公开(公告)号：US09644255B2

公开(公告)日：2017-05-09

申请号：US14114060

申请日：2012-04-12

申请人： Yuichi Furukawa ,  Masahiro Okumiya ,  Yoshiki Tsunekawa ,  Nao Kumemoto ,  Fumio Kawahara ,  Katsuhiro Takami

发明人： Yuichi Furukawa ,  Masahiro Okumiya ,  Yoshiki Tsunekawa ,  Nao Kumemoto ,  Fumio Kawahara ,  Katsuhiro Takami

IPC分类号： C23C8/26 ,  C23C8/80 ,  C21D1/68 ,  C21D1/72 ,  C21D1/74 ,  C21D7/06 ,  C01B31/02 ,  C23C8/24 ,  B82Y30/00 ,  B82Y40/00

CPC分类号： C23C8/80 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/15 ,  C21D1/68 ,  C21D1/72 ,  C21D1/74 ,  C21D7/06 ,  C23C8/24 ,  C23C8/26

摘要： A surface treatment method for a metal material is provided which includes applying diluted sulfuric acid to a surface of the metal material that is composed primarily of iron, performing a heat treatment on the metal material in the presence of at least one of CO, CO2 and organic gas under nitriding conditions under which a nitrided layer is formed in a superficial layer of the metal material after the application of the diluted sulfuric acid to form a carbon film which includes at least one of carbon nanocoils, carbon nanotubes and carbon nanofilaments on a surface of the nitrided layer of the metal material.

公开(公告)号：US5840086A

公开(公告)日：1998-11-24

申请号：US627608

申请日：1996-04-04

申请人： Katsuhiro Takami ,  Nobutoshi Kodama

发明人： Katsuhiro Takami ,  Nobutoshi Kodama

IPC分类号： H01G9/00 ,  H01G9/15 ,  G01R31/26 ,  H01L21/66

CPC分类号： H01G9/15 ,  Y10T29/417

摘要： An improved method for manufacturing a capacitor packaged by synthetic resin after welding an anode bar of a capacitor element with a lead terminal of a lead frame and electrically connecting a cathode of the capacitor element with another lead terminal of the lead frame, wherein the capacitor is assembled after measuring an inclination of the capacitor element in the horizontal/vertical direction after welding the anode bar of the capacitor element with the lead terminal and correcting the inclination of the capacitor element by pressing a portion of the lead terminal to which the anode bar is welded corresponding to the direction of the inclination when the inclination exceeds a predetermined value. As a result, no stress is applied to the capacitor element itself, so that no element is rendered defective or no element characteristic is damaged. In the same time, no capacitor element part will protrude out of the package or no thin package portion is created due to the inclination of the capacitor element, so that the reliability is kept.

摘要翻译： 一种用于制造由合成树脂封装的电容器的改进方法，该电容器在将电容器元件的阳极棒与引线框架的引线端子焊接并将电容器元件的阴极与引线框架的另一引线端子电连接之后，其中电容器 在电容器元件的阳极棒与引线端子焊接之后，在测量电容器元件在水平/垂直方向上的倾斜度之后进行组装，并且通过按压阳极棒的引线端子的一部分来校正电容器元件的倾斜度 当倾斜度超过预定值时，与倾斜方向相对应地焊接。 结果，电容器元件本身没有施加应力，使得没有元件被损坏或元件特性被损坏。 同时，由于电容器元件的倾斜，电容器元件部分不会突出到封装之外，也不会产生薄的封装部分，从而保持可靠性。

公开(公告)号：US20140048182A1

公开(公告)日：2014-02-20

申请号：US14114060

申请日：2012-04-12

申请人： Yuichi Furukawa ,  Masahiro Okumiya ,  Yoshiki Tsunekawa ,  Nao Kumemoto ,  Fumio Kawahara ,  Katsuhiro Takami

发明人： Yuichi Furukawa ,  Masahiro Okumiya ,  Yoshiki Tsunekawa ,  Nao Kumemoto ,  Fumio Kawahara ,  Katsuhiro Takami

IPC分类号： C23C8/80 ,  C23C8/24

CPC分类号： C23C8/80 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/15 ,  C21D1/68 ,  C21D1/72 ,  C21D1/74 ,  C21D7/06 ,  C23C8/24 ,  C23C8/26

摘要： A surface treatment method for a metal material is provided which includes applying diluted sulfuric acid to a surface of the metal material that is composed primarily of iron, performing a heat treatment on the metal material in the presence of at least one of CO, CO2 and organic gas under nitriding conditions under which a nitrided layer is formed in a superficial layer of the metal material after the application of the diluted sulfuric acid to form a carbon film which includes at least one of carbon nanocoils, carbon nanotubes and carbon nanofilaments on a surface of the nitrided layer of the metal material.

摘要翻译： 提供了一种用于金属材料的表面处理方法，其包括将稀硫酸施加到主要由铁组成的金属材料的表面，在CO，CO 2和CO 2中的至少一种的存在下对金属材料进行热处理， 在氮化条件下的有机气体，在施加稀硫酸之后，在金属材料的表层形成氮化层，形成碳膜，所述碳膜在表面上包括碳纳米线，碳纳米管和碳纳米丝中的至少一种 的金属材料的氮化层。

公开(公告)号：US10596618B2

公开(公告)日：2020-03-24

申请号：US15684333

申请日：2017-08-23

申请人： Naoaki Sugiura ,  Yuichi Furukawa ,  Mitsuhiro Kobayashi ,  Fumio Kawahara ,  Katsuhiro Takami

发明人： Naoaki Sugiura ,  Yuichi Furukawa ,  Mitsuhiro Kobayashi ,  Fumio Kawahara ,  Katsuhiro Takami

IPC分类号： B21D53/04 ,  B22D17/00 ,  B23P15/26 ,  F28F3/02 ,  F28F13/18 ,  F28F21/06 ,  B05D1/02 ,  B05D3/02 ,  B05D7/14 ,  H05K7/20

摘要： Provided is a method for producing a heat sink that can easily and effectively form a heat radiating film on the surface of a substrate without requiring enormous heat energy for increasing the temperature of the substrate. The method is a method for producing a heat sink having a substrate and a heat radiating film formed on the surface of the substrate, including a first step of casting a substrate by injecting molten metal into a cavity of molding dies; and a second step of applying a heat radiating coating to the substrate through spraying or dropping in the period from when the molding dies are opened after the casting until when the temperature of the substrate that has been cast becomes lower than the deposition temperature that is a temperature necessary to deposit the heat radiating coating on the substrate.

公开(公告)号：US20180056363A1

公开(公告)日：2018-03-01

申请号：US15684333

申请日：2017-08-23

申请人： Naoaki SUGIURA ,  Yuichi FURUKAWA ,  Mitsuhiro KOBAYASHI ,  Fumio KAWAHARA ,  Katsuhiro TAKAMI

发明人： Naoaki SUGIURA ,  Yuichi FURUKAWA ,  Mitsuhiro KOBAYASHI ,  Fumio KAWAHARA ,  Katsuhiro TAKAMI

IPC分类号： B21D53/04 ,  B23P15/26 ,  F28F13/18 ,  F28F21/06 ,  F28F3/02

CPC分类号： B21D53/04 ,  B05D1/02 ,  B05D3/0218 ,  B05D7/14 ,  B05D2202/25 ,  B05D2505/00 ,  B05D2505/50 ,  B22D17/00 ,  B23P15/26 ,  B23P2700/10 ,  F28F3/02 ,  F28F13/18 ,  F28F21/065 ,  H05K7/2039

摘要： Provided is a method for producing a heat sink that can easily and effectively form a heat radiating film on the surface of a substrate without requiring enormous heat energy for increasing the temperature of the substrate. The method is a method for producing a heat sink having a substrate and a heat radiating film formed on the surface of the substrate, including a first step of casting a substrate by injecting molten metal into a cavity of molding dies; and a second step of applying a heat radiating coating to the substrate through spraying or dropping in the period from when the molding dies are opened after the casting until when the temperature of the substrate that has been cast becomes lower than the deposition temperature that is a temperature necessary to deposit the heat radiating coating on the substrate.

公开(公告)号：US4945398A

公开(公告)日：1990-07-31

申请号：US421761

申请日：1989-10-16

申请人： Yoshio Kurita ,  Katsuhiro Takami ,  Kenji Tanaka ,  Yuji Kosumi

发明人： Yoshio Kurita ,  Katsuhiro Takami ,  Kenji Tanaka ,  Yuji Kosumi

IPC分类号： H01L23/48 ,  H01H85/02 ,  H01H85/041 ,  H01L23/58 ,  H01L23/62

CPC分类号： H01H85/0411 ,  H01L23/62 ,  H01H2085/0034 ,  H01H85/0241 ,  H01L2224/48091 ,  H01L2224/4826 ,  H01L2924/181

摘要： An overcurrent preventive diode comprises a diode chip sandwiched between respective bonding ends of first and second leads. The bonding end of the first lead is directly bonded to the diode chip into electrical conduction while being also kept in heat conduction with the chip. The bonding end of the second lead is held in heat conduction with the diode chip via a thin electrical insulating layer. The bonding end of the second lead and the insulating layer are shaped to expose an electrical connecting portion of the chip, thereby enabling the second lead bonding end to be electrically connected to the chip through a fusing wire which is designed to be melt-cut upon passage of a predetermined overcurrent.