公开(公告)号：US07312880B2

公开(公告)日：2007-12-25

申请号：US10925497

申请日：2004-08-24

申请人： Bruce Whitefield ,  Jason McNichols ,  David Sturtevant

发明人： Bruce Whitefield ,  Jason McNichols ,  David Sturtevant

IPC分类号： G01B11/14

CPC分类号： G01N21/9503

摘要： A method of determining the distance from an edge feature to a wafer edge. The wafer is put onto an image acquisition tool, and images are captured and classified. Based on the coordinates of the images and their classifications, the distance between an edge feature and the wafer edge is determined. Reference marks can be etched into the wafer to facilitate the measurement. The measurement technique is objective, and can be used to minimize the edge exclusion ring as well as defects that originate from the edge of the wafer.

摘要翻译： 确定从边缘特征到晶片边缘的距离的方法。 将晶片放置在图像采集工具上，并对图像进行捕获和分类。 基于图像的坐标及其分类，确定边缘特征与晶片边缘之间的距离。 可以将参考标记蚀刻到晶片中以便于测量。 测量技术是客观的，可用于最小化边缘排除环以及源自晶片边缘的缺陷。

公开(公告)号：US20060044571A1

公开(公告)日：2006-03-02

申请号：US10925497

申请日：2004-08-24

申请人： Bruce Whitefield ,  Jason McNichols ,  David Sturtevant

发明人： Bruce Whitefield ,  Jason McNichols ,  David Sturtevant

IPC分类号： G01N21/00 ,  G01B11/14

CPC分类号： G01N21/9503

摘要： A method of determining the distance from an edge feature to a wafer edge. The wafer is put onto an image acquisition tool, and images are captured and classified. Based on the coordinates of the images and their classifications, the distance between an edge feature and the wafer edge is determined. Reference marks can be etched into the wafer to facilitate the measurement. The measurement technique is objective, and can be used to minimize the edge exclusion ring as well as defects that originate from the edge of the wafer.

摘要翻译： 确定从边缘特征到晶片边缘的距离的方法。 将晶片放置在图像采集工具上，并对图像进行捕获和分类。 基于图像的坐标及其分类，确定边缘特征与晶片边缘之间的距离。 可以将参考标记蚀刻到晶片中以便于测量。 测量技术是客观的，可用于最小化边缘排除环以及源自晶片边缘的缺陷。

公开(公告)号：US20060073617A1

公开(公告)日：2006-04-06

申请号：US10949760

申请日：2004-09-24

申请人： Bruce Whitefield ,  Jason McNichols

发明人： Bruce Whitefield ,  Jason McNichols

IPC分类号： H01L21/00

CPC分类号： G01R31/2891 ,  G01R31/311

摘要： A method for creating a reference for a first position on a substrate edge. A first reference point is selected relative to a circumference of the substrate edge, and a second reference point is selected relative to a bevel of the substrate edge. A first distance along the circumference of the substrate edge between the first reference point and the first position is identified as a first coordinate, and a second distance along the bevel of the substrate edge between the second reference point and the first position is identified as a second coordinate. The first coordinate and the second coordinate are used as the reference for the first position.

摘要翻译： 一种用于为衬底边缘上的第一位置创建参考的方法。 相对于衬底边缘的圆周选择第一参考点，并且相对于衬底边缘的斜面选择第二参考点。 沿着第一参考点和第一位置之间的衬底边缘的圆周的第一距离被识别为第一坐标，并且沿着第二参考点和第一位置之间的衬底边缘的斜面的第二距离被识别为 第二个坐标。 第一坐标和第二坐标用作第一位置的参考。

公开(公告)号：US20050229144A1

公开(公告)日：2005-10-13

申请号：US10801310

申请日：2004-03-16

申请人： Chandra Desu ,  Nima Behkami ,  Bruce Whitefield ,  David Abercrombie ,  David Sturtevant

发明人： Chandra Desu ,  Nima Behkami ,  Bruce Whitefield ,  David Abercrombie ,  David Sturtevant

IPC分类号： G06F17/50

CPC分类号： G06F17/5068

摘要： A graphical profile map for integrated circuits on a substrate. The graphical profile map includes a depiction of die placement boundaries and shot placement boundaries for the integrated circuits on the substrate. Also included are integrated circuit property information contours, where the contours are not limited to either of the die placement boundaries or the shot placement boundaries. In this manner, three key pieces of information for the integrated circuits are presented, including integrated circuit property information, die placement, and shot placement. Because these three pieces of information are presented in a graphical form, it is much easier to interpret the information. For example, it is much easier to determine which shot and die placements have properties that are at risk, and which shot and die placements have adequate property profiles.

摘要翻译： 衬底上集成电路的图形配置图。 图形轮廓图包括对基片上的集成电路的管芯放置边界和镜头放置边界的描绘。 还包括集成电路属性信息轮廓，其中轮廓不限于管芯放置边界或射击放置边界中的任何一个。 以这种方式，提供了用于集成电路的三个关键信息，包括集成电路属性信息，管芯放置和射击放置。 因为这三条信息以图形形式呈现，所以解释信息要容易得多。 例如，确定哪些投篮和投篮位置具有处于风险中的属性以及哪些投篮和投篮位置具有足够的财产配置文件将变得更加容易。

公开(公告)号：US07074710B2

公开(公告)日：2006-07-11

申请号：US10980945

申请日：2004-11-03

申请人： Bruce Whitefield ,  David Ambercrombie

发明人： Bruce Whitefield ,  David Ambercrombie

IPC分类号： H01L21/4763

CPC分类号： H01L21/02087 ,  G03F7/2028 ,  Y10S438/926

摘要： A method includes steps of: (a) providing a wafer on which a film has been deposited; (b) exposing an annular area in an edge exclusion zone of the wafer to radiation having a wavelength suitable for patterning the film in the annular area; and (c) modulating the radiation while exposing the annular area to form a pattern in the film in the annular area.

摘要翻译： 一种方法包括以下步骤：（a）提供其上沉积有膜的晶片; （b）将晶片的边缘排除区域中的环形区域暴露于具有适于在环形区域中图案化膜的波长的辐射; 和（c）在暴露环形区域的同时调制辐射，以在环形区域中的膜中形成图案。

公开(公告)号：US20060073703A1

公开(公告)日：2006-04-06

申请号：US10950839

申请日：2004-09-27

申请人： Xiao Li ,  Roger Young ,  Bruce Whitefield

发明人： Xiao Li ,  Roger Young ,  Bruce Whitefield

IPC分类号： H01L21/302

CPC分类号： H01L21/02087 ,  H01L21/6708

摘要： A method of removing an edge bead of a coated material on a substrate. The substrate is rotated, and a fluid that solvates the coated material is delivered. The delivery of the fluid is directed radially inward on the substrate at a rate of between about three millimeters per second and about twenty millimeters per second until a desired innermost fluid delivery position on the substrate is attained. Immediately upon attaining the desired innermost fluid delivery position on the substrate, the delivery of the fluid is directed radially outward off the substrate at a rate of more than zero millimeters per second and less than about four millimeters per second. The rotation of the substrate is ceased.

摘要翻译： 一种去除衬底上涂覆材料的边缘珠的方法。 旋转衬底，并且输送溶剂化涂覆材料的流体。 流体的输送以约3毫米每秒和约20毫米/秒的速率径向向内指向基底上，直到达到基底上所需的最内流体输送位置。 在基板上达到理想的最内流体输送位置之后，流体的输送立即以大于零毫米/秒的速度从基板径向向外指向，并且小于约4毫米/秒。 衬底的旋转停止。

公开(公告)号：US20050181706A1

公开(公告)日：2005-08-18

申请号：US10779966

申请日：2004-02-17

申请人： Michael Berman ,  Steven Reder ,  Bruce Whitefield

发明人： Michael Berman ,  Steven Reder ,  Bruce Whitefield

IPC分类号： B24B37/04 ,  B24B49/10 ,  B24B49/00

CPC分类号： B24B37/005 ,  B24B49/10

摘要： A method and control system for detecting harmonic oscillation in a chemical mechanical polishing process and reacting thereto, such as by taking steps to at least one of: 1) reduce or eliminate the harmonic oscillation; and 2) counter the noise which is associated with the harmonic oscillation. By reducing or eliminating harmonic oscillation, films with reduced structure strengths including low k dielectric films can be used. By countering the noise, the quality of the work environment is improved.

摘要翻译： 一种用于检测化学机械抛光工艺中的谐波振荡并与其反应的方法和控制系统，例如通过采取以下步骤中的至少一个步骤：1）减少或消除谐波振荡; 和2）对抗与谐波振荡相关的噪声。 通过减少或消除谐波振荡，可以使用包括低k电介质膜的具有降低的结构强度的膜。 通过对付噪声，提高了工作环境的质量。

公开(公告)号：US06787379B1

公开(公告)日：2004-09-07

申请号：US10020407

申请日：2001-12-12

申请人： Robert Madge ,  Kevin Cota ,  Bruce Whitefield

发明人： Robert Madge ,  Kevin Cota ,  Bruce Whitefield

IPC分类号： H01L2166

CPC分类号： H01L22/20

摘要： A method of detecting spatially correlated variations that may be used for detecting statistical outliers in a production lot of integrated circuits to increase the average service life of the production lot includes measuring a selected parameter of each of a plurality of electronic circuits replicated on a common surface; calculating a difference between a value of the selected parameter at a target location and a value of the selected parameter an identical relative location with respect to the target location for each of the plurality of electronic circuits to generate a distribution of differences; calculating an absolute value of the distribution of differences; and calculating an average of the absolute value of the distribution of differences to generate a representative value for the residual for the identical relative location.

摘要翻译： 一种检测可用于检测集成电路的生产批次中的统计异常值以增加生产批次的平均使用寿命的空间相关变化的方法包括测量在公共表面上复制的多个电子电路中的每一个的选定参数 ; 计算目标位置处的所选参数的值与所选择的参数的值之间的差相对于所述多个电子电路中的每一个的所述目标位置的相同相对位置以产生差分布; 计算差异分布的绝对值; 并且计算差分布的绝对值的平均值，以生成相同相对位置的残差的代表值。

公开(公告)号：US07323768B2

公开(公告)日：2008-01-29

申请号：US11131705

申请日：2005-05-18

申请人： Bruce Whitefield

发明人： Bruce Whitefield

IPC分类号： H01L23/06

CPC分类号： H01L22/34 ,  G01R31/2853 ,  G01R31/2884 ,  G01R31/303

摘要： A semiconductor chip is provided which includes active and inactive IP cores. The spaces on the metal layer associated with the inactive IP cores includes voltage contrast inspection structures. The voltage contrast inspection structures serve to provide improved planarization of the metal layer and provided improved inspection capabilities.

摘要翻译： 提供了一种半导体芯片，其包括有源和非活动IP核。 与非活动IP核相关联的金属层上的空间包括电压对比度检查结构。 电压对比检查结构用于提供金属层的改进的平面化并提供改进的检查能力。

公开(公告)号：US20060076036A1

公开(公告)日：2006-04-13

申请号：US10963255

申请日：2004-10-12

申请人： Bruce Whitefield ,  Gregory Piatt ,  Michael Gatov

发明人： Bruce Whitefield ,  Gregory Piatt ,  Michael Gatov

IPC分类号： B08B7/04 ,  B08B3/04

CPC分类号： B08B3/04

摘要： An apparatus for cleaning a substrate. A cleaning chamber contacts the substrate with a cleaning solution. The cleaning solution thereby removes contaminants from the substrate and additionally leaches material from the substrate. A gettering chamber receives the cleaning solution, and includes a surface for chemically attracting the leached material and precipitating the leached material at least in part out of the cleaning solution. By removing the leached copper from the cleaning solution In this manner, the various embodiments of the present invention reduce the amount of copper that is available for plating out of the solvent, and therefore reduces the number and size of nodules that can form on the substrate. Thus, the need for other expensive approaches, like chemical replacement or less effective cleaning solvents, is obviated. The aluminum that is preferably used in the plating cell not only has an affinity to collect copper, but it is also known to be compatible with the solvent and substrates, since it is already present in abundance on the substrates themselves.

摘要翻译： 一种用于清洁基底的装置。 清洁室与清洁溶液接触基板。 因此，清洁溶液从基底上除去污染物，另外从基材中沥出材料。 吸气室接收清洁溶液，并且包括用于化学吸引浸出的材料并使至少部分地从清洗溶液中浸出的材料沉淀的表面。 通过从清洗溶液中除去浸出的铜以这种方式，本发明的各种实施方案减少了可用于电镀出溶剂的铜的量，因此减少了可在基材上形成的结核的数量和尺寸 。 因此，消除了对其他昂贵方法的需要，例如化学更换或较不有效的清洁溶剂。 优选在电镀单元中使用的铝不仅具有收集铜的亲和性，而且已知与溶剂和基材相容，因为它已经在基材本身上已经大量存在。