公开(公告)号：US08866027B2

公开(公告)日：2014-10-21

申请号：US12518398

申请日：2008-01-16

申请人： Yoshio Oka ,  Jinjoo Park ,  Kazuyuki Maeda ,  Narito Yagi ,  Tetsuya Shimomura ,  Junichiro Nishikawa

发明人： Yoshio Oka ,  Jinjoo Park ,  Kazuyuki Maeda ,  Narito Yagi ,  Tetsuya Shimomura ,  Junichiro Nishikawa

IPC分类号： H05K1/11 ,  H05K3/44 ,  H05K3/20 ,  H05K1/09 ,  H05K3/40 ,  H01B1/22 ,  H05K1/05

CPC分类号： H05K3/44 ,  H01B1/22 ,  H05K1/056 ,  H05K1/097 ,  H05K3/4069 ,  H05K2201/09554 ,  H05K2203/0315 ,  H05K2203/105 ,  H05K2203/1136 ,  Y10T29/49128 ,  Y10T29/49165

摘要： The printed wiring board 1 includes the metallic substrate 2, the insulating layer 3 provided on the surface of the metallic substrate 2, and the conductive layer 4 formed on the surface of the insulating layer 3. The conductive layer 4 is electrically connected to the metallic substrate 2. A bottomed via hole or a through hole 6 is formed in the insulating layer 3 and the conducive layer 4. The via hole has a bottom in the metallic substrate 2, and has a wall surface in the insulating layer 3 and in the conductive layer 4. The through hole 6 extends through the insulating layer 3, the conductive layer 4, and the metallic substrate 2. Conductive paste 7 fills the bottomed via hole or the through hole 6 to electrically connect the metallic substrate 2 and the conductive layer 4 with each other. The printed wiring board 1 is subjected to a process in which current is applied to the interface between the metallic substrate 2 and the conductive paste 7.

摘要翻译： 印刷电路板1包括金属基板2，设置在金属基板2的表面上的绝缘层3和形成在绝缘层3的表面上的导电层4.导电层4电连接到金属 基板2.在绝缘层3和导电层4中形成有底的通孔或通孔6.通孔在金属基板2中具有底部，并且在绝缘层3中具有壁表面 通孔6延伸穿过绝缘层3，导电层4和金属基底2.导电浆料7填充有底的通孔或通孔6，以将金属基底2和导电层 4与彼此。 对印刷布线板1进行电流施加到金属基板2和导电浆料7之间的界面的处理。

公开(公告)号：US08309853B2

公开(公告)日：2012-11-13

申请号：US12526917

申请日：2008-02-15

申请人： Yoshio Oka ,  Takashi Kasuga ,  Jinjoo Park ,  Kouki Nakama

发明人： Yoshio Oka ,  Takashi Kasuga ,  Jinjoo Park ,  Kouki Nakama

IPC分类号： H05K1/00

CPC分类号： H05K3/4685 ,  H05K1/0393 ,  H05K1/095 ,  H05K1/118 ,  H05K3/281 ,  H05K3/4069 ,  H05K3/4664 ,  H05K2201/0394 ,  H05K2201/10363 ,  H05K2203/1581

摘要： A flexible printed wiring board includes a substrate, conductor wirings, a coverlay film, a jumper wiring, and through holes. The conductor wirings are disposed on a first surface of the substrate. The coverlay film covers at least part of the conductor wirings. The jumper wiring electrically connects the conductor wirings to each other. The through holes are formed in the substrate and respectively open to the surfaces of the conductor wirings. The jumper wiring is composed of a hardened material of a conductive paste and is formed so that a second surface of the substrate is continuous with respective surfaces of the conductor wirings to which the through holes open.

摘要翻译： 柔性印刷电路板包括基板，导体布线，覆盖膜，跳线布线和通孔。 导体布线设置在基板的第一表面上。 覆盖膜覆盖导体布线的至少一部分。 跳线将导体布线彼此电连接。 通孔形成在基板中并分别向导体配线的表面开口。 跳线布线由导电浆料的硬化材料构成，并且形成为使得基板的第二表面与通孔打开的导体布线的各个表面连续。

公开(公告)号：US20100116525A1

公开(公告)日：2010-05-13

申请号：US12526917

申请日：2008-02-15

申请人： Yoshio Oka ,  Takashi Kasuga ,  Jinjoo Park ,  Kouki Nakama

发明人： Yoshio Oka ,  Takashi Kasuga ,  Jinjoo Park ,  Kouki Nakama

IPC分类号： H05K1/02

CPC分类号： H05K3/4685 ,  H05K1/0393 ,  H05K1/095 ,  H05K1/118 ,  H05K3/281 ,  H05K3/4069 ,  H05K3/4664 ,  H05K2201/0394 ,  H05K2201/10363 ,  H05K2203/1581

摘要： A flexible printed wiring board includes a substrate, conductor wirings, a coverlay film, a jumper wiring, and through holes. The conductor wirings are disposed on a first surface of the substrate. The coverlay film covers at least part of the conductor wirings. The jumper wiring electrically connects the conductor wirings to each other. The through holes are formed in the substrate and respectively open to the surfaces of the conductor wirings. The jumper wiring is composed of a hardened material of a conductive paste and is formed so that a second surface of the substrate is continuous with respective surfaces of the conductor wirings which the through holes open.

摘要翻译： 柔性印刷电路板包括基板，导体布线，覆盖膜，跳线布线和通孔。 导体布线设置在基板的第一表面上。 覆盖膜覆盖导体布线的至少一部分。 跳线将导体布线彼此电连接。 通孔形成在基板中并分别向导体配线的表面开口。 跳线布线由导电膏的硬化材料构成，并且形成为使得基板的第二表面与通孔打开的导体布线的各个表面连续。

公开(公告)号：US20100044094A1

公开(公告)日：2010-02-25

申请号：US12518398

申请日：2008-01-16

申请人： Yoshio Oka ,  Jinjoo Park ,  Kazuyuki Maeda ,  Narito Yagi ,  Tetsuya Shimomura ,  Junichiro Nishikawa

发明人： Yoshio Oka ,  Jinjoo Park ,  Kazuyuki Maeda ,  Narito Yagi ,  Tetsuya Shimomura ,  Junichiro Nishikawa

IPC分类号： H05K1/11 ,  H05K3/10

CPC分类号： H05K3/44 ,  H01B1/22 ,  H05K1/056 ,  H05K1/097 ,  H05K3/4069 ,  H05K2201/09554 ,  H05K2203/0315 ,  H05K2203/105 ,  H05K2203/1136 ,  Y10T29/49128 ,  Y10T29/49165

摘要： The printed wiring board 1 includes the metallic substrate 2, the insulating layer 3 provided on the surface of the metallic substrate 2, and the conductive layer 4 formed on the surface of the insulating layer 3. The conductive layer 4 is electrically connected to the metallic substrate 2. A bottomed via hole or a through hole 6 is formed in the insulating layer 3 and the conducive layer 4. The via hole has a bottom in the metallic substrate 2, and has a wall surface in the insulating layer 3 and in the conductive layer 4. The through hole 6 extends through the insulating layer 3, the conductive layer 4, and the metallic substrate 2. Conductive paste 7 fills the bottomed via hole or the through hole 6 to electrically connect the metallic substrate 2 and the conductive layer 4 with each other. The printed wiring board 1 is subjected to a process in which current is applied to the interface between the metallic substrate 2 and the conductive paste 7.

摘要翻译： 印刷电路板1包括金属基板2，设置在金属基板2的表面上的绝缘层3和形成在绝缘层3的表面上的导电层4.导电层4电连接到金属 基板2.在绝缘层3和导电层4中形成有底的通孔或通孔6.通孔在金属基板2中具有底部，并且在绝缘层3中具有壁表面 通孔6延伸穿过绝缘层3，导电层4和金属基底2.导电浆料7填充有底的通孔或通孔6，以将金属基底2和导电层 4与彼此。 对印刷布线板1进行电流施加到金属基板2和导电浆料7之间的界面的处理。