公开(公告)号：US06896304B2

公开(公告)日：2005-05-24

申请号：US10234068

申请日：2002-09-03

申请人： Hsiao-Yi Li ,  Chin-Hsin Peng ,  Cheng-Shun Chan ,  Jiann-Sheng Chang ,  Chung-Hao Tseng ,  Chien-Ling Huang

发明人： Hsiao-Yi Li ,  Chin-Hsin Peng ,  Cheng-Shun Chan ,  Jiann-Sheng Chang ,  Chung-Hao Tseng ,  Chien-Ling Huang

IPC分类号： H01L21/00 ,  H01L21/687 ,  B25J15/06

CPC分类号： H01L21/67288 ,  H01L21/67259 ,  H01L21/68707 ,  Y10S294/907 ,  Y10S414/141

摘要： An automatic sensing wafer blade for picking up wafers that is equipped with a sensor capable of self-diagnosing potential failure conditions of the blade and a method for using the wafer blade are described. The automatic sensing wafer blade is equipped with a V-shaped seal ring on a top surface, and a sensor of either a limit switch or a capacitance sensor for sensing the presence or absence of a wafer on top of the wafer blade. The automatic sensing wafer blade is further capable of self-diagnosing any potential failure conditions of the function of the wafer blade due to contaminating particles, or contaminating liquid on the wafer surface, or due to an aged or malfunctioning seal ring on top of the wafer blade.

摘要翻译： 描述了用于拾取晶片的自动感测晶片刀片，其配备有能够自我诊断刀片的潜在故障状况的传感器以及使用晶片刀片的方法。 自动感测晶片叶片在顶表面上配备有V形密封环，以及限制开关或电容传感器的传感器，用于感测在晶片叶片顶部存在或不存在晶片。 自动感测晶片刀片还能够自动诊断由于污染颗粒或晶片表面上的污染液体的晶片叶片的功能的任何潜在故障状况，或者由于晶片顶部的老化或故障密封环 刀。

公开(公告)号：US08691706B2

公开(公告)日：2014-04-08

申请号：US13349323

申请日：2012-01-12

申请人： Chen-Hua Yu ,  Wen-Chih Chiou ,  Fang Wen Tsai ,  Kuang-Wei Cheng ,  Jiann Sheng Chang ,  Yi Chou Lai ,  Jiung Wu

发明人： Chen-Hua Yu ,  Wen-Chih Chiou ,  Fang Wen Tsai ,  Kuang-Wei Cheng ,  Jiann Sheng Chang ,  Yi Chou Lai ,  Jiung Wu

IPC分类号： H01L21/02

CPC分类号： C23C16/0209 ,  H01L21/67115 ,  H01L21/67201 ,  H01L21/67288

摘要： System and method for reducing substrate warpage in a thermal process. An embodiment comprises pre-heating a substrate in a loadlock chamber before performing the thermal process of the substrate. After the thermal process, the substrate is cooled down in a loadlock chamber. The pre-heat and cool-down process reduces the warpage of the substrate caused by the differences in coefficients of thermal expansion (CTEs) of the materials that make up the substrate.

摘要翻译： 用于减少热过程中的基板翘曲的系统和方法。 一个实施例包括在执行衬底的热处理之前预先加载负载锁定室中的衬底。 在热处理之后，基板在负载锁定室中被冷却。 预热和冷却过程减少了由构成基材的材料的热膨胀系数（CTE）所引起的基板翘曲。

公开(公告)号：US20130183831A1

公开(公告)日：2013-07-18

申请号：US13349323

申请日：2012-01-12

申请人： Chen-Hua Yu ,  Wen-Chih Chiou ,  Fang Wen Tsai ,  Kuang-Wei Cheng ,  Jiann Sheng Chang ,  Yi Chou Lai ,  Jiung Wu

发明人： Chen-Hua Yu ,  Wen-Chih Chiou ,  Fang Wen Tsai ,  Kuang-Wei Cheng ,  Jiann Sheng Chang ,  Yi Chou Lai ,  Jiung Wu

IPC分类号： H01L21/02 ,  C23C16/50 ,  C23C16/44

CPC分类号： C23C16/0209 ,  H01L21/67115 ,  H01L21/67201 ,  H01L21/67288

摘要： System and method for reducing substrate warpage in a thermal process. An embodiment comprises pre-heating a substrate in a loadlock chamber before performing the thermal process of the substrate. After the thermal process, the substrate is cooled down in a loadlock chamber. The pre-heat and cool-down process reduces the warpage of the substrate caused by the differences in coefficients of thermal expansion (CTEs) of the materials that make up the substrate.

摘要翻译： 用于减少热过程中的基板翘曲的系统和方法。 一个实施例包括在执行衬底的热处理之前预先加载负载锁定室中的衬底。 在热处理之后，基板在负载锁定室中被冷却。 预热和冷却过程减少了由构成基材的材料的热膨胀系数（CTE）所引起的基板翘曲。