公开(公告)号：US6163145A

公开(公告)日：2000-12-19

申请号：US917922

申请日：1997-08-27

申请人： Hiromichi Yamada ,  Kunio Kobayashi ,  Sekio Ito ,  Eiri Yuhara ,  Shinji Semba ,  Jiro Takamura ,  Shinji Sogabe ,  Hiroyuki Shinmen ,  Mitsuru Yamazaki

发明人： Hiromichi Yamada ,  Kunio Kobayashi ,  Sekio Ito ,  Eiri Yuhara ,  Shinji Semba ,  Jiro Takamura ,  Shinji Sogabe ,  Hiroyuki Shinmen ,  Mitsuru Yamazaki

IPC分类号： G01R31/26 ,  G01R1/067 ,  G01R1/04 ,  B65G59/02 ,  G01R31/02

CPC分类号： G01R1/06705

摘要： A transporting apparatus used in testing a plurality of semiconductor devices includes a magazine in which a plurality of pallets are stacked in plural stages, each pallet with a plurality of semiconductor device placed thereon; a distributing stocker mechanism for placing the plurality of pallets in the magazine onto a carrier; a carrier transporting mechanism for transporting the carrier into a test station in a constant temperature room and transporting the carrier after to outside the constant temperature room; and a recovery stocker mechanism for recovering the plurality of pallets after test on the carrier into the magazine. Thus, the transporting apparatus with high installing area efficiency and high test efficiency can be fabricated at low production cost.

摘要翻译： 用于测试多个半导体器件的传送装置包括多个托盘以多个层叠的盒子，每个托盘上放置有多个半导体器件; 用于将所述多个托盘放置在所述盒中的分配储存器机构到载体上; 载体输送机构，用于将载体输送到恒温室内的试验台，并将载体运送到恒温室外; 以及回收储存器机构，用于在载体上测试之后将多个托盘回收到料盒中。 因此，可以以低生产成本制造具有高安装面积效率和高测试效率的输送装置。

公开(公告)号：US5565008A

公开(公告)日：1996-10-15

申请号：US234595

申请日：1994-04-28

申请人： Kunihiro Shigetomo ,  Jiro Takamura ,  Kunio Kobayashi ,  Kiyoji Imanaka

发明人： Kunihiro Shigetomo ,  Jiro Takamura ,  Kunio Kobayashi ,  Kiyoji Imanaka

IPC分类号： B65D85/86 ,  B65D85/38 ,  B65G47/74 ,  H01L21/50 ,  H01L21/673 ,  H01L21/677 ,  H01L21/68 ,  H01L23/00 ,  H05K13/00 ,  H01L21/58

CPC分类号： H05K13/0084 ,  Y10T29/41

摘要： A method of manufacturing semiconductor devices includes accommodating the semiconductor devices in the form of semimanufactures in accomodating tools having uniform outer dimensions regardless of the type of the semiconductor devices; receiving the semiconductor devices in the form of semimanufactures in each of a plurality of processing devices while maintaining the semiconductor devices in the accomodating tools; and processing the semiconductor devices in the form of semimanufactures in each of a plurality of processing devices.

摘要翻译： 一种制造半导体器件的方法包括以半制造的形式容纳具有均匀外形尺寸的工具的半导体器件，而与半导体器件的类型无关; 在将所述半导体器件保持在所述适应工具中的同时，在多个处理装置的每一个中接收半制造形式的半导体器件; 以及在多个处理装置中的每一个中以半制造形式处理半导体器件。