公开(公告)号：US20060073617A1

公开(公告)日：2006-04-06

申请号：US10949760

申请日：2004-09-24

申请人： Bruce Whitefield ,  Jason McNichols

发明人： Bruce Whitefield ,  Jason McNichols

IPC分类号： H01L21/00

CPC分类号： G01R31/2891 ,  G01R31/311

摘要： A method for creating a reference for a first position on a substrate edge. A first reference point is selected relative to a circumference of the substrate edge, and a second reference point is selected relative to a bevel of the substrate edge. A first distance along the circumference of the substrate edge between the first reference point and the first position is identified as a first coordinate, and a second distance along the bevel of the substrate edge between the second reference point and the first position is identified as a second coordinate. The first coordinate and the second coordinate are used as the reference for the first position.

摘要翻译： 一种用于为衬底边缘上的第一位置创建参考的方法。 相对于衬底边缘的圆周选择第一参考点，并且相对于衬底边缘的斜面选择第二参考点。 沿着第一参考点和第一位置之间的衬底边缘的圆周的第一距离被识别为第一坐标，并且沿着第二参考点和第一位置之间的衬底边缘的斜面的第二距离被识别为 第二个坐标。 第一坐标和第二坐标用作第一位置的参考。

公开(公告)号：US07312880B2

公开(公告)日：2007-12-25

申请号：US10925497

申请日：2004-08-24

申请人： Bruce Whitefield ,  Jason McNichols ,  David Sturtevant

发明人： Bruce Whitefield ,  Jason McNichols ,  David Sturtevant

IPC分类号： G01B11/14

CPC分类号： G01N21/9503

摘要： A method of determining the distance from an edge feature to a wafer edge. The wafer is put onto an image acquisition tool, and images are captured and classified. Based on the coordinates of the images and their classifications, the distance between an edge feature and the wafer edge is determined. Reference marks can be etched into the wafer to facilitate the measurement. The measurement technique is objective, and can be used to minimize the edge exclusion ring as well as defects that originate from the edge of the wafer.

摘要翻译： 确定从边缘特征到晶片边缘的距离的方法。 将晶片放置在图像采集工具上，并对图像进行捕获和分类。 基于图像的坐标及其分类，确定边缘特征与晶片边缘之间的距离。 可以将参考标记蚀刻到晶片中以便于测量。 测量技术是客观的，可用于最小化边缘排除环以及源自晶片边缘的缺陷。

公开(公告)号：US20060044571A1

公开(公告)日：2006-03-02

申请号：US10925497

申请日：2004-08-24

申请人： Bruce Whitefield ,  Jason McNichols ,  David Sturtevant

发明人： Bruce Whitefield ,  Jason McNichols ,  David Sturtevant

IPC分类号： G01N21/00 ,  G01B11/14

CPC分类号： G01N21/9503

摘要： A method of determining the distance from an edge feature to a wafer edge. The wafer is put onto an image acquisition tool, and images are captured and classified. Based on the coordinates of the images and their classifications, the distance between an edge feature and the wafer edge is determined. Reference marks can be etched into the wafer to facilitate the measurement. The measurement technique is objective, and can be used to minimize the edge exclusion ring as well as defects that originate from the edge of the wafer.

摘要翻译： 确定从边缘特征到晶片边缘的距离的方法。 将晶片放置在图像采集工具上，并对图像进行捕获和分类。 基于图像的坐标及其分类，确定边缘特征与晶片边缘之间的距离。 可以将参考标记蚀刻到晶片中以便于测量。 测量技术是客观的，可用于最小化边缘排除环以及源自晶片边缘的缺陷。

公开(公告)号：US20050023491A1

公开(公告)日：2005-02-03

申请号：US10628614

申请日：2003-07-28

申请人： Roger Young ,  John Knoch ,  Jason McNichols

发明人： Roger Young ,  John Knoch ,  Jason McNichols

IPC分类号： G01N21/95 ,  G01V8/00 ,  G01N21/88 ,  H04N7/18

CPC分类号： G01N21/9503 ,  G01N2021/8896

摘要： A wafer edge defect inspection method and apparatus for use in an integrated circuit fabrication system includes an image capturing device for capturing images of the edges of wafers, a database in which the images are stored and accessible for analysis and a computer for analyzing the images of one or more wafer edges to locate edge defects and for evaluating the performance of the fabrication system. The inspection and data storage are performed automatically. The database storage enables detailed analysis of many wafers and fabrication process steps.

摘要翻译： 用于集成电路制造系统的晶片边缘缺陷检查方法和装置包括：用于捕获晶片边缘的图像的图像捕获装置，存储图像并可访问的用于分析的数据库;以及用于分析图像的图像的计算机 一个或多个晶片边缘以定位边缘缺陷并用于评估制造系统的性能。 自动执行检查和数据存储。 数据库存储可以对许多晶圆和制造工艺步骤进行详细分析。