摘要:
A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.
摘要:
A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.
摘要:
A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices, wherein the substrate or encapsulation enclosure, or both, contain vent holes and vent hole seal material or wherein the seal material contains gaps prior to spacing the substrate and the encapsulation enclosure within a predetermined range and the gaps are filled in by spreading the sealing material.
摘要:
A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices, wherein the substrate or encapsulation enclosure, or both, contain vent holes and vent hole seal material or wherein the seal material contains gaps prior to spacing the substrate and the encapsulation enclosure within a predetermined range and the gaps are filled in by spreading the sealing material.
摘要:
A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a partial seal (later to be filled) between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.
摘要:
A method of desiccating an environment surrounding a moisture-sensitive electronic device sealed within an enclosure, includes selecting a desiccant comprised of solid particles having a particle size range 0.1 to 200 micrometers, the desiccant selected to provide an equilibrium minimum humidity level lower than a humidity level to which the device is sensitive within the sealed enclosure; choosing a binder that maintains or enhances the moisture absorption rate of the desiccant for blending the selected desiccant therein, the binder being in liquid phase or dissolved in a liquid; forming a castable blend including at least the desiccant particles and the binder, the blend having a preferred weight fraction of the desiccant particles in the blend in a range of 10% to 90%; casting a measured amount of the blend onto a portion of an interior surface of an enclosure to form a desiccant layer thereover, the enclosure having a sealing flange; solidifying the desiccant layer to a solid; and sealing the electronic device with the enclosure along the sealing flange.
摘要:
An effective desiccant for use in a package which has a material including at least in part solid particles of one or more materials, at least one of such materials having an average particle size range 0.001 to 0.1 micrometers to provide a high rate of water absorption and to provide an equilibrium minimum humidity level lower than a humidity level to which a highly moisture sensitive electronic device is sensitive within a sealed enclosure.
摘要:
An organic electroluminescent (EL) display panel is disclosed which has a protective cover sealed thereon with a radiation-cured perimeter seal. The organic EL display panel is formed on a radiation-transmissive substrate, and includes at least one metallized leader which is in electrical contact with at least one anode electrode or with at least one cathode electrode. The metallized leader has a patterned seal zone which defines radiation-transmissive apertures. A perimeter seal band is formed over the substrate and extends through the patterned seal zone of the metallized leader. A protective cover has a perimeter seal flange which mates with the perimeter seal band. A bead of a radiation-curable resin is in contact with the seal flange and with the display panel at the perimeter seal band. A source of curing radiation is directed to the bead of radiation-curable resin through the substrate and through the patterned seal zone for curing the bead so as to seal the protective cover on the organic EL display panel with an electrically insulative radiation-cured perimeter seal.
摘要:
An apparatus for depositing one or more organic material layers of an OLED lighting device upon a first region of a substrate and one or more conducting layers upon a second region, wherein the conducting layers partially or completely cover and extend beyond one side of the organic layers, comprising: a reusable mask in contact with the substrate, at least one mask open area having an overhang feature; one or more sources of vaporized organic material, selected to form layers of the OLED lighting device, and the vaporized organic material plume is shaped, on the side corresponding to the mask overhang feature, so as to limit substantial transfer of organic material on said side to angles less than or equal to a selected cutoff angle to the first region; and one or more sources of vaporized conducting material that transfer conducting material to the second region, wherein the second region partially or completely overlaps the first region and extends beyond the first region on the side corresponding to the overhang feature of the mask.
摘要:
A thin film environmental barrier encapsulation process includes providing an electronic device on a substrate, a first reactant gaseous material, a second reactant gaseous material, an inert gaseous material; and a delivery head through which the reactant gaseous materials and the inert gaseous material are simultaneously directed toward the electronic device and the substrate. One or more of the reactant gaseous materials and the inert gaseous material flows through the delivery head. The flow of the one or more of the reactant gaseous materials and the inert gaseous material generates a pressure to create a gas fluid bearing that maintains a substantially uniform distance between the delivery head and the substrate. Relative motion between the delivery head and the substrate causes the second reactant gaseous material to react with at least a portion of the electronic device and the substrate that has been treated with the first reactant gaseous material.