公开(公告)号：US08441116B2

公开(公告)日：2013-05-14

申请号：US13465274

申请日：2012-05-07

申请人： Woong Sun Lee ,  Qwan Ho Chung ,  Il Hwan Cho ,  Sang Joon Lim ,  Jong Woo Yoo ,  Jin Ho Bae ,  Seung Hyun Lee

发明人： Woong Sun Lee ,  Qwan Ho Chung ,  Il Hwan Cho ,  Sang Joon Lim ,  Jong Woo Yoo ,  Jin Ho Bae ,  Seung Hyun Lee

IPC分类号： H01L23/48

CPC分类号： H01L23/5384 ,  H01L23/5386 ,  H01L24/29 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83007 ,  H01L2224/83138 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The substrate for a semiconductor package includes a substrate body having a first surface and a second surface opposite to the first surface. Connection pads are formed near an edge of the first surface. Signal lines having conductive vias and first, second, and third line parts are formed. The first line parts are formed on the first surface and are connected to the connection pads and the conductive vias, which pass through the substrate body. The second line parts are formed on the first surface and connect to the conductive vias. The third line parts are formed on the second surface and connect to the conductive vias. The second and third line parts are formed to have substantially the same length. The semiconductor package utilizes the above substrate for processing data at a high speed.

摘要翻译： 用于半导体封装的衬底包括具有第一表面和与第一表面相对的第二表面的衬底本体。 在第一表面的边缘附近形成连接垫。 形成具有导电通孔和第一，第二和第三线部分的信号线。 第一线部分形成在第一表面上并且连接到穿过基板主体的连接焊盘和导电通孔。 第二线部分形成在第一表面上并连接到导电通孔。 第三线部分形成在第二表面上并连接到导电通孔。 第二和第三线部分形成为具有基本相同的长度。 半导体封装利用上述基板高速处理数据。

公开(公告)号：US20120217637A1

公开(公告)日：2012-08-30

申请号：US13465274

申请日：2012-05-07

申请人： Woong Sun LEE ,  Qwan Ho CHUNG ,  Il Hwan CHO ,  Sang Joon LIM ,  Jong Woo YOO ,  Jin Ho BAE ,  Seung Hyun LEE

发明人： Woong Sun LEE ,  Qwan Ho CHUNG ,  Il Hwan CHO ,  Sang Joon LIM ,  Jong Woo YOO ,  Jin Ho BAE ,  Seung Hyun LEE

IPC分类号： H01L23/48

CPC分类号： H01L23/5384 ,  H01L23/5386 ,  H01L24/29 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83007 ,  H01L2224/83138 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The substrate for a semiconductor package includes a substrate body having a first surface and a second surface opposite to the first surface. Connection pads are formed near an edge of the first surface. Signal lines having conductive vias and first, second, and third line parts are formed. The first line parts are formed on the first surface and are connected to the connection pads and the conductive vias, which pass through the substrate body. The second line parts are formed on the first surface and connect to the conductive vias. The third line parts are formed on the second surface and connect to the conductive vias. The second and third line parts are formed to have substantially the same length. The semiconductor package utilizes the above substrate for processing data at a high speed.

摘要翻译： 用于半导体封装的衬底包括具有第一表面和与第一表面相对的第二表面的衬底本体。 在第一表面的边缘附近形成连接垫。 形成具有导电通孔和第一，第二和第三线部分的信号线。 第一线部分形成在第一表面上并且连接到穿过基板主体的连接焊盘和导电通孔。 第二线部分形成在第一表面上并连接到导电通孔。 第三线部分形成在第二表面上并连接到导电通孔。 第二和第三线部分形成为具有基本相同的长度。 半导体封装利用上述基板高速处理数据。

公开(公告)号：US20090152708A1

公开(公告)日：2009-06-18

申请号：US12049661

申请日：2008-03-17

申请人： Woong Sun LEE ,  Qwan Ho CHUNG ,  Il Hwan CHO ,  Sang Joon LIM ,  Jong Woo YOO ,  Jin Ho BAE ,  Seung Hyun LEE

发明人： Woong Sun LEE ,  Qwan Ho CHUNG ,  Il Hwan CHO ,  Sang Joon LIM ,  Jong Woo YOO ,  Jin Ho BAE ,  Seung Hyun LEE

IPC分类号： H01L23/498

CPC分类号： H01L23/5384 ,  H01L23/5386 ,  H01L24/29 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83007 ,  H01L2224/83138 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The substrate for a semiconductor package includes a substrate body having a first surface and a second surface opposite to the first surface. Connection pads are formed near an edge of the first surface. Signal lines having conductive vias and first, second, and third line parts are formed. The first line parts are formed on the first surface and are connected to the connection pads and the conductive vias, which pass through the substrate body. The second line parts are formed on the first surface and connect to the conductive vias. The third line parts are formed on the second surface and connect to the conductive vias. The second and third line parts are formed to have substantially the same length. The semiconductor package utilizes the above substrate for processing data at a high speed.

摘要翻译： 用于半导体封装的衬底包括具有第一表面和与第一表面相对的第二表面的衬底本体。 在第一表面的边缘附近形成连接垫。 形成具有导电通孔和第一，第二和第三线部分的信号线。 第一线部分形成在第一表面上并且连接到穿过基板主体的连接焊盘和导电通孔。 第二线部分形成在第一表面上并连接到导电通孔。 第三线部分形成在第二表面上并连接到导电通孔。 第二和第三线部分形成为具有基本相同的长度。 半导体封装利用上述基板高速处理数据。