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1.发明授权公开(公告)号：US06818479B2
公开(公告)日：2004-11-16
申请号：US10409840
申请日：2003-04-09
IPC分类号： H01L2144
CPC分类号： H01L23/26 , H01L23/08 , H01L23/10 , H01L51/524 , H01L51/5246 , H01L51/5253 , H01L51/5259 , H01L2251/566 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/16152 , H01L2924/16195 , H01L2924/3011 , H01L2924/00
摘要： A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.
摘要翻译： 高度湿度敏感元件和制造这种元件的方法包括将基底上的所有高湿度敏感电子器件封装的封装外壳和位于基底和封装外壳之间的密封材料，以在基底和封装外壳之间形成完整密封 每个高度湿度敏感的电子设备周围的封装外壳或高湿度敏感电子设备的周围。
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公开(公告)号：US07091605B2
公开(公告)日：2006-08-15
申请号：US09957851
申请日：2001-09-21
IPC分类号： H01L23/34
CPC分类号： H01L23/26 , H01L23/08 , H01L23/10 , H01L51/524 , H01L51/5246 , H01L51/5253 , H01L51/5259 , H01L2251/566 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/16152 , H01L2924/16195 , H01L2924/3011 , H01L2924/00
摘要： A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.
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3.发明授权Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps 有权高度湿度敏感的电子设备元件和利用排气孔或间隙的制造方法公开(公告)号：US06470594B1
公开(公告)日：2002-10-29
申请号：US09960677
申请日：2001-09-21
IPC分类号： F26B300
CPC分类号： H01L23/564 , H01L23/08 , H01L23/10 , H01L23/26 , H01L27/14618 , H01L27/14806 , H01L51/524 , H01L51/5246 , H01L51/5259 , H01L2251/566 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/15151 , H01L2924/16152 , H01L2924/16195 , H01L2924/00
摘要： A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices, wherein the substrate or encapsulation enclosure, or both, contain vent holes and vent hole seal material or wherein the seal material contains gaps prior to spacing the substrate and the encapsulation enclosure within a predetermined range and the gaps are filled in by spreading the sealing material.
摘要翻译： 高度湿度敏感元件和制造这种元件的方法包括将基底上的所有高湿度敏感电子器件封装的封装外壳和位于基底和封装外壳之间的密封材料，以在基底和封装外壳之间形成完整密封 每个高度湿度敏感的电子设备周围的封装外壳或高度湿度敏感的电子设备的组，其中衬底或封装外壳或两者包含通气孔和通气孔密封材料，或者其中密封材料在间隔之前包含间隙 衬底和封装外壳处于预定范围内，并通过铺展密封材料来填充间隙。
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公开(公告)号：US06594916B2
公开(公告)日：2003-07-22
申请号：US10150029
申请日：2002-05-17
IPC分类号： F26B300
CPC分类号： H01L23/564 , H01L23/08 , H01L23/10 , H01L23/26 , H01L27/14618 , H01L27/14806 , H01L51/524 , H01L51/5246 , H01L51/5259 , H01L2251/566 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/15151 , H01L2924/16152 , H01L2924/16195 , H01L2924/00
摘要： A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices, wherein the substrate or encapsulation enclosure, or both, contain vent holes and vent hole seal material or wherein the seal material contains gaps prior to spacing the substrate and the encapsulation enclosure within a predetermined range and the gaps are filled in by spreading the sealing material.
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5.发明授权Sealing structure for highly moisture-sensitive electronic device element and method for fabrication 有权高湿度敏感电子元件元件的密封结构及其制造方法公开(公告)号：US06590157B2
公开(公告)日：2003-07-08
申请号：US09957856
申请日：2001-09-21
IPC分类号： H05K500
CPC分类号： H01L23/26 , B81B7/0038 , H01L23/08 , H01L23/10 , H01L27/14618 , H01L51/524 , H01L51/5246 , H01L51/5253 , H01L51/5259 , H01L2251/566 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H01L2924/00
摘要： A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a partial seal (later to be filled) between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.
摘要翻译： 高度湿度敏感的元件和制造这种元件的方法包括将基底上的所有高湿度敏感电子器件封装的封装外壳和位于基底和封装外壳之间的密封材料以形成部分密封（稍后为 填充）在每个高度湿度敏感的电子设备周围的基底和封装外壳之间或围绕几组高度湿度敏感的电子设备。
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