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    Integrated-circuit lead-frame package with low-resistance ground-lead and heat-sink means
    1.
    发明授权
    Integrated-circuit lead-frame package with low-resistance ground-lead and heat-sink means 失效
    具有低电阻接地引线和散热装置的集成电路引线框封装

    公开(公告)号：US4916506A

    公开(公告)日：1990-04-10

    申请号：US284003

    申请日：1988-11-18

    申请人： Jay J. Gagnon

    发明人： Jay J. Gagnon

    IPC分类号： H01L23/495

    CPC分类号： H01L23/49541 ,  H01L23/49568 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/12036 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181

    摘要： The lead-frame in an integrated circuit package, a dual-inline-package (DIP), has a plurality of leads of which four are extensions of a down-set die-attach pad. A dog-leg finger lines in the plane of the leads and is an extension of a peripheral portion of the die-attach pad. The dog-leg finger has first and second parts that are at right angles to each other so as to lock a distal port of it in the body of encapsulating resin. An integrated circuit die having at least one power transistor is grounded electrically via a terminal and wire bonded to the distal part of the dog-leg finger. This ground circuit parallels and is redundant to a ground circuit through the die via the conductive resin that attaches the bottom of the die to the die-attach pad, the later circuit having a relatively high electrical resistance. The four leads that are extensions of the die-attach pad serve both to remove heat from the die and to provide an electrical ground connection. The extending finger of dog-leg shape provides a point of ground-wire attachment that does not move relative to the encapsulating resin as do other peripheral parts of the die attach pad during temperature cycling.

    摘要翻译： 集成电路封装（双列直插封装（DIP））中的引线框具有多个引线，其中4个是下降管芯附着焊盘的扩展。 引脚的平面中的爪形指状线是芯片附接垫的周边部分的延伸部。 狗腿指状物具有彼此成直角的第一和第二部分，以便将其远端端口锁定在密封树脂的主体中。 具有至少一个功率晶体管的集成电路管芯通过端子和电线接合，并且接合到狗爪指的远端部分。 该接地电路通过导电树脂使模具的接地电路平行并且冗余，所述导电树脂将管芯的底部附接到管芯附接焊盘，后一电路具有较高的电阻。 作为芯片附接焊盘的扩展的四个引线用于从模具移除热量并提供电接地连接。 狗腿形状的延伸手指提供了在温度循环期间与芯片附接垫的其它外围部分一样的相对于封装树脂不移动的接地线附接点。

    Integrated-circuit lead-frame package with failure-resistant ground-lead and heat-sink means
    3.
    发明授权
    Integrated-circuit lead-frame package with failure-resistant ground-lead and heat-sink means 失效
    集成电路引线框架封装，具有抗故障的接地引线和散热装置

    公开(公告)号：US5289344A

    公开(公告)日：1994-02-22

    申请号：US958496

    申请日：1992-10-08

    申请人： Jay J. Gagnon ,  Paul J. Panaccione

    发明人： Jay J. Gagnon ,  Paul J. Panaccione

    IPC分类号： H01L23/495 ,  H05K7/20

    CPC分类号： H01L24/48 ,  H01L23/49562 ,  H01L23/49568 ,  H01L24/06 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49112 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181

    摘要： The lead-frame in an integrated circuit package, a standard package designated SOT-89, has a plurality of leads of which at least one is an extension of a die-attach pad. At least one ground wing is formed as an extension of a peripheral portion of the die-attach pad and extends upward to approximately the plane of the top of the die. The ground wing has an upstanding portion and a horizontal portion that are at an angle to each other so as to lock the distal end of the wing in the body of encapsulating resin. An integrated circuit die having at least one electrical connection which is grounded electrically via a terminal and wire bonded to the distal part of the ground wing. A contact surface near the distal end of wing is positioned approximately in the plane of the top of the die. This ground circuit can parallel and can be redundant to a ground circuit through the die via the conductive bond that attaches the bottom of the die to the die-attach pad. The ground lead that is an extension of the die-attach pad serves both to remove heat from the die and to provide an electrical ground connection. The contact surface of the wing provides a point of ground-wire attachment that does not move relative to the encapsulating resin as do other peripheral parts of the die attach pad during temperature cycling and mechanical stress. Thus, a common failure mode, which is called heal-cracking, is substantially eliminated.

    摘要翻译： 集成电路封装中的引线框，标为SOT-89的封装，具有多个引线，其中至少一个是管芯安装焊盘的延伸部。 至少一个地面翼片形成为模具附接垫的周边部分的延伸部，并且向上延伸到模具的顶部的大致平面。 地面翼具有彼此成一定角度的直立部分和水平部分，以便将翼片的远端锁定在密封树脂的主体中。 一种具有至少一个电连接的集成电路管芯，该电连接件通过端子和电线接合并接合到接地翼的远端部分。 翼的远端​​附近的接触表面大致位于模具顶部的平面内。 该接地电路可以并联并且可以通过将管芯底部附接到管芯附接焊盘的导电接合通过管芯对接地电路进行冗余。 作为芯片附着焊盘延伸的接地引线用于从模具移除热量并提供电接地连接。 机翼的接触表面提供了在温度循环和机械应力期间，与芯片附接垫的其它外围部分一样，相对于密封树脂不会移动的接地线附接点。 因此，基本上消除了称为愈合裂纹的常见故障模式。