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公开(公告)号：US08963191B2
公开(公告)日：2015-02-24
申请号：US13396905
申请日：2012-02-15
CPC分类号： H01L33/62 , H01L33/38 , H01L33/486 , H01L33/60 , H01L2924/0002 , H01L2924/00
摘要： The light emitting device package includes a body provided with a cavity, a first lead frame mounted on the body, a second lead frame mounted on the body and separated from the first lead frame, and a light emitting device mounted in the cavity and disposed between the first lead frame and the second lead frame, the light emitting device is formed by sequentially stacking a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer, the sequentially stacking direction of the first conductivity-type semiconductor layer, the active layer and the second conductivity-type semiconductor layer is parallel with the bottom surface of the cavity, the first lead frame includes a first connection part electrically connected to the first conductivity-type semiconductor layer, and the second lead frame includes a second connection part electrically connected to the second conductivity-type semiconductor layer.
摘要翻译： 发光器件封装包括设置有空腔的本体，安装在主体上的第一引线框架，安装在主体上并与第一引线框架分离的第二引线框架，以及安装在空腔中并设置在第二引线框架之间的发光器件 第一引线框和第二引线框，通过依次层叠第一导电型半导体层，有源层和第二导电型半导体层而形成发光器件，第一导电型半导体的顺序层叠方向 所述有源层和所述第二导电型半导体层与所述空腔的底面平行，所述第一引线框架包括与所述第一导电型半导体层电连接的第一连接部，所述第二引线框包括： 与第二导电型半导体层电连接的第二连接部。
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公开(公告)号：US20120153337A1
公开(公告)日：2012-06-21
申请号：US13396905
申请日：2012-02-15
CPC分类号： H01L33/62 , H01L33/38 , H01L33/486 , H01L33/60 , H01L2924/0002 , H01L2924/00
摘要： The light emitting device package includes a body provided with a cavity, a first lead frame mounted on the body, a second lead frame mounted on the body and separated from the first lead frame, and a light emitting device mounted in the cavity and disposed between the first lead frame and the second lead frame, the light emitting device is formed by sequentially stacking a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer, the sequentially stacking direction of the first conductivity-type semiconductor layer, the active layer and the second conductivity-type semiconductor layer is parallel with the bottom surface of the cavity, the first lead frame includes a first connection part electrically connected to the first conductivity-type semiconductor layer, and the second lead frame includes a second connection part electrically connected to the second conductivity-type semiconductor layer.
摘要翻译： 发光器件封装包括设置有空腔的本体，安装在主体上的第一引线框架，安装在主体上并与第一引线框架分离的第二引线框架，以及安装在空腔中并设置在第二引线框架之间的发光器件 第一引线框和第二引线框，通过依次层叠第一导电型半导体层，有源层和第二导电型半导体层而形成发光器件，第一导电型半导体的顺序层叠方向 所述有源层和所述第二导电型半导体层与所述空腔的底面平行，所述第一引线框架包括与所述第一导电型半导体层电连接的第一连接部，所述第二引线框包括： 与第二导电型半导体层电连接的第二连接部。
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公开(公告)号：US08916778B2
公开(公告)日：2014-12-23
申请号：US13367988
申请日：2012-02-07
申请人： Sangwoo Lee , Jiun Kong , Il Seo , Hongboem Jin , Dongwook Park
发明人： Sangwoo Lee , Jiun Kong , Il Seo , Hongboem Jin , Dongwook Park
CPC分类号： H05K1/053 , F21V29/89 , H01L2224/48091 , H05K1/05 , H01L2924/00014
摘要： Embodiments are about light emitting devices array. The light emitting device array according to embodiments may include a printed circuit board including a base layer, a first protection layer which is in contact with at least one surface of the base layer, an insulating layer disposed on the base layer, and a conduction layer disposed on the insulating layer and a light emitting device package mounted on the conduction layer, wherein the base layer includes iron (Fe).
摘要翻译： 实施例涉及发光器件阵列。 根据实施例的发光器件阵列可以包括印刷电路板，其包括基底层，与基底层的至少一个表面接触的第一保护层，设置在基底层上的绝缘层和导电层 设置在所述绝缘层上，以及安装在所述导电层上的发光器件封装，其中所述基极层包括铁（Fe）。
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公开(公告)号：US20130039078A1
公开(公告)日：2013-02-14
申请号：US13367988
申请日：2012-02-07
申请人： Sangwoo Lee , Jiun Kong , Il Seo , Hongboem Jin , Dongwook Park
发明人： Sangwoo Lee , Jiun Kong , Il Seo , Hongboem Jin , Dongwook Park
CPC分类号： H05K1/053 , F21V29/89 , H01L2224/48091 , H05K1/05 , H01L2924/00014
摘要： Embodiments are about light emitting devices array. The light emitting device array according to embodiments may include a printed circuit board including a base layer, a first protection layer which is in contact with at least one surface of the base layer, an insulating layer disposed on the base layer, and a conduction layer disposed on the insulating layer and a light emitting device package mounted on the conduction layer, wherein the base layer includes iron (Fe).
摘要翻译： 实施例涉及发光器件阵列。 根据实施例的发光器件阵列可以包括印刷电路板，其包括基底层，与基底层的至少一个表面接触的第一保护层，设置在基底层上的绝缘层和导电层 设置在所述绝缘层上，以及安装在所述导电层上的发光器件封装，其中所述基极层包括铁（Fe）。
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