公开(公告)号：US08866027B2

公开(公告)日：2014-10-21

申请号：US12518398

申请日：2008-01-16

申请人： Yoshio Oka ,  Jinjoo Park ,  Kazuyuki Maeda ,  Narito Yagi ,  Tetsuya Shimomura ,  Junichiro Nishikawa

发明人： Yoshio Oka ,  Jinjoo Park ,  Kazuyuki Maeda ,  Narito Yagi ,  Tetsuya Shimomura ,  Junichiro Nishikawa

IPC分类号： H05K1/11 ,  H05K3/44 ,  H05K3/20 ,  H05K1/09 ,  H05K3/40 ,  H01B1/22 ,  H05K1/05

CPC分类号： H05K3/44 ,  H01B1/22 ,  H05K1/056 ,  H05K1/097 ,  H05K3/4069 ,  H05K2201/09554 ,  H05K2203/0315 ,  H05K2203/105 ,  H05K2203/1136 ,  Y10T29/49128 ,  Y10T29/49165

摘要： The printed wiring board 1 includes the metallic substrate 2, the insulating layer 3 provided on the surface of the metallic substrate 2, and the conductive layer 4 formed on the surface of the insulating layer 3. The conductive layer 4 is electrically connected to the metallic substrate 2. A bottomed via hole or a through hole 6 is formed in the insulating layer 3 and the conducive layer 4. The via hole has a bottom in the metallic substrate 2, and has a wall surface in the insulating layer 3 and in the conductive layer 4. The through hole 6 extends through the insulating layer 3, the conductive layer 4, and the metallic substrate 2. Conductive paste 7 fills the bottomed via hole or the through hole 6 to electrically connect the metallic substrate 2 and the conductive layer 4 with each other. The printed wiring board 1 is subjected to a process in which current is applied to the interface between the metallic substrate 2 and the conductive paste 7.

摘要翻译： 印刷电路板1包括金属基板2，设置在金属基板2的表面上的绝缘层3和形成在绝缘层3的表面上的导电层4.导电层4电连接到金属 基板2.在绝缘层3和导电层4中形成有底的通孔或通孔6.通孔在金属基板2中具有底部，并且在绝缘层3中具有壁表面 通孔6延伸穿过绝缘层3，导电层4和金属基底2.导电浆料7填充有底的通孔或通孔6，以将金属基底2和导电层 4与彼此。 对印刷布线板1进行电流施加到金属基板2和导电浆料7之间的界面的处理。

公开(公告)号：US20100044094A1

公开(公告)日：2010-02-25

申请号：US12518398

申请日：2008-01-16

申请人： Yoshio Oka ,  Jinjoo Park ,  Kazuyuki Maeda ,  Narito Yagi ,  Tetsuya Shimomura ,  Junichiro Nishikawa

发明人： Yoshio Oka ,  Jinjoo Park ,  Kazuyuki Maeda ,  Narito Yagi ,  Tetsuya Shimomura ,  Junichiro Nishikawa

IPC分类号： H05K1/11 ,  H05K3/10

CPC分类号： H05K3/44 ,  H01B1/22 ,  H05K1/056 ,  H05K1/097 ,  H05K3/4069 ,  H05K2201/09554 ,  H05K2203/0315 ,  H05K2203/105 ,  H05K2203/1136 ,  Y10T29/49128 ,  Y10T29/49165

摘要： The printed wiring board 1 includes the metallic substrate 2, the insulating layer 3 provided on the surface of the metallic substrate 2, and the conductive layer 4 formed on the surface of the insulating layer 3. The conductive layer 4 is electrically connected to the metallic substrate 2. A bottomed via hole or a through hole 6 is formed in the insulating layer 3 and the conducive layer 4. The via hole has a bottom in the metallic substrate 2, and has a wall surface in the insulating layer 3 and in the conductive layer 4. The through hole 6 extends through the insulating layer 3, the conductive layer 4, and the metallic substrate 2. Conductive paste 7 fills the bottomed via hole or the through hole 6 to electrically connect the metallic substrate 2 and the conductive layer 4 with each other. The printed wiring board 1 is subjected to a process in which current is applied to the interface between the metallic substrate 2 and the conductive paste 7.

摘要翻译： 印刷电路板1包括金属基板2，设置在金属基板2的表面上的绝缘层3和形成在绝缘层3的表面上的导电层4.导电层4电连接到金属 基板2.在绝缘层3和导电层4中形成有底的通孔或通孔6.通孔在金属基板2中具有底部，并且在绝缘层3中具有壁表面 通孔6延伸穿过绝缘层3，导电层4和金属基底2.导电浆料7填充有底的通孔或通孔6，以将金属基底2和导电层 4与彼此。 对印刷布线板1进行电流施加到金属基板2和导电浆料7之间的界面的处理。