Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure
    1.
    发明授权
    Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure 有权
    保持夹具,半导体晶片研磨方法,半导体晶片保护结构和半导体晶片研磨方法以及使用该结构的半导体芯片制造方法

    公开(公告)号:US07875501B2

    公开(公告)日:2011-01-25

    申请号:US12282984

    申请日:2007-03-09

    IPC分类号: H01L21/44 H01L21/48 H01L21/50

    摘要: A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.

    摘要翻译: 半导体晶片W的背面研磨机10包括:设置在安装件11的工作面上的工作台13; 通过表13上的检查台15布置多个保持夹具20; 用于进行通过保持夹具20保持的半导体晶片W的后侧的研磨处理的研磨机30; 以及用于接地半导体晶片W的洗涤装置40.每个保持夹具20由在基板21的表面上凹陷的凹部22构成,多个支撑突起23投影地排列在凹部22的底面上, 接触膜24,覆盖凹部22,由多个支撑突起23支撑,用于可拆卸地保持半导体晶片W与其紧密接触; 以及用于将空气从由接触膜24覆盖的凹部22引导到外部的排气路径25。

    Multicore cable and a method of manufacturing thereof
    2.
    发明授权
    Multicore cable and a method of manufacturing thereof 失效
    多芯电缆及其制造方法

    公开(公告)号:US06310296B1

    公开(公告)日:2001-10-30

    申请号:US09442457

    申请日:1999-11-18

    IPC分类号: H01B708

    摘要: A multicore cable includes a plurality of cables in parallel and is formed by fusion-welding the plurality of cables with a resin jacket. Each of the plurality of cables is formed by winding a shield around a signaling core wire, which is covered with an insulating material, and a grounding core wire. The resin jacket and the shield are stripped so that a stair portion is formed. The stair portion is coated with an electrically conductive adhesive. A vibration is exerted on the grounding core wire, thereby connecting the shield with the grounding core wire with the electrically conductive adhesive. Eventually, the shield and the grounding core wire are bonded with the electrically conductive adhesive. This allows an electrical connection between the shield and the grounding core wire to be maintained in a desirable condition, thus making it possible to suppress a characteristic impedance variation of the signaling core wire caused by an external factor.

    摘要翻译: 多芯电缆包括并联的多根电缆,并且通过用树脂护套将多根电缆熔接而形成。 多个电缆中的每一个通过围绕由绝缘材料覆盖的信号芯线和接地芯线缠绕屏蔽来形成。 剥离树脂护套和护罩,形成台阶部。 楼梯部分涂有导电粘合剂。 在接地芯线上施加振动,从而将屏蔽与接地芯线与导电粘合剂连接。 最后,屏蔽层和接地芯线与导电粘合剂结合。 这样就可以将屏蔽层和接地芯线之间的电连接保持在期望的状态,从而可以抑制由外部因素引起的信号芯线的特性阻抗变化。

    Arrangement of pulley working fluid passage in a belt-type continuously
variable transmission
    3.
    发明授权
    Arrangement of pulley working fluid passage in a belt-type continuously variable transmission 失效
    皮带轮工作流体通道在带式无级变速器中的布置

    公开(公告)号:US5941787A

    公开(公告)日:1999-08-24

    申请号:US6383

    申请日:1998-01-13

    CPC分类号: F16H63/065 Y10T477/624

    摘要: In a pulley working fluid (oil) passage arrangement for a belt-type continuously variable transmission having a V belt wound about a letter V-shaped groove formed with mutually opposing oblique surfaces of movable and stationary sheaves and a working fluid pressure cylinder chamber to which a working fluid pressure is supplied so as to move the movable sheave toward or away from the stationary sheave, thus a gear shift being varied, a first working fluid passage communicated with an axle chamber working fluid passage is extended in an axial direction of the axle member at an opposing surface thereof against the axle member and the movable sheave and a second working fluid passage having one end communicated with the first working fluid passage and the other end opened to a working fluid pressure cylinder chamber is extended along a radial direction of the axle member.

    摘要翻译: 在用于带式无级变速器的带轮工作流体(油)通道装置中,所述带式无级变速器具有卷绕在形成有可移动和固定滑轮的相互相对的倾斜表面的字母V形槽的V形带和工作流体压力缸室, 提供工作流体压力以使可动滑轮朝向或远离固定滑轮移动,因此变速是变化的,与轴室工作流体通道连通的第一工作流体通道在轴的轴向方向上延伸 在其相对表面处的构件抵靠所述车轴构件和所述可动槽轮;以及第二工作流体通道,其具有与所述第一工作流体通道连通的一端,并且向工作流体压力缸室敞开的另一端沿着所述第一工作流体通道的径向方向延伸 轴构件。

    Fixing jig and method of processing work
    4.
    发明授权
    Fixing jig and method of processing work 有权
    固定夹具及加工工艺方法

    公开(公告)号:US08465011B2

    公开(公告)日:2013-06-18

    申请号:US12452647

    申请日:2008-07-31

    IPC分类号: H01L21/683 B25B11/00

    摘要: A fixing jig is made up of a plate-like jig main body (2) and a close contact layer (3) which detachably holds a work (W) in close contact therewith. The jig main body has: on one surface thereof a plurality of supporting projections (4) to support the close contact layer; and also has, along an outer peripheral portion of said one surface, a side wall (5) which is of substantially the same height as the supporting projections. The close contact layer is adhered to an end surface of the side wall to thereby define a partitioned space (6) between the close contact layer and the jig main body. By sucking the air within the partitioned space via a ventilation hole (7) formed in the jig main body, the close contact layer is deformed. The work is thus surely supported and fixed also in performing a processing in which a force is applied to the work. The jig main body (2) has formed therein a suction hole (8) which opens into an outer surface on the side of the close contact layer (3) but which is not communicated with the partitioned space (6). A through hole (9) in communication with the suction hole (8) is formed in the close contact layer (3). A suction force is applied to the work W by evacuation of the suction hole (8).

    摘要翻译: 固定夹具由能够可拆卸地保持工件(W)紧密接触的板状夹具主体(2)和紧密接触层(3)构成。 夹具主体在其一个表面上具有多个支撑突起(4)以支撑紧密接触层; 并且沿着所述一个表面的外周部分具有与所述支撑突起基本相同的高度的侧壁(5)。 紧密接触层粘附到侧壁的端面,从而在紧密接触层和夹具主体之间限定分隔空间(6)。 通过在夹具主体中形成的通气孔(7)吸入分隔空间内的空气,使紧密接触层发生变形。 因此,在对作业施加力的处理中,确实地支撑和固定工件。 夹具主体(2)上形成有向密闭接触层(3)侧的外表面开口但不与分隔空间(6)连通的吸入孔(8)。 在紧密接触层(3)中形成有与抽吸孔(8)连通的通孔(9)。 通过抽吸吸入孔(8)将吸力施加到工件W。

    HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAFER PROTECTING STRUCTURE AND SEMICONDUCTOR WAFER GRINDING METHOD AND SEMICONDUCTOR CHIP FABRICATION METHOD USING THE STRUCTURE
    6.
    发明申请
    HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAFER PROTECTING STRUCTURE AND SEMICONDUCTOR WAFER GRINDING METHOD AND SEMICONDUCTOR CHIP FABRICATION METHOD USING THE STRUCTURE 有权
    控制晶圆,半导体晶粒磨削方法,半导体晶体保护结构和半导体晶粒研磨方法及半导体芯片制造方法

    公开(公告)号:US20090081852A1

    公开(公告)日:2009-03-26

    申请号:US12282984

    申请日:2007-03-09

    IPC分类号: H01L21/304 B24B41/06

    摘要: A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.

    摘要翻译: 半导体晶片W的背面研磨机10包括:设置在安装件11的工作面上的工作台13; 通过表13上的检查台15布置多个保持夹具20; 用于进行通过保持夹具20保持的半导体晶片W的后侧的研磨处理的研磨机30; 以及用于接地半导体晶片W的洗涤装置40.每个保持夹具20由在基板21的表面上凹陷的凹部22构成,多个支撑突起23投影地排列在凹部22的底面上, 接触膜24,覆盖凹部22,由多个支撑突起23支撑,用于可拆卸地保持半导体晶片W与其紧密接触; 以及用于将空气从由接触膜24覆盖的凹部22引导到外部的排气路径25。

    Arrangement of pulley cylinder in a belt-type continuously variable
transmission
    7.
    发明授权
    Arrangement of pulley cylinder in a belt-type continuously variable transmission 失效
    皮带轮在带式无级变速器中的布置

    公开(公告)号:US6089999A

    公开(公告)日:2000-07-18

    申请号:US10577

    申请日:1998-01-22

    CPC分类号: F16H55/56 F16H63/065

    摘要: In a pulley arrangement of a belt-type continuously variable transmission, a ring member (6) integrated with a first cylinder member (3) is coupled to a second cylinder member (5) using splines (6d and 5c) to limit mutual movements of the first and second cylinder members and using snap ring (7) to limit the axial displacement therebetween in peripheral directions of the respective first and second cylinder members. The first cylinder member is slidably contacted on an outer peripheral surface of a hollow cylindrical portion of a second conical pulley component. The second cylinder member is fixed onto an outer peripheral surface of a shaft portion of a first conical pulley component. In addition, a another stopper is provided between an outer peripheral end of the hollow cylindrical portion (56d) and an inner peripheral surface of the second piston member (8) for limiting mutual movements of the second piston member and the hollow cylindrical portion in the peripheral directions of the second piston member and the hollow cylindrical portion.

    摘要翻译: 在带式无级变速器的滑轮装置中,与第一气缸构件(3)成一体的环构件(6)使用花键(6d和5c)联接到第二气缸构件(5),以限制相互运动 第一和第二气缸构件,并且使用止动环(7)限制其在相应的第一和第二气缸构件的圆周方向上的轴向位移。 第一圆筒构件在第二圆锥形滑轮组件的中空圆柱形部分的外周表面上可滑动地接触。 第二圆筒部件被固定在第一锥形滑轮部件的轴部的外周面上。 此外,在中空圆筒部(56d)的外周端与第二活塞部件(8)的内周面之间设置另一个止动件,用于限制第二活塞部件和中空圆筒部的相互移动 第二活塞部件和中空圆筒部的圆周方向。

    Method and apparatusa for determining supply sequence of products ot be
processed to production line
    8.
    发明授权
    Method and apparatusa for determining supply sequence of products ot be processed to production line 失效
    用于确定待处理生产线的产品供应顺序的方法和装置

    公开(公告)号:US5506783A

    公开(公告)日:1996-04-09

    申请号:US268375

    申请日:1994-06-29

    CPC分类号: G06Q10/04

    摘要: A method of determining supply sequence of products to be processed to an N-step flow shop type production line, where N is an integer N greater than or equal to 2, is disclosed. To optimize the production time of all the products in the N-step flow shop type production line with high precision, the supply sequence of products to be processed to the N-step flow shop type production line is determined by virtually dividing the N steps to 2 virtual steps on the basis of a total number of necessary man-hour of products to be processed, sequencing the supply of the products to be processed in one of the virtual steps to a first step of the N steps in the order of smallness of the required man-hours for the product, storing the product to be processed in the other virtual step in a stack memory as products for which a new supply sequence is to be determined and repeating the supply sequence determining processing recurrently as long as N is greater than or equal to 2 and the stack memory contains stored virtual steps.

    摘要翻译: 公开了一种确定要处理的产品的供应顺序的方法,其N为大于或等于2的整数N的N步流动车型生产线。 为了优化N级流程车间型生产线中所有产品的生产时间,精确度高,N级流程车间型生产线的加工产品供应顺序通过将N步骤实际划分为 基于要处理的产品的必要工时的总数的2个虚拟步骤,将要在其中一个虚拟步骤中处理的产品的供应排序到N个步骤的第一步以小的顺序 产品所需的工时,将要处理的产品存储在堆叠存储器中的另一个虚拟步骤中,作为要确定新的供应顺序的产品,并且只要N更大,则重复供应顺序确定处理 大于或等于2,堆栈内存包含存储的虚拟步骤。

    Method for terminating cables and apparatus therefor
    9.
    发明授权
    Method for terminating cables and apparatus therefor 失效
    终端电缆及其设备的方法

    公开(公告)号:US5142121A

    公开(公告)日:1992-08-25

    申请号:US585404

    申请日:1990-09-20

    IPC分类号: H02G1/12

    CPC分类号: H02G1/1256 H02G1/128

    摘要: According to the method for terminating a cable and the apparatus used therefor of the present invention, first the thermosetting resin layer of the cable is heat-cured, for example, by laser beam. The heat-cured thermosetting resin layer is lowered in stress and strain at rupture and hence can be easily cut and then this thermosetting resin layer is cut and peeled off.

    摘要翻译: 根据本发明的端接电缆的方法及其使用的装置,首先将电缆的热固性树脂层例如通过激光束热固化。 热固性热固性树脂层的应力和断裂应变降低,因此可以容易地切断,然后将该热固性树脂层切断并剥离。

    Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure
    10.
    发明授权
    Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure 有权
    保持夹具,半导体晶片研磨方法,半导体晶片保护结构和半导体晶片研磨方法以及使用该结构的半导体芯片制造方法

    公开(公告)号:US08212345B2

    公开(公告)日:2012-07-03

    申请号:US12945078

    申请日:2010-11-12

    IPC分类号: H01L23/02

    摘要: A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.

    摘要翻译: 半导体晶片W的背面研磨机10包括:设置在安装件11的工作面上的工作台13; 通过表13上的检查台15布置多个保持夹具20; 用于进行通过保持夹具20保持的半导体晶片W的后侧的研磨处理的研磨机30; 以及用于接地半导体晶片W的洗涤装置40.每个保持夹具20由在基板21的表面上凹陷的凹部22构成,多个支撑突起23投影地排列在凹部22的底面上, 接触膜24,覆盖凹部22,由多个支撑突起23支撑,用于可拆卸地保持半导体晶片W与其紧密接触; 以及用于将空气从由接触膜24覆盖的凹部22引导到外部的排气路径25。