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1.发明授权公开(公告)号：US06169274A
公开(公告)日：2001-01-02
申请号：US09259675
申请日：1999-03-01
Applicant: John Kulp
Inventor： John Kulp
IPC: H05B102
CPC classification number: H01L21/67248 , H01L21/67103
Abstract: A heating element is disposed on a back face side of a holding plate, and a substrate mounted on the surface of the holding plate is designed to be heat-treated. In the holding plate, a hole having a bottom is provided from the back face toward the surface. At positions of different heights, a first temperature sensor and a second temperature sensor are disposed respectively. And a control section estimates the temperatures of the treatment position corresponding to detected results by the first temperature sensor and the second temperature sensor, controls heat energy to be supplied to the holding plate to control a heat treatment temperature of the substrate on the holding plate. Through the above formation, the temperature of the treatment position can be accurately estimated, the treatment position can reach a desired temperature within a short time, regardless of the temperature history, so that the time to treat the substrate at a desired treatment temperature can be made long.
Abstract translation: 加热元件设置在保持板的背面侧，并且将安装在保持板的表面上的基板设计为进行热处理。 在保持板中，从背面朝向表面设置有具有底部的孔。 在不同高度的位置，分别设置第一温度传感器和第二温度传感器。 并且，控制部估计由第一温度传感器和第二温度传感器对应于检测结果的处理位置的温度，控制向保持板供给的热能，以控制保持板上的基板的热处理温度。 通过上述形成，可以准确地估计处理位置的温度，处理位置可以在短时间内达到期望的温度，而不管温度历史如何，使得在所需处理温度下处理基板的时间可以是 做得很久
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2.发明授权Apparatus and method for predictive temperature correction during thermal processing 有权热处理期间预测温度校正的装置和方法公开(公告)号：US08669497B2
公开(公告)日：2014-03-11
申请号：US11694172
申请日：2007-03-30
Applicant: John Kulp
Inventor： John Kulp
IPC: H01L21/67
CPC classification number: F27B17/0025 , H01L21/67109 , H01L21/67248 , H01L21/67259
Abstract: A thermal processing apparatus and method with predictive temperature correction. Distances are measured from a backside of the wafer relative to a reference plane. Heat is transferred to the backside of the substrate in relation to the measured distances. This allows a baking unit to uniformly heat the substrate to compensate for irregularities or warpage.
Abstract translation: 一种具有预测温度校正的热处理装置和方法。 距晶片相对于参考平面从背面测量。 相对于测量的距离，热量传递到衬底的背面。 这允许烘烤单元均匀地加热基底以补偿不规则或翘曲。
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公开(公告)号：US20120117571A1
公开(公告)日：2012-05-10
申请号：US12940613
申请日：2010-11-05
Applicant: Adam Davis , Andrew John Kulp
Inventor： Adam Davis , Andrew John Kulp
CPC classification number: H04L67/1025 , H04L41/0253 , H04L41/0806 , H04L41/18 , H04L41/22 , H04L63/0263 , H04L63/101
Abstract: A method and system may receive a request to configure a computing resource, such as a load balancer or firewall based on configuration information received from a user via a web portal. The configuration information may be stored and a subsequent request to commit the stored configuration information may be received. One or more jobs may be queued in a jobs database based on the request to commit the configuration information. The one or more jobs may be dequeued by a workflow engine and executed to configure the computing resource.
Abstract translation: 方法和系统可以基于经由门户网站从用户接收的配置信息来接收配置诸如负载均衡器或防火墙的计算资源的请求。 可以存储配置信息，并且可以接收提交存储的配置信息的后续请求。 基于提交配置信息的请求，一个或多个作业可能在作业数据库中排队。 一个或多个作业可以由工作流引擎出队并被执行以配置计算资源。
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Patent Agency Ranking
4.发明授权Method for heating a chemically amplified resist layer carried on a rotating substrate 失效用于加热承载在旋转衬底上的化学放大抗蚀剂层的方法公开(公告)号：US07479463B2
公开(公告)日：2009-01-20
申请号：US11684154
申请日：2007-03-09
Applicant: John Kulp , Michael Carcasi , Merritt Funk
Inventor： John Kulp , Michael Carcasi , Merritt Funk
IPC: H01L21/312
CPC classification number: H01L21/6715 , G03F7/3021 , H01L21/67109
Abstract: Embodiments of an apparatus and methods for heating a substrate and a sacrificial layer are generally described herein. Other embodiments may be described and claimed.
Abstract translation: 本文通常描述用于加热衬底和牺牲层的装置和方法的实施例。 可以描述和要求保护其他实施例。
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5.发明申请公开(公告)号：US20080220340A1
公开(公告)日：2008-09-11
申请号：US11684154
申请日：2007-03-09
Applicant: John Kulp , Michael A. Carcasi , Merritt Funk
Inventor： John Kulp , Michael A. Carcasi , Merritt Funk
CPC classification number: H01L21/6715 , G03F7/3021 , H01L21/67109
Abstract: Embodiments of an apparatus and methods for heating a substrate and a sacrificial layer are generally described herein. Other embodiments may be described and claimed.
Abstract translation: 本文通常描述用于加热衬底和牺牲层的装置和方法的实施例。 可以描述和要求保护其他实施例。
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6.发明申请Sacrificial surfactanated pre-wet for defect reduction in a semiconductor photolithography developing process 失效在半导体光刻显影工艺中用于缺陷还原的牺牲表面活性预湿法公开(公告)号：US20050069821A1
公开(公告)日：2005-03-31
申请号：US10675419
申请日：2003-09-30
Applicant: John Kulp
Inventor： John Kulp
CPC classification number: G03F7/322
Abstract: A method and apparatus for developing a resist on a substrate in which a sacrificial surfactant-containing liquid is first applied to a resist as a pretreatment to reduce developing process defects and to improve the development process time and the uniformity of the resist. The pretreatment is followed by supplying a developing solution to the resist and thereafter developing the resist.
Abstract translation: 一种用于在基板上显影抗蚀剂的方法和装置，其中先将含牺牲表面活性剂的液体施加到抗蚀剂上作为预处理，以减少显影工艺缺陷并改善显影处理时间和抗蚀剂的均匀性。 预处理之后，向抗蚀剂供给显影液，然后显影抗蚀剂。
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公开(公告)号：US09237194B2
公开(公告)日：2016-01-12
申请号：US12940613
申请日：2010-11-05
Applicant: Adam Davis , Andrew John Kulp
Inventor： Adam Davis , Andrew John Kulp
CPC classification number: H04L67/1025 , H04L41/0253 , H04L41/0806 , H04L41/18 , H04L41/22 , H04L63/0263 , H04L63/101
Abstract: A method and system may receive a request to configure a computing resource, such as a load balancer or firewall based on configuration information received from a user via a web portal. The configuration information may be stored and a subsequent request to commit the stored configuration information may be received. One or more jobs may be queued in a jobs database based on the request to commit the configuration information. The one or more jobs may be dequeued by a workflow engine and executed to configure the computing resource.
Abstract translation: 方法和系统可以基于经由门户网站从用户接收的配置信息来接收配置诸如负载均衡器或防火墙的计算资源的请求。 可以存储配置信息，并且可以接收提交存储的配置信息的后续请求。 基于提交配置信息的请求，一个或多个作业可能在作业数据库中排队。 一个或多个作业可以由工作流引擎出队并被执行以配置计算资源。
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8.发明申请APPARATUS AND METHOD FOR PREDICTIVE TEMPERATURE CORRECTION DURING THERMAL PROCESSING 有权热处理期间预测温度校正的装置和方法公开(公告)号：US20080241778A1
公开(公告)日：2008-10-02
申请号：US11694172
申请日：2007-03-30
Applicant: John Kulp
Inventor： John Kulp
IPC: F27D13/00
CPC classification number: F27B17/0025 , H01L21/67109 , H01L21/67248 , H01L21/67259
Abstract: A thermal processing apparatus and method with predictive temperature correction. Distances are measured from a backside of the wafer relative to a reference plane. Heat is transferred to the backside of the substrate in relation to the measured distances. This allows a baking unit to uniformly heat the substrate to compensate for irregularities or warpage.
Abstract translation: 一种具有预测温度校正的热处理装置和方法。 距晶片相对于参考平面从背面测量。 相对于测量的距离，热量传递到衬底的背面。 这允许烘烤单元均匀地加热基底以补偿不规则或翘曲。
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