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公开(公告)号：US20090015486A1
公开(公告)日：2009-01-15
申请号：US12170999
申请日：2008-07-10
申请人： Chang Mok Han , Ki Won Chang , Duk Woo Lee , Dae Kyu Lee , Jeong Sik Seo , Hyun Do Park
发明人： Chang Mok Han , Ki Won Chang , Duk Woo Lee , Dae Kyu Lee , Jeong Sik Seo , Hyun Do Park
IPC分类号： H01Q9/04
CPC分类号： H01Q1/38 , H01Q9/0407
摘要： There are provided a chip antenna and a mobile telecommunication terminal having the chip antenna. The chip antenna includes: a dielectric block having opposing top and bottom surfaces and a plurality of side surfaces connecting the top and bottom surfaces; a first conductive pattern formed on at least one of the surfaces of the dielectric block and connected to an external feeding part; a second conductive pattern formed on at least one of the surfaces of the dielectric block to connect to the first conductive pattern, and having one end connected to an external ground part; and a third conductive pattern formed on at least one of the surfaces of the dielectric block, and spaced apart from the first and second conductive patterns to be capacitively coupled to the first and second conductive patterns, respectively, the third conductive pattern having a lower end connected to the external ground part.
摘要翻译： 提供了具有芯片天线的芯片天线和移动电信终端。 芯片天线包括：具有相对的顶表面和底表面的介质块和连接顶表面和底表面的多个侧表面; 形成在介质块的至少一个表面上并连接到外部馈电部分的第一导电图案; 形成在所述介电块的至少一个表面上以连接到所述第一导电图案并且具有连接到外部接地部分的一端的第二导电图案; 以及形成在所述介质块的至少一个表面上并且与所述第一和第二导电图案间隔开以分别电容耦合到所述第一和第二导电图案的第三导电图案，所述第三导电图案具有下端 连接到外部接地部分。
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公开(公告)号：US08159400B2
公开(公告)日：2012-04-17
申请号：US12170999
申请日：2008-07-10
申请人： Chang Mok Han , Ki Won Chang , Duk Woo Lee , Dae Kyu Lee , Jeong Sik Seo , Hyun Do Park
发明人： Chang Mok Han , Ki Won Chang , Duk Woo Lee , Dae Kyu Lee , Jeong Sik Seo , Hyun Do Park
CPC分类号： H01Q1/38 , H01Q9/0407
摘要： There are provided a chip antenna and a mobile telecommunication terminal having the chip antenna. The chip antenna includes: a dielectric block having opposing top and bottom surfaces and a plurality of side surfaces connecting the top and bottom surfaces; a first conductive pattern formed on at least one of the surfaces of the dielectric block and connected to an external feeding part; a second conductive pattern formed on at least one of the surfaces of the dielectric block to connect to the first conductive pattern, and having one end connected to an external ground part; and a third conductive pattern formed on at least one of the surfaces of the dielectric block, and spaced apart from the first and second conductive patterns to be capacitively coupled to the first and second conductive patterns, respectively, the third conductive pattern having a lower end connected to the external ground part.
摘要翻译： 提供了具有芯片天线的芯片天线和移动电信终端。 芯片天线包括：具有相对的顶表面和底表面的介质块和连接顶表面和底表面的多个侧表面; 形成在介质块的至少一个表面上并连接到外部馈电部分的第一导电图案; 形成在所述介电块的至少一个表面上以连接到所述第一导电图案并且具有连接到外部接地部分的一端的第二导电图案; 以及形成在所述介质块的至少一个表面上并且与所述第一和第二导电图案间隔开以分别电容耦合到所述第一和第二导电图案的第三导电图案，所述第三导电图案具有下端 连接到外部接地部分。
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3.发明授权Antenna pattern frame, electronic device case provided with antenna pattern frame and electronic device including electronic device case 有权天线图案框架，设置有天线图案框架的电子设备壳体和包括电子设备壳体的电子设备公开(公告)号：US08933844B2
公开(公告)日：2015-01-13
申请号：US13032365
申请日：2011-02-22
申请人： Ha Ryong Hong , Sung Eun Cho , Tae Sung Kim , Duk Woo Lee , Dae Kyu Lee , Chan Gwang An , Jae Suk Sung , Ki Won Chang , Chang Mok Han , Hyun Do Park
发明人： Ha Ryong Hong , Sung Eun Cho , Tae Sung Kim , Duk Woo Lee , Dae Kyu Lee , Chan Gwang An , Jae Suk Sung , Ki Won Chang , Chang Mok Han , Hyun Do Park
CPC分类号： H01Q1/243 , B29C45/14065 , B29C45/14639 , B29L2031/3431 , B29L2031/3456 , H01Q1/40
摘要： There is provided an antenna pattern frame according to an exemplary embodiment of the present invention, including: a film radiator that includes a protective film supporting one surface or both surfaces of a radiator provided with an antenna pattern part; and a radiator frame that is an injection molded part to which the film radiator is fixed and embeds the antenna pattern part in the electronic device case.
摘要翻译： 提供了根据本发明的示例性实施例的天线图案框架，包括：薄膜辐射器，其包括支撑设置有天线图案部分的散热器的一个表面或两个表面的保护膜; 以及散热器框架，其是胶片辐射器固定到其上的注塑部件，并将天线图案部分嵌入电子设备壳体中。
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4.发明授权Antenna pattern frame and mold for manufacturing electronic device case including the same 有权天线图案框架和用于制造包括其的电子设备壳体的模具公开(公告)号：US09035847B2
公开(公告)日：2015-05-19
申请号：US13027345
申请日：2011-02-15
申请人： Ha Ryong Hong , Sung Eun Cho , Dae Kyu Lee , Chan Gwang An , Jae Suk Sung , Ki Won Chang , Dae Ki Lim , Chang Mok Han , Hyun Do Park
发明人： Ha Ryong Hong , Sung Eun Cho , Dae Kyu Lee , Chan Gwang An , Jae Suk Sung , Ki Won Chang , Dae Ki Lim , Chang Mok Han , Hyun Do Park
CPC分类号： B29C45/1671 , B29C45/006 , B29C45/14065 , B29C45/14639 , B29C2045/14147 , B29L2031/3431 , B29L2031/3437 , B29L2031/3456 , B29L2031/3481 , H01Q1/243 , H01Q1/40 , H01Q9/0421
摘要： There is provided an antenna pattern frame including: a radiator comprising an antenna pattern portion transmitting and receiving a signal and a connection terminal portion allowing the signal to be transmitted to and received from a circuit board of an electronic device; and a radiator frame manufactured by injection molding on the radiator, allowing the antenna pattern portion to be embedded in a case of the electronic device, and supporting the radiator. The radiator frame includes a hydraulic recess introducing a resin material to a mold for manufacturing a case of the electronic device in which the radiator is embedded through injection molding, so that the radiator frame contacts the mold by injection pressure.
摘要翻译： 提供了一种天线图案框架，包括：散热器，包括发送和接收信号的天线图案部分和允许信号被发送到电子设备的电路板并从电子设备的电路板接收的连接端子部分; 以及通过在散热器上注射成型制造的散热器框架，将天线图案部分嵌入电子设备的壳体中，并且支撑散热器。 散热器框架包括将树脂材料引入到用于制造通过注射成型嵌入散热器的电子设备的壳体的模具的液压凹部，使得散热器框架通过注射压力与模具接触。
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公开(公告)号：US08111194B2
公开(公告)日：2012-02-07
申请号：US11944573
申请日：2007-11-23
申请人： Ki Won Chang , Jeong Sik Seo , Hyun Do Park , Jae Suk Sung
发明人： Ki Won Chang , Jeong Sik Seo , Hyun Do Park , Jae Suk Sung
CPC分类号： H01Q1/2283 , H01Q1/243 , H01Q9/42 , H05K1/0243 , H05K2201/10636 , Y02P70/611
摘要： There is provided a mobile telecommunication terminal comprising: a chip antenna, and a printed circuit board having the chip antenna mounted on one surface thereof, the printed circuit board comprising a tuning ground pattern formed on a surface opposing the one surface of the printed circuit board to have one end connected to a ground part so as to be used for tuning frequency characteristics of the chip antenna.
摘要翻译： 提供了一种移动通信终端，包括：芯片天线和其一个表面上安装有芯片天线的印刷电路板，印刷电路板包括形成在与印刷电路板的一个表面相对的表面上的调谐接地图案 将一端连接到接地部分，以便用于调谐芯片天线的频率特性。
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公开(公告)号：US08054227B2
公开(公告)日：2011-11-08
申请号：US11944575
申请日：2007-11-23
申请人： Ki Won Chang , Jeong Sik Seo , Hyun Do Park , Jae Suk Sung
发明人： Ki Won Chang , Jeong Sik Seo , Hyun Do Park , Jae Suk Sung
IPC分类号： H01Q1/38
CPC分类号： H01Q1/2283 , H01Q1/243 , H01Q9/42 , H05K1/0243 , H05K2201/10636 , Y02P70/611
摘要： There is provided a chip antenna including: a dielectric block; a first conductive pattern formed on at least one surface of the dielectric block to connect to an external feeding part; a second conductive pattern spaced apart from the first conductive pattern at a certain distance so as to be capacitively coupled to the first conductive pattern to act as a radiator, the second conductive pattern having one end connected to an external ground part; and a third conductive pattern spaced apart from the first conductive pattern at a certain distance so as to be capacitively coupled to the first conductive pattern to enable impedance matching of the antenna, the third conductive pattern having one end connected to the external ground part.
摘要翻译： 提供了一种芯片天线，包括：介质块; 形成在介质块的至少一个表面上以连接到外部馈电部分的第一导电图案; 第二导电图案，其间隔一定距离与第一导电图案间隔开，以便电容耦合到第一导电图案以用作散热器，第二导电图案的一端连接到外部接地部分; 以及第三导电图案，其以一定距离与第一导电图案间隔开，以便电容耦合到第一导电图案，以使得天线的阻抗匹配，第三导电图案的一端连接到外部接地部分。
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公开(公告)号：US20080129604A1
公开(公告)日：2008-06-05
申请号：US11944573
申请日：2007-11-23
申请人： Ki Won CHANG , Jeong Sik Seo , Hyun Do Park , Jae Suk Sung
发明人： Ki Won CHANG , Jeong Sik Seo , Hyun Do Park , Jae Suk Sung
CPC分类号： H01Q1/2283 , H01Q1/243 , H01Q9/42 , H05K1/0243 , H05K2201/10636 , Y02P70/611
摘要： There is provided a mobile telecommunication terminal comprising: a chip antenna, and a printed circuit board having the chip antenna mounted on one surface thereof, the printed circuit board comprising a tuning ground pattern formed on a surface opposing the one surface of the printed circuit board to have one end connected to a ground part so as to be used for tuning frequency characteristics of the chip antenna.
摘要翻译： 提供了一种移动通信终端，包括：芯片天线和其一个表面上安装有芯片天线的印刷电路板，印刷电路板包括形成在与印刷电路板的一个表面相对的表面上的调谐接地图案 将一端连接到接地部分，以便用于调谐芯片天线的频率特性。
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公开(公告)号：US20080122713A1
公开(公告)日：2008-05-29
申请号：US11944571
申请日：2007-11-23
申请人： Ki Won CHANG , Jeong Sik Seo , Hyun Do Park , Jae Suk Sung
发明人： Ki Won CHANG , Jeong Sik Seo , Hyun Do Park , Jae Suk Sung
IPC分类号： H01Q9/00
CPC分类号： H01Q1/2283 , H01Q1/243 , H01Q9/42 , H05K1/0243 , H05K2201/10636 , Y02P70/611
摘要： There is provided a printed circuit board comprising: a mounting area of a chip antenna provided on one surface thereof, and a tuning ground pattern formed on a surface opposing the one surface of the printed circuit board to have one end connected to a ground part so as to be used for tuning frequency characteristics of the chip antenna.
摘要翻译： 提供了一种印刷电路板，包括：设置在其一个表面上的芯片天线的安装区域和形成在与印刷电路板的一个表面相对的表面上的调谐接地图案，以使其一端连接到接地部分 用于调谐芯片天线的频率特性。
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公开(公告)号：US07791541B2
公开(公告)日：2010-09-07
申请号：US11944571
申请日：2007-11-23
申请人： Ki Won Chang , Jeong Sik Seo , Hyun Do Park , Jae Suk Sung
发明人： Ki Won Chang , Jeong Sik Seo , Hyun Do Park , Jae Suk Sung
IPC分类号： H01Q1/38
CPC分类号： H01Q1/2283 , H01Q1/243 , H01Q9/42 , H05K1/0243 , H05K2201/10636 , Y02P70/611
摘要： There is provided a printed circuit board comprising: a mounting area of a chip antenna provided on one surface thereof, and a tuning ground pattern formed on a surface opposing the one surface of the printed circuit board to have one end connected to a ground part so as to be used for tuning frequency characteristics of the chip antenna.
摘要翻译： 提供了一种印刷电路板，包括：设置在其一个表面上的芯片天线的安装区域和形成在与印刷电路板的一个表面相对的表面上的调谐接地图案，以使其一端连接到接地部分 用于调谐芯片天线的频率特性。
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公开(公告)号：US20080122722A1
公开(公告)日：2008-05-29
申请号：US11944575
申请日：2007-11-23
申请人： Ki Won CHANG , Jeong Sik Seo , Hyun Do Park , Jae Suk Sung
发明人： Ki Won CHANG , Jeong Sik Seo , Hyun Do Park , Jae Suk Sung
CPC分类号： H01Q1/2283 , H01Q1/243 , H01Q9/42 , H05K1/0243 , H05K2201/10636 , Y02P70/611
摘要： There is provided a chip antenna including: a dielectric block; a first conductive pattern formed on at least one surface of the dielectric block to connect to an external feeding part; a second conductive pattern spaced apart from the first conductive pattern at a certain distance so as to be capacitively coupled to the first conductive pattern to act as a radiator, the second conductive pattern having one end connected to an external ground part; and a third conductive pattern spaced apart from the first conductive pattern at a certain distance so as to be capacitively coupled to the first conductive pattern to enable impedance matching of the antenna, the third conductive pattern having one end connected to the external ground part.
摘要翻译： 提供了一种芯片天线，包括：介质块; 形成在介质块的至少一个表面上以连接到外部馈电部分的第一导电图案; 第二导电图案，其间隔一定距离与第一导电图案间隔开，以便电容耦合到第一导电图案以用作散热器，第二导电图案的一端连接到外部接地部分; 以及第三导电图案，其以一定距离与第一导电图案间隔开，以便电容耦合到第一导电图案，以使得天线的阻抗匹配，第三导电图案的一端连接到外部接地部分。
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