摘要:
In some embodiments of the present invention, the buried silicon oxide technology is employed in the fabrication of fluid channels, particularly nanochannels. For example, a fluid channel can be made in a buried silicon oxide layer by etching the buried oxide layer with a method that selectively removes silicon oxide but not silicon. Thus, one dimension of the resulting fluid channel is limited by the thickness of the buried oxide layer. It is possible to manufacture a very thin buried oxide layer with great precision, thus a nanochannel can be fabricated in a controlled manner. Moreover, in addition to buried oxide, any pairs of substances with a high etch ratio with respect to each other can be used in the same way. Further provided are the fluid channels, apparatuses, devices and systems comprising the fluid channels, and uses thereof.
摘要:
In some embodiments of the present invention, the buried silicon oxide technology is employed in the fabrication of fluid channels, particularly nanochannels. For example, a fluid channel can be made in a buried silicon oxide layer by etching the buried oxide layer with a method that selectively removes silicon oxide but not silicon. Thus, one dimension of the resulting fluid channel is limited by the thickness of the buried oxide layer. It is possible to manufacture a very thin buried oxide layer with great precision, thus a nanochannel can be fabricated in a controlled manner. Moreover, in addition to buried oxide, any pairs of substances with a high etch ratio with respect to each other can be used in the same way. Further provided are the fluid channels, apparatuses, devices and systems comprising the fluid channels, and uses thereof.
摘要:
A method and apparatus for mounting an optical sensor in an optical instrument. The optical sensor is attached to a rigid substrate. The substrate has two locator holes, with the sensor mounted between the holes. Rigid locator pins attached to the housing of the instrument protrude into the locator holes. A spring pushing against the substrate forces the locator holes against corresponding locator pins, aligning the substrate within a plane. In a first embodiment, the holes are positioned so that the optical sensor is rigidly held at its midpoint, minimizing dimensional deviations along the length of the sensor with temperature change. The sensor assembly is easily removable and the mounting apparatus does not mechanically stress the substrate or the sensor with temperature changes. The mounting apparatus is easily manufactured, allows precise alignment, and is inexpensive.