摘要:
A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.
摘要:
A multicore cable includes a plurality of cables in parallel and is formed by fusion-welding the plurality of cables with a resin jacket. Each of the plurality of cables is formed by winding a shield around a signaling core wire, which is covered with an insulating material, and a grounding core wire. The resin jacket and the shield are stripped so that a stair portion is formed. The stair portion is coated with an electrically conductive adhesive. A vibration is exerted on the grounding core wire, thereby connecting the shield with the grounding core wire with the electrically conductive adhesive. Eventually, the shield and the grounding core wire are bonded with the electrically conductive adhesive. This allows an electrical connection between the shield and the grounding core wire to be maintained in a desirable condition, thus making it possible to suppress a characteristic impedance variation of the signaling core wire caused by an external factor.
摘要:
In a pulley working fluid (oil) passage arrangement for a belt-type continuously variable transmission having a V belt wound about a letter V-shaped groove formed with mutually opposing oblique surfaces of movable and stationary sheaves and a working fluid pressure cylinder chamber to which a working fluid pressure is supplied so as to move the movable sheave toward or away from the stationary sheave, thus a gear shift being varied, a first working fluid passage communicated with an axle chamber working fluid passage is extended in an axial direction of the axle member at an opposing surface thereof against the axle member and the movable sheave and a second working fluid passage having one end communicated with the first working fluid passage and the other end opened to a working fluid pressure cylinder chamber is extended along a radial direction of the axle member.
摘要:
A fixing jig is made up of a plate-like jig main body (2) and a close contact layer (3) which detachably holds a work (W) in close contact therewith. The jig main body has: on one surface thereof a plurality of supporting projections (4) to support the close contact layer; and also has, along an outer peripheral portion of said one surface, a side wall (5) which is of substantially the same height as the supporting projections. The close contact layer is adhered to an end surface of the side wall to thereby define a partitioned space (6) between the close contact layer and the jig main body. By sucking the air within the partitioned space via a ventilation hole (7) formed in the jig main body, the close contact layer is deformed. The work is thus surely supported and fixed also in performing a processing in which a force is applied to the work. The jig main body (2) has formed therein a suction hole (8) which opens into an outer surface on the side of the close contact layer (3) but which is not communicated with the partitioned space (6). A through hole (9) in communication with the suction hole (8) is formed in the close contact layer (3). A suction force is applied to the work W by evacuation of the suction hole (8).
摘要:
A double floor structure capable of being adapted to the conditions of construction and the needs of users at low cost. A double floor structure (K) provided with support legs (1) which are provided on a lower floor and rows of beams which form an upper floor. The support legs (1) are each provided with an upper member (14) which supports a beam from the lower side, an intermediate member (13) which supports the upper member (14) from the lower side, and a lower member (12) which supports the intermediate member (13) from the lower side. The upper member (14), the intermediate member (13), and the lower member (12) consist of metallic, extruded shape material and are disposed in such a manner that the direction of the extrusion is aligned with the top-bottom direction.
摘要:
A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.
摘要:
In a pulley arrangement of a belt-type continuously variable transmission, a ring member (6) integrated with a first cylinder member (3) is coupled to a second cylinder member (5) using splines (6d and 5c) to limit mutual movements of the first and second cylinder members and using snap ring (7) to limit the axial displacement therebetween in peripheral directions of the respective first and second cylinder members. The first cylinder member is slidably contacted on an outer peripheral surface of a hollow cylindrical portion of a second conical pulley component. The second cylinder member is fixed onto an outer peripheral surface of a shaft portion of a first conical pulley component. In addition, a another stopper is provided between an outer peripheral end of the hollow cylindrical portion (56d) and an inner peripheral surface of the second piston member (8) for limiting mutual movements of the second piston member and the hollow cylindrical portion in the peripheral directions of the second piston member and the hollow cylindrical portion.
摘要:
A method of determining supply sequence of products to be processed to an N-step flow shop type production line, where N is an integer N greater than or equal to 2, is disclosed. To optimize the production time of all the products in the N-step flow shop type production line with high precision, the supply sequence of products to be processed to the N-step flow shop type production line is determined by virtually dividing the N steps to 2 virtual steps on the basis of a total number of necessary man-hour of products to be processed, sequencing the supply of the products to be processed in one of the virtual steps to a first step of the N steps in the order of smallness of the required man-hours for the product, storing the product to be processed in the other virtual step in a stack memory as products for which a new supply sequence is to be determined and repeating the supply sequence determining processing recurrently as long as N is greater than or equal to 2 and the stack memory contains stored virtual steps.
摘要:
According to the method for terminating a cable and the apparatus used therefor of the present invention, first the thermosetting resin layer of the cable is heat-cured, for example, by laser beam. The heat-cured thermosetting resin layer is lowered in stress and strain at rupture and hence can be easily cut and then this thermosetting resin layer is cut and peeled off.
摘要:
A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.