公开(公告)号：US20130260650A1

公开(公告)日：2013-10-03

申请号：US13882280

申请日：2011-11-07

申请人： Toshio Shinoda ,  Kayoko Nagahara ,  Yutaka Inoue ,  Shuhei Takahashi ,  Toshihiro Miwa

发明人： Toshio Shinoda ,  Kayoko Nagahara ,  Yutaka Inoue ,  Shuhei Takahashi ,  Toshihiro Miwa

IPC分类号： C09G1/02 ,  B24B31/00

CPC分类号： C09G1/02 ,  B24B31/003 ,  H01L21/02024

摘要： Provided is a polishing composition containing abrasive grains, at least one type of alcohol compound selected from the group consisting of aliphatic alcohols with 2 to 6 carbon atoms and glycol ethers with 3 to 10 carbon atoms, at least one type of basic compound selected from the group consisting of quaternary ammonium salts and alkali metal salts, and water. The average primary particle diameter of the abrasive grains is 5 to 50 nm. The content of the alcohol compound in the polishing composition is 0.01 to 1% by mass. The polishing composition is mainly used in an application of polishing a semiconductor substrate surface.

摘要翻译： 本发明提供一种抛光组合物，其含有磨粒，至少一种选自碳原子数2〜6的脂肪族醇和碳原子数3〜10的二醇醚的醇类化合物，至少一种选自 由季铵盐和碱金属盐组成的组和水。 磨粒的平均一次粒径为5〜50nm。 抛光组合物中醇化合物的含量为0.01〜1质量％。 抛光组合物主要用于研磨半导体衬底表面的应用中。

公开(公告)号：US09090799B2

公开(公告)日：2015-07-28

申请号：US13882280

申请日：2011-11-07

申请人： Toshio Shinoda ,  Kayoko Nagahara ,  Yutaka Inoue ,  Shuhei Takahashi ,  Toshihiro Miwa

发明人： Toshio Shinoda ,  Kayoko Nagahara ,  Yutaka Inoue ,  Shuhei Takahashi ,  Toshihiro Miwa

IPC分类号： B24B1/00 ,  C09G1/02 ,  H01L21/02 ,  B24B31/00

CPC分类号： C09G1/02 ,  B24B31/003 ,  H01L21/02024

摘要： Provided is a polishing composition containing abrasive grains, at least one type of alcohol compound selected from the group consisting of aliphatic alcohols with 2 to 6 carbon atoms and glycol ethers with 3 to 10 carbon atoms, at least one type of basic compound selected from the group consisting of quaternary ammonium salts and alkali metal salts, and water. The average primary particle diameter of the abrasive grains is 5 to 50 nm. The content of the alcohol compound in the polishing composition is 0.01 to 1% by mass. The polishing composition is mainly used in an application of polishing a semiconductor substrate surface.

摘要翻译： 本发明提供一种抛光组合物，其含有磨粒，至少一种选自碳原子数2〜6的脂肪族醇和碳原子数3〜10的二醇醚的醇类化合物，至少一种选自 由季铵盐和碱金属盐组成的组和水。 磨粒的平均一次粒径为5〜50nm。 抛光组合物中醇化合物的含量为0.01〜1质量％。 抛光组合物主要用于研磨半导体衬底表面的应用中。