公开(公告)号：US09028709B2

公开(公告)日：2015-05-12

申请号：US13824778

申请日：2011-09-23

申请人： Kohsuke Tsuchiya ,  Hitoshi Morinaga ,  Noboru Yasufuku ,  Shuhei Takahashi ,  Tomohiro Imao

发明人： Kohsuke Tsuchiya ,  Hitoshi Morinaga ,  Noboru Yasufuku ,  Shuhei Takahashi ,  Tomohiro Imao

IPC分类号： C09K13/00 ,  C11D1/825 ,  C11D11/00 ,  H01L21/02 ,  C09K3/14 ,  C09G1/02 ,  C11D1/72 ,  C11D1/722

CPC分类号： C09K13/00 ,  C09G1/02 ,  C09K3/1463 ,  C11D1/72 ,  C11D1/722 ,  C11D1/825 ,  C11D11/0047 ,  H01L21/02024 ,  H01L21/02052

摘要： A surface treatment composition of the present invention contains a first surfactant, a second surfactant, a basic compound, and water. The surface treatment composition has a pH of 8 or more. The second surfactant has a weight-average molecular weight one-half or less that of the first surfactant. The sum of the content of the first surfactant and the content of the second surfactant is 0.00001 to 0.1% by mass.

摘要翻译： 本发明的表面处理组合物含有第一表面活性剂，第二表面活性剂，碱性化合物和水。 表面处理组合物的pH为8以上。 第二表面活性剂的重均分子量为第一表面活性剂的二分之一以下。 第一表面活性剂的含量和第二表面活性剂的含量之和为0.00001〜0.1质量％。

公开(公告)号：US08632693B2

公开(公告)日：2014-01-21

申请号：US12496314

申请日：2009-07-01

申请人： Hitoshi Morinaga ,  Shuhei Takahashi ,  Shogaku Ide ,  Tomohiro Imao ,  Naoyuki Ishihara

发明人： Hitoshi Morinaga ,  Shuhei Takahashi ,  Shogaku Ide ,  Tomohiro Imao ,  Naoyuki Ishihara

IPC分类号： C09K13/00

CPC分类号： C09G1/02 ,  H01L21/02024 ,  H01L21/02052

摘要： To provide a wetting agent for semiconductors and a polishing composition whereby the wettability of a semiconductor substrate surface can be improved, and microdefects such as particle attachments can be remarkably reduced.A wetting agent for semiconductors, comprising a water soluble polymer compound having a low viscosity and water, and a polishing composition. A 0.3 wt % aqueous solution of the water soluble polymer compound has a viscosity of less than 10 mPa·s at 25° C.

摘要翻译： 为了提供用于半导体的润湿剂和可以提高半导体衬底表面的润湿性的抛光组合物，并且可以显着降低诸如颗粒附着物的微缺陷。 一种用于半导体的润湿剂，其包含具有低粘度和水的水溶性聚合物化合物和抛光组合物。 水溶性聚合物化合物的0.3重量％水溶液在25℃下的粘度小于10mPa·s

公开(公告)号：US08038496B2

公开(公告)日：2011-10-18

申请号：US12219648

申请日：2008-07-25

申请人： Masayuki Sakakura ,  Shuhei Takahashi ,  Kazuko Ikeda ,  Tomoya Futamura

发明人： Masayuki Sakakura ,  Shuhei Takahashi ,  Kazuko Ikeda ,  Tomoya Futamura

IPC分类号： H01L51/56

CPC分类号： H01L51/5253 ,  H01L27/1214 ,  H01L27/1248 ,  H01L27/3244 ,  H01L27/3248 ,  H01L27/3258 ,  H05B33/04

摘要： A light emitting device of the invention includes a thin film transistor, an insulating layer covering the thin film transistor, an electrode which is electrically connected to the thin film transistor through a contact hole formed on the insulating layer, and a light emitting element formed by interposing a light emitting layer between a first electrode which is electrically connected to the electrode and a second electrode. The light emitting device further includes a layer formed of a different material from that of the insulating layer only between the electrode and the first electrode over the insulating layer and the insulating layer. The structure of the light emitting device and its manufacturing method reduces the amount of water remaining in the light emitting device and suppresses the deterioration of the light emitting element due to water remaining in the light emitting device.

摘要翻译： 本发明的发光器件包括薄膜晶体管，覆盖薄膜晶体管的绝缘层，通过形成在绝缘层上的接触孔与薄膜晶体管电连接的电极，以及由绝缘层形成的发光元件 在与电极电连接的第一电极和第二电极之间插入发光层。 发光器件还包括仅在绝缘层和绝缘层上的电极和第一电极之间的与绝缘层不同的材料形成的层。 发光器件的结构及其制造方法减少了发光器件中剩余的水量，并且抑制了由于发光器件中剩余的水而引起的发光元件的劣化。

公开(公告)号：US07821002B2

公开(公告)日：2010-10-26

申请号：US11790072

申请日：2007-04-23

申请人： Shunpei Yamazaki ,  Yukie Suzuki ,  Yasuyuki Arai ,  Yoshitaka Moriya ,  Kazuko Ikeda ,  Yoshifumi Tanada ,  Shuhei Takahashi

发明人： Shunpei Yamazaki ,  Yukie Suzuki ,  Yasuyuki Arai ,  Yoshitaka Moriya ,  Kazuko Ikeda ,  Yoshifumi Tanada ,  Shuhei Takahashi

IPC分类号： H01L29/04 ,  H01L31/036 ,  H01L31/0376 ,  H01L31/062 ,  H01L29/76

CPC分类号： H01L29/42368 ,  H01L21/28273 ,  H01L21/28282 ,  H01L21/84 ,  H01L27/12 ,  H01L27/1203 ,  H01L27/1214 ,  H01L27/1248 ,  H01L27/1255 ,  H01L27/13 ,  H01L29/42384 ,  H01L29/66757 ,  H01L29/66825 ,  H01L29/66833 ,  H01L29/78609 ,  H01L29/78618 ,  H01L29/7881

摘要： The semiconductor device has a semiconductor layer, a gate electrode which covers an end portion of the semiconductor layer, and an insulating layer for insulating the semiconductor layer and the gate electrode. The film thickness of the insulating layer which insulates a region where an end portion of the semiconductor layer and the gate electrode overlap each other is thicker than the film thickness of the insulating layer which covers the central portion of the semiconductor layer.

摘要翻译： 半导体器件具有半导体层，覆盖半导体层的端部的栅电极和用于使半导体层和栅电极绝缘的绝缘层。 使半导体层的端部与栅电极重叠的区域绝缘的绝缘层的膜厚比覆盖半导体层的中心部的绝缘层的膜厚厚。

公开(公告)号：US07748908B2

公开(公告)日：2010-07-06

申请号：US11794914

申请日：2006-01-20

申请人： Tatsuo Aira ,  Shuhei Takahashi

发明人： Tatsuo Aira ,  Shuhei Takahashi

IPC分类号： F16C33/10 ,  F16C33/74

CPC分类号： F16C33/74 ,  E02F9/006 ,  F16C11/045 ,  F16C33/10 ,  F16C2350/26

摘要： A bearing device for uniformly distributing lubricating oil between first and second bushing sliding surfaces and a connection pin is provided. The connection pin is inserted into the first bushing that is inserted into a boss member. The second bushings are inserted into a pair of bracket members. An oil storage portion is formed at a middle part of the connection pin, and is communicated to an oil feed channel that feeds lubricating oil from the outside. First sealing members and second sealing members are disposed in the first bushing and the second bushings, respectively. A pair of first channels and a second channel are formed inside the connection pin. The first channels are opened in locations in proximity to the first sealing members. The second channel is communicated to this first channel and the oil storage chamber.

摘要翻译： 提供了用于在第一和第二衬套滑动表面之间均匀分布润滑油的轴承装置和连接销。 连接销插入插入到凸台部件中的第一衬套中。 第二衬套被插入一对支架构件中。 储油部形成在连接销的中间部，与从外部供给润滑油的供油路连通。 第一密封构件和第二密封构件分别设置在第一衬套和第二衬套中。 一对第一通道和第二通道形成在连接销的内部。 第一通道在靠近第一密封构件的位置打开。 第二通道与第一通道和储油室相通。

公开(公告)号：US07423373B2

公开(公告)日：2008-09-09

申请号：US11079280

申请日：2005-03-15

申请人： Masayuki Sakakura ,  Shuhei Takahashi ,  Kazuko Ikeda ,  Tomoya Futamura

发明人： Masayuki Sakakura ,  Shuhei Takahashi ,  Kazuko Ikeda ,  Tomoya Futamura

IPC分类号： H01J1/62 ,  H01J63/04

CPC分类号： H01L51/5253 ,  H01L27/1214 ,  H01L27/1248 ,  H01L27/3244 ,  H01L27/3248 ,  H01L27/3258 ,  H05B33/04

摘要： An object of the present invention is to provide a structure and a manufacturing method of a light emitting device, which reduces the amount of water remaining in the light emitting device. Another object of the invention is to provide a structure and a manufacturing method of a light emitting device, which suppresses the deterioration of a light emitting element due to water remaining in the light emitting device. A light emitting device of the invention includes a thin film transistor, an insulating layer covering the thin film transistor, an electrode which is electrically connected to the thin film transistor through a contact hole formed on the insulating layer, and a light emitting element formed by interposing a light emitting layer between a first electrode which is electrically connected to the electrode and a second electrode. The light emitting device further includes a layer formed of a different material from that of the insulating layer only between the electrode and the first electrode over the insulating layer and the insulating layer.

公开(公告)号：US09090799B2

公开(公告)日：2015-07-28

申请号：US13882280

申请日：2011-11-07

申请人： Toshio Shinoda ,  Kayoko Nagahara ,  Yutaka Inoue ,  Shuhei Takahashi ,  Toshihiro Miwa

发明人： Toshio Shinoda ,  Kayoko Nagahara ,  Yutaka Inoue ,  Shuhei Takahashi ,  Toshihiro Miwa

IPC分类号： B24B1/00 ,  C09G1/02 ,  H01L21/02 ,  B24B31/00

CPC分类号： C09G1/02 ,  B24B31/003 ,  H01L21/02024

摘要： Provided is a polishing composition containing abrasive grains, at least one type of alcohol compound selected from the group consisting of aliphatic alcohols with 2 to 6 carbon atoms and glycol ethers with 3 to 10 carbon atoms, at least one type of basic compound selected from the group consisting of quaternary ammonium salts and alkali metal salts, and water. The average primary particle diameter of the abrasive grains is 5 to 50 nm. The content of the alcohol compound in the polishing composition is 0.01 to 1% by mass. The polishing composition is mainly used in an application of polishing a semiconductor substrate surface.

摘要翻译： 本发明提供一种抛光组合物，其含有磨粒，至少一种选自碳原子数2〜6的脂肪族醇和碳原子数3〜10的二醇醚的醇类化合物，至少一种选自 由季铵盐和碱金属盐组成的组和水。 磨粒的平均一次粒径为5〜50nm。 抛光组合物中醇化合物的含量为0.01〜1质量％。 抛光组合物主要用于研磨半导体衬底表面的应用中。

公开(公告)号：US20130183826A1

公开(公告)日：2013-07-18

申请号：US13824149

申请日：2011-09-20

申请人： Kohsuke Tsuchiya ,  Shuhei Takahashi

发明人： Kohsuke Tsuchiya ,  Shuhei Takahashi

IPC分类号： C09K13/00 ,  H01L21/306

CPC分类号： C09K13/00 ,  B24B37/044 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/02024 ,  H01L21/02052 ,  H01L21/30625

摘要： A polishing composition for a silicon wafer and a rinsing composition for a silicon wafer according to the present invention contain a nonionic surfactant of a polyoxyethylene adduct. The HLB value of the polyoxyethylene adduct is 8 to 15. The weight-average molecular weight of the polyoxyethylene adduct is 1400 or less. The average number of moles of oxyethylene added in the polyoxyethylene adduct is 13 or less. The content of the polyoxyethylene adduct in each of the polishing composition and the rinsing composition is 0.00001 to 0.1% by mass.

摘要翻译： 本发明的硅晶片用抛光组合物和硅晶片用漂洗组合物含有聚氧乙烯加合物的非离子性表面活性剂。 聚氧乙烯加成物的HLB值为8〜15。聚氧乙烯加成物的重均分子量为1400以下。 在聚氧乙烯加合物中加入的氧乙烯的平均摩尔数为13以下。 抛光组合物和漂洗组合物中的聚氧乙烯加合物的含量为0.00001〜0.1质量％。

公开(公告)号：US20080138005A1

公开(公告)日：2008-06-12

申请号：US11794914

申请日：2006-01-20

申请人： Tatsuo Aira ,  Shuhei Takahashi

发明人： Tatsuo Aira ,  Shuhei Takahashi

IPC分类号： F16C33/10 ,  F16C33/74

CPC分类号： F16C33/74 ,  E02F9/006 ,  F16C11/045 ,  F16C33/10 ,  F16C2350/26

摘要： A bearing device for uniformly distributing lubricating oil between first and second bushing sliding surfaces and a connection pin is provided. The connection pin is inserted into the first bushing that is inserted into a boss member. The second bushings are inserted into a pair of bracket members. An oil storage portion is formed at a middle part of the connection pin, and is communicated to an oil feed channel that feeds lubricating oil from the outside. First sealing members and second sealing members are disposed in the first bushing and the second bushings, respectively. A pair of first channels and a second channel are formed inside the connection pin. The first channels are opened in locations in proximity to the first sealing members. The second channel is communicated to this first channel and the oil storage chamber.

摘要翻译： 提供了用于在第一和第二衬套滑动表面之间均匀分布润滑油的轴承装置和连接销。 连接销插入插入到凸台部件中的第一衬套中。 第二衬套被插入一对支架构件中。 储油部形成在连接销的中间部，与从外部供给润滑油的供油路连通。 第一密封构件和第二密封构件分别设置在第一衬套和第二衬套中。 一对第一通道和第二通道形成在连接销的内部。 第一通道在靠近第一密封构件的位置打开。 第二通道与第一通道和储油室相通。

公开(公告)号：US20130302984A1

公开(公告)日：2013-11-14

申请号：US13980138

申请日：2012-01-18

申请人： Kohsuke Tsuchiya ,  Megumi Kubo ,  Shuhei Takahashi

发明人： Kohsuke Tsuchiya ,  Megumi Kubo ,  Shuhei Takahashi

IPC分类号： H01L21/306 ,  C09G1/04

CPC分类号： H01L21/30625 ,  B24B37/044 ,  C09G1/02 ,  C09G1/04 ,  C09K3/1409 ,  H01L21/02024

摘要： Provided is a polishing composition characterized by: including at least one of either organic acid or organic salt and including a composition (A) including hydroxyethyl cellulose, ammonia, abrasive grains, and water. The electrical conductivity of the polishing composition is 1.2 to 8 times the electrical conductivity of the composition (A). The polishing composition is mainly used in substrate surface polishing applications.

摘要翻译： 提供一种抛光组合物，其特征在于：包括有机酸或有机盐中的至少一种，并且包括包含羟乙基纤维素，氨，磨料颗粒和水的组合物（A）。 抛光组合物的电导率为组合物（A）的电导率的1.2〜8倍。 抛光组合物主要用于基材表面抛光应用。