Substrate transport robot, substrate transport system, and substrate transport method

    公开(公告)号:US11031269B2

    公开(公告)日:2021-06-08

    申请号:US16548041

    申请日:2019-08-22

    IPC分类号: H01L21/67 H01L21/677

    摘要: A substrate transport robot includes: a base installed inside a transport chamber; an arm; a first hand and a second hand rotatable about a vertical hand axis and configured to support a substrate; and a controller. The controller performs: a first transfer process of causing the first hand to enter from the transport chamber into a storage chamber, and transferring the substrate between the first hand and a placing portion in the storage chamber; an exit process of causing the first hand to exit the storage chamber into the transport chamber; and a second transfer process of causing the second hand to enter from the transport chamber into the storage chamber. In the exit process, the hand axis moves away from a center line of an opening, such that the hand axis is farther from the center line than a reference position of the first hand is.

    METHOD OF CORRECTING POSITION OF ROBOT AND ROBOT

    公开(公告)号:US20200206934A1

    公开(公告)日:2020-07-02

    申请号:US16234339

    申请日:2018-12-27

    IPC分类号: B25J9/16

    摘要: A method of correcting a position of a robot includes: a correction step of rotating an arm around a first axis to detect a rotation angle around the first axis when a target blocks detection light, and locating the first axis, a third axis, and the target on an identical straight line by rotating the arm and/or a hand around the first axis, a second axis, and/or the third axis based on a detection result; and a correction amount arithmetic step of obtaining rotation angle correction amounts of the second axis and the third axis based on the rotation angle of each rotation axis acquired after the correction step in a first posture.

    ROBOT AND METHOD OF ADJUSTING ORIGINAL POSITION OF ROBOT

    公开(公告)号:US20200070349A1

    公开(公告)日:2020-03-05

    申请号:US16119634

    申请日:2018-08-31

    IPC分类号: B25J9/16

    摘要: Provided is a robot which automatically adjusts an original position without requiring attachment and detachment of a jig or a sensor dedicated to adjustment of the original position. The robot includes a robot arm having a plurality of links connected via a joint, an end effector coupled to a distal end of the robot arm via a wrist joint, an imaging device attached to the end effector or the robot arm so that a whole of the end effector and the robot arm in the original posture is included in the imaging range, and a controller that controls operations of the robot arm and the imaging device. The controller sets rotational positions of a joint and a wrist joint as the original position, causes the imaging device to capture an image to acquire the captured image, obtains a deviation of a current posture of the end effector and the robot arm from the original posture by comparing the original posture reference image with the captured image, and determines presence or absence of displacement of the original position based on the deviation.

    SUBSTRATE CONVEYING ROBOT AND SUBSTRATE PROCESSING SYSTEM
    7.
    发明申请
    SUBSTRATE CONVEYING ROBOT AND SUBSTRATE PROCESSING SYSTEM 审中-公开
    基板输送机器人和基板处理系统

    公开(公告)号:US20170062264A1

    公开(公告)日:2017-03-02

    申请号:US14840593

    申请日:2015-08-31

    IPC分类号: H01L21/687 B25J15/00 B25J9/04

    摘要: A control unit of a substrate conveying robot makes a robot arm and a substrate holding device execute a blade member advancing operation, a substrate receiving operation, and a substrate placing operation. The substrate holding device is configured to be capable of being switched between a first working state that a pair of blade members are arranged in the vertical direction and a second working state that a pair of blade members are arranged in a position out of the vertical direction and a single blade member can be advanced into a substrate placing structure.

    摘要翻译: 基板输送机械手的控制单元使机器人臂和基板保持装置执行叶片构件前进操作,基板接收操作和基板放置操作。 基板保持装置被构造成能够在一对叶片构件沿垂直方向布置的第一工作状态和一对叶片构件布置在垂直方向外的位置的第二工作状态之间切换 并且单个刀片构件可以前进到衬底放置结构中。

    Method of wafer system interlock for the protection of equipment and product in semiconductor processing bridge tool
    8.
    发明授权
    Method of wafer system interlock for the protection of equipment and product in semiconductor processing bridge tool 有权
    晶圆系统联锁方法,用于保护半导体加工桥梁工具中的设备和产品

    公开(公告)号:US09002504B2

    公开(公告)日:2015-04-07

    申请号:US13797460

    申请日:2013-03-12

    摘要: The present disclosure is directed to methods and systems for evaluating wafer size handling capabilities of wafer handling robots and wafer stations in a wafer processing environment. In one embodiment, a method is provided in which size parameters for each of one or more wafer stations and one or more robot hands of a wafer handling robot are set based on user input. A user command identifying a desired robot hand and a desired wafer station is received. A first size parameter of the desired robot hand is compared to a second size parameter of the desired wafer station. If the first size parameter is equal to the second size parameter, or if the second size parameter is an all-size parameter, the user command is executed. If the first size parameter is not equal to the second size parameter, an error is generated.

    摘要翻译: 本公开涉及用于在晶片处理环境中评估晶片处理机器人和晶圆台的晶片尺寸处理能力的方法和系统。 在一个实施例中,提供了一种方法,其中基于用户输入来设置晶片处理机器人的一个或多个晶片台和一个或多个机器人手中的每一个的尺寸参数。 接收识别所需机器人手和期望的晶片台的用户命令。 将期望的机器人手的第一尺寸参数与期望的晶片台的第二尺寸参数进行比较。 如果第一个尺寸参数等于第二个尺寸参数,或者如果第二个尺寸参数是全尺寸参数,则执行用户命令。 如果第一个尺寸参数不等于第二个尺寸参数,则会生成错误。

    ROBOT SYSTEM AND OFFSET ACQUISITION METHOD

    公开(公告)号:US20220080604A1

    公开(公告)日:2022-03-17

    申请号:US17024543

    申请日:2020-09-17

    摘要: A robot system according to an embodiment may include a robot, a wafer jig that is held by the robot, a positioning base, a positional displacement detection device, a control part, and an offset acquisition part for acquiring an offset that occurs between a command position for the robot and an actual position. The positioning base includes contacting members. The wafer jig has a tapered surface. The tapered surface guides the wafer jig so that a center of the wafer jig approaches a predetermined position as a position where the taped surface contacts the contacting members is relatively higher. The robot places the wafer jig on the positioning base, then holds and conveys the wafer jig to the positional displacement detection device. The offset acquisition part acquires the offset based on a result in which the positional displacement detection device detects a positional displacement of the conveyed wafer jig.