公开(公告)号：US07808778B2

公开(公告)日：2010-10-05

申请号：US11709885

申请日：2007-02-23

申请人： Jeffrey Hsu

发明人： Jeffrey Hsu

IPC分类号： H05K7/14

CPC分类号： G06F1/187

摘要： A redundant array of independent disks (RAID) module converted from a 2.5-inch specification to a 3.5-inch specification is characterized in that two 2.5-inch SATA hard disks are installed within a standard 3.5-inch SATA RAID module, so as to form a RAID having two hard disks or two stand-alone SATA hard disks for mounting the RAID module including two 2.5-inch hard disks within a 3.5-inch disk drive slot of a common computer housing, or any other devices that can receive a 3.5-inch disk drive.

摘要翻译： 从2.5英寸规格转换为3.5英寸规格的独立磁盘（RAID）模块的冗余阵列的特点是两个2.5英寸SATA硬盘安装在标准的3.5英寸SATA RAID模块中，以形成 具有两个硬盘或两个独立SATA硬盘的RAID，用于将RAID模块安装在通用计算机外壳的3.5英寸磁盘驱动器插槽内，包括两个2.5英寸硬盘，或者可以接收3.5- 英寸磁盘驱动器。

公开(公告)号：US07378731B2

公开(公告)日：2008-05-27

申请号：US11705130

申请日：2007-02-12

申请人： Chender Huang ,  Pei-Haw Tsao ,  Allan Lin ,  Jeffrey Hsu

发明人： Chender Huang ,  Pei-Haw Tsao ,  Allan Lin ,  Jeffrey Hsu

IPC分类号： H01L23/10

CPC分类号： H01L23/36 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2224/0401 ,  H01L2924/00012

摘要： A heat spreader and package structure utilizing the same. The heat spreader is embedded in an encapsulant of a package and above a chip therein, wherein the package has a substrate, having a molding gate, and the chip has a center and a corner which is the farthest from the molding gate. The spreader includes a base with a hollow portion therethrough, a plurality of support leads, protruding from the base, on the inner edge, and a cap plate, having a hole at least directly above a region between the center and the corner of the chip, fixed by the support leads to be above the hollow portion, the cap plate.

摘要翻译： 散热器和利用其的包装结构。 散热器嵌入在封装的密封剂中并且在其中的芯片之上，其中封装具有具有模制浇口的基板，并且芯片具有与模制浇口最远的中心和拐角。 吊具包括具有穿过其的中空部分的基部，在内边缘上从基部突出的多个支撑引线和盖板，其具有至少直接在芯片的中心和拐角之间的区域上方的孔 通过支撑件固定在中空部分上方的盖板上。

公开(公告)号：US07190066B2

公开(公告)日：2007-03-13

申请号：US11073676

申请日：2005-03-08

申请人： Chender Huang ,  Pei-Haw Tsao ,  Allan Lin ,  Jeffrey Hsu

发明人： Chender Huang ,  Pei-Haw Tsao ,  Allan Lin ,  Jeffrey Hsu

IPC分类号： H01L23/12

CPC分类号： H01L23/36 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2224/0401 ,  H01L2924/00012

摘要： A heat spreader and package structure utilizing the same. The heat spreader is embedded in an encapsulant of a package and above a chip therein, wherein the package has a substrate, having a molding gate, and the chip has a center and a corner which is the farthest from the molding gate. The spreader includes a base with a hollow portion therethrough, a plurality of support leads, protruding from the base, on the inner edge, and a cap plate, having a hole at least directly above a region between the center and the corner of the chip, fixed by the support leads to be above the hollow portion, the cap plate.

公开(公告)号：US20080172527A1

公开(公告)日：2008-07-17

申请号：US11709885

申请日：2007-02-23

申请人： Jeffrey Hsu

发明人： Jeffrey Hsu

IPC分类号： G06F12/00

CPC分类号： G06F1/187

摘要： A redundant array of independent disks (RAID) module converted from a 2.5-inch specification to a 3.5-inch specification is characterized in that two 2.5-inch SATA hard disks are installed within a standard 3.5-inch SATA RAID module, so as to form a RAID having two hard disks or two stand-alone SATA hard disks for mounting the RAID module including two 2.5-inch hard disks within a 3.5-inch disk drive slot of a common computer housing, or any other devices that can receive a 3.5-inch disk drive.

摘要翻译： 从2.5英寸规格转换为3.5英寸规格的独立磁盘（RAID）模块的冗余阵列的特点是两个2.5英寸SATA硬盘安装在标准的3.5英寸SATA RAID模块中，以形成 具有两个硬盘或两个独立SATA硬盘的RAID，用于将RAID模块安装在通用计算机外壳的3.5英寸磁盘驱动器插槽内，包括两个2.5英寸硬盘，或者可以接收3.5- 英寸磁盘驱动器。

公开(公告)号：US20060202326A1

公开(公告)日：2006-09-14

申请号：US11073676

申请日：2005-03-08

申请人： Chender Huang ,  Pei-Haw Tsao ,  Allan Lin ,  Jeffrey Hsu

发明人： Chender Huang ,  Pei-Haw Tsao ,  Allan Lin ,  Jeffrey Hsu

IPC分类号： H01L23/10

CPC分类号： H01L23/36 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2224/0401 ,  H01L2924/00012

摘要： A heat spreader and package structure utilizing the same. The heat spreader is embedded in an encapsulant of a package and above a chip therein, wherein the package has a substrate, having a molding gate, and the chip has a center and a corner which is the farthest from the molding gate. The spreader includes a base with a hollow portion therethrough, a plurality of support leads, protruding from the base, on the inner edge, and a cap plate, having a hole at least directly above a region between the center and the corner of the chip, fixed by the support leads to be above the hollow portion, the cap plate.

摘要翻译： 散热器和利用其的包装结构。 散热器嵌入在封装的密封剂中并且在其中的芯片之上，其中封装具有具有模制浇口的基板，并且芯片具有与模制浇口最远的中心和拐角。 吊具包括具有穿过其的中空部分的基部，在内边缘上从基部突出的多个支撑引线和盖板，其具有至少直接在芯片的中心和拐角之间的区域上方的孔 通过支撑件固定在中空部分上方的盖板上。

公开(公告)号：US20220270244A1

公开(公告)日：2022-08-25

申请号：US17628144

申请日：2020-07-17

申请人： Jeffrey Hsu-Min Chuang ,  Javad Noorbakhsh ,  Ali Foroughi pour ,  Kourosh Zarringhalam ,  Saman Farahmand ,  Mohammad Soltanieh-ha ,  The Jackson Laboratory

发明人： Jeffrey Hsu-Min Chuang ,  Javad Noorbakhsh ,  Ali Foroughi pour ,  Kourosh Zarringhalam ,  Saman Farahmand ,  Mohammad Soltanieh-ha

IPC分类号： G06T7/00 ,  G01N33/483 ,  G06T7/194 ,  G06N3/063 ,  G06N3/08

摘要： Techniques for classifying, using a deep learning model, histopathological whole slide images (WSIs) as comprising images of cancerous or non-cancerous tissue and/or as comprising images of cancerous tissue having a genetic mutation or not having a genetic mutation are described herein. The techniques include at least one processor configured to instantiate a container-based processing architecture to train and/or use the deep learning model to process and classify at least one WSI. In some embodiments, a treatment may be selected and administered based on a classification result obtained from the deep learning model.

公开(公告)号：US20070138627A1

公开(公告)日：2007-06-21

申请号：US11705130

申请日：2007-02-12

申请人： Chender Huang ,  Pei-Haw Tsao ,  Allan Lin ,  Jeffrey Hsu

发明人： Chender Huang ,  Pei-Haw Tsao ,  Allan Lin ,  Jeffrey Hsu

IPC分类号： H01L23/34

CPC分类号： H01L23/36 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2224/0401 ,  H01L2924/00012

摘要： A heat spreader and package structure utilizing the same. The heat spreader is embedded in an encapsulant of a package and above a chip therein, wherein the package has a substrate, having a molding gate, and the chip has a center and a corner which is the farthest from the molding gate. The spreader includes a base with a hollow portion therethrough, a plurality of support leads, protruding from the base, on the inner edge, and a cap plate, having a hole at least directly above a region between the center and the corner of the chip, fixed by the support leads to be above the hollow portion, the cap plate.

摘要翻译： 散热器和利用其的包装结构。 散热器嵌入在封装的密封剂中并且在其中的芯片之上，其中封装具有具有模制浇口的基板，并且芯片具有与模制浇口最远的中心和拐角。 吊具包括具有穿过其的中空部分的基部，在内边缘上从基部突出的多个支撑引线和盖板，其具有至少直接在芯片的中心和拐角之间的区域上方的孔 通过支撑件固定在中空部分上方的盖板上。