塑树脂将金属屏蔽件，模具封装在基板上，并填充限定在金属屏蔽件和模具之间的间隙。