公开(公告)号：US20100044861A1

公开(公告)日：2010-02-25

申请号：US12194809

申请日：2008-08-20

申请人： Chin-Tien Chiu ,  Hem Takiar ,  Jia Qing Xi

发明人： Chin-Tien Chiu ,  Hem Takiar ,  Jia Qing Xi

IPC分类号： H01L23/49

CPC分类号： H01L25/0657 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06586 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/92247

摘要： A semiconductor device is disclosed including a support structure for supporting an edge of a semiconductor die that is not supported on the substrate or semiconductor die below. In embodiments, the semiconductor device may in general include a substrate having a plurality of contact pads, a first semiconductor die mounted on the substrate, and a second semiconductor die mounted on the first semiconductor die in an offset configuration so that an edge of the second semiconductor die overhangs the first semiconductor die. A support structure may be affixed to one or more of the contact pads beneath the overhanging edge to support the overhanging edge during a wire bonding process which exerts a downward force on the overhanging edge.

摘要翻译： 公开了一种半导体器件，其包括用于支撑半导体管芯的边缘的支撑结构，所述半导体管芯的边缘不在下面的基板或半导体管芯上。 在实施例中，半导体器件通常可以包括具有多个接触焊盘的衬底，安装在衬底上的第一半导体管芯和以偏移构造安装在第一半导体管芯上的第二半导体管芯，使得第二 半导体模具突出第一半导体管芯。 支撑结构可以固定到突出边缘下方的一个或多个接触垫，以在引线接合过程期间支撑悬垂边缘，其在突出边缘上施加向下的力。