公开(公告)号：US06818479B2

公开(公告)日：2004-11-16

申请号：US10409840

申请日：2003-04-09

申请人： Michael L. Boroson ,  John Schmittendorf ,  Jeffrey P. Serbicki

发明人： Michael L. Boroson ,  John Schmittendorf ,  Jeffrey P. Serbicki

IPC分类号： H01L2144

CPC分类号： H01L23/26 ,  H01L23/08 ,  H01L23/10 ,  H01L51/524 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5259 ,  H01L2251/566 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/00

摘要： A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.

摘要翻译： 高度湿度敏感元件和制造这种元件的方法包括将基底上的所有高湿度敏感电子器件封装的封装外壳和位于基底和封装外壳之间的密封材料，以在基底和封装外壳之间形成完整密封 每个高度湿度敏感的电子设备周围的封装外壳或高湿度敏感电子设备的周围。

公开(公告)号：US06594916B2

公开(公告)日：2003-07-22

申请号：US10150029

申请日：2002-05-17

申请人： Michael L. Boroson ,  John Schmittendorf ,  Peter G. Bessey ,  Jeffrey P. Serbicki

发明人： Michael L. Boroson ,  John Schmittendorf ,  Peter G. Bessey ,  Jeffrey P. Serbicki

IPC分类号： F26B300

CPC分类号： H01L23/564 ,  H01L23/08 ,  H01L23/10 ,  H01L23/26 ,  H01L27/14618 ,  H01L27/14806 ,  H01L51/524 ,  H01L51/5246 ,  H01L51/5259 ,  H01L2251/566 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/15151 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/00

摘要： A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices, wherein the substrate or encapsulation enclosure, or both, contain vent holes and vent hole seal material or wherein the seal material contains gaps prior to spacing the substrate and the encapsulation enclosure within a predetermined range and the gaps are filled in by spreading the sealing material.

公开(公告)号：US06590157B2

公开(公告)日：2003-07-08

申请号：US09957856

申请日：2001-09-21

申请人： Michael L. Boroson ,  John Schmittendorf ,  Peter G. Bessey ,  Jeffrey P. Serbicki

发明人： Michael L. Boroson ,  John Schmittendorf ,  Peter G. Bessey ,  Jeffrey P. Serbicki

IPC分类号： H05K500

CPC分类号： H01L23/26 ,  B81B7/0038 ,  H01L23/08 ,  H01L23/10 ,  H01L27/14618 ,  H01L51/524 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5259 ,  H01L2251/566 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/00

摘要： A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a partial seal (later to be filled) between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.

摘要翻译： 高度湿度敏感的元件和制造这种元件的方法包括将基底上的所有高湿度敏感电子器件封装的封装外壳和位于基底和封装外壳之间的密封材料以形成部分密封（稍后为 填充）在每个高度湿度敏感的电子设备周围的基底和封装外壳之间或围绕几组高度湿度敏感的电子设备。

公开(公告)号：US07091605B2

公开(公告)日：2006-08-15

申请号：US09957851

申请日：2001-09-21

申请人： Michael L. Boroson ,  John Schmittendorf ,  Jeffrey P. Serbicki

发明人： Michael L. Boroson ,  John Schmittendorf ,  Jeffrey P. Serbicki

IPC分类号： H01L23/34

CPC分类号： H01L23/26 ,  H01L23/08 ,  H01L23/10 ,  H01L51/524 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5259 ,  H01L2251/566 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/00

摘要： A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.

公开(公告)号：US06470594B1

公开(公告)日：2002-10-29

申请号：US09960677

申请日：2001-09-21

申请人： Michael L. Boroson ,  John Schmittendorf ,  Peter G. Bessey ,  Jeffrey P. Serbicki

发明人： Michael L. Boroson ,  John Schmittendorf ,  Peter G. Bessey ,  Jeffrey P. Serbicki

IPC分类号： F26B300

CPC分类号： H01L23/564 ,  H01L23/08 ,  H01L23/10 ,  H01L23/26 ,  H01L27/14618 ,  H01L27/14806 ,  H01L51/524 ,  H01L51/5246 ,  H01L51/5259 ,  H01L2251/566 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/15151 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/00

摘要： A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices, wherein the substrate or encapsulation enclosure, or both, contain vent holes and vent hole seal material or wherein the seal material contains gaps prior to spacing the substrate and the encapsulation enclosure within a predetermined range and the gaps are filled in by spreading the sealing material.

摘要翻译： 高度湿度敏感元件和制造这种元件的方法包括将基底上的所有高湿度敏感电子器件封装的封装外壳和位于基底和封装外壳之间的密封材料，以在基底和封装外壳之间形成完整密封 每个高度湿度敏感的电子设备周围的封装外壳或高度湿度敏感的电子设备的组，其中衬底或封装外壳或两者包含通气孔和通气孔密封材料，或者其中密封材料在间隔之前包含间隙 衬底和封装外壳处于预定范围内，并通过铺展密封材料来填充间隙。