Surface inspecting apparatus and surface inspecting method
    1.
    发明授权
    Surface inspecting apparatus and surface inspecting method 有权
    表面检查装置和表面检查方法

    公开(公告)号:US08223328B2

    公开(公告)日:2012-07-17

    申请号:US13241029

    申请日:2011-09-22

    申请人: Kazuhiko Fukazawa

    发明人: Kazuhiko Fukazawa

    IPC分类号: G01N21/00

    摘要: A surface inspecting apparatus includes an illumination optical system irradiating linearly polarized light to a wafer surface under a plurality of inspection conditions; an imaging optical system capturing an image of the wafer formed by polarization components having an oscillation direction different from that of the linearly polarized light as part of reflected light from the wafer surface irradiated by the linearly polarized light under the plurality of inspection conditions; and an image-processing apparatus for extracting for individual pixels an image having the smallest signal intensity from among images of the wafer captured under the plurality of inspection conditions by the imaging optical system, and for inspecting for the presence of defects in a repeated pattern of the wafer based on an inspection image of the wafer generated by connecting each of the extracted pixels.

    摘要翻译: 表面检查装置包括在多个检查条件下将线偏振光照射到晶片表面的照明光学系统; 成像光学系统,在多个检查条件下,拍摄由具有与所述线偏振光照射的晶片表面反射的光的反射光的振荡方向不同于所述线偏振光的振荡方向的偏振成分所形成的图像, 以及图像处理装置,用于通过成像光学系统从在多个检查条件下捕获的晶片的图像中提取具有最小信号强度的图像的各个像素,并且用于检查在重复图案中是否存在缺陷 基于通过连接每个所提取的像素而产生的晶片的检查图像的晶片。

    Surface inspection device
    2.
    发明申请
    Surface inspection device 审中-公开
    表面检测装置

    公开(公告)号:US20110254946A1

    公开(公告)日:2011-10-20

    申请号:US13067033

    申请日:2011-05-03

    IPC分类号: H04N7/18

    摘要: A surface inspection device (1) includes: a stage (10) for supporting a wafer (W); an illumination system (20) for illuminating with ultraviolet light a surface of the wafer (W) supported by the stage (10); a light reception system (30) for forming an image on a predetermined imaging surface with the light from the surface of the wafer (W); a camera unit (34) for capturing an image of the wafer (W) formed on the imaging surface by the light reception system (30); a pixel compensation drive unit (35) for performing pixel compensation; a control unit (40) for controlling the operation of the pixel compensation drive unit (35) and the camera unit (34) so that the camera unit (34) captures images of a plurality of wafers (W) while performing pixel compensation using the pixel compensation drive unit (35); and an image processing unit (45) for generating a synthesized image of the wafer (W) by successively arranging the pixels in the plurality of images captured by the camera unit (34) in the order based on the pixel compensation.

    摘要翻译: 表面检查装置(1)包括:用于支撑晶片(W)的台(10); 用于利用紫外光照射由所述载物台(10)支撑的所述晶片(W)的表面的照明系统(20)。 光接收系统(30),用于利用来自晶片(W)的表面的光在预定的成像表面上形成图像; 用于通过所述光接收系统(30)捕获在所述成像表面上形成的所述晶片(W)的图像的相机单元(34)。 用于执行像素补偿的像素补偿驱动单元(35); 用于控制像素补偿驱动单元(35)和相机单元(34)的操作的控制单元(40),使得相机单元(34)在使用该单元(34)进行像素补偿的同时捕获多个晶片(W)的图像 像素补偿驱动单元(35); 以及图像处理单元(45),用于通过基于像素补偿依次排列由相机单元(34)捕获的多个图像中的像素来生成晶片(W)的合成图像。

    SURFACE INSPECTING APPARATUS AND SURFACE INSPECTING METHOD
    3.
    发明申请
    SURFACE INSPECTING APPARATUS AND SURFACE INSPECTING METHOD 审中-公开
    表面检查装置和表面检查方法

    公开(公告)号:US20100321677A1

    公开(公告)日:2010-12-23

    申请号:US12852015

    申请日:2010-08-06

    申请人: Kazuhiko FUKAZAWA

    发明人: Kazuhiko FUKAZAWA

    IPC分类号: G01N21/00

    摘要: There is provided a surface inspecting apparatus capable of performing inspection at higher speed and with higher accuracy. A surface inspecting apparatus (1) is provided with an illumination optical system (30) for irradiating linearly polarized light to a surface of a wafer (10) under a plurality of inspection conditions; an imaging optical system (40) for capturing an image of the wafer (10) formed by polarization components having an oscillation direction that is different from that of the linearly polarized light as part of reflected light from the surface of the wafer (10) irradiated by the linearly polarized light under the plurality of inspection conditions; and an image-processing apparatus (50) for extracting for individual pixels an image having the smallest signal intensity from among images of the wafer (10) captured under the plurality of inspection conditions by the imaging optical system (40), and for inspecting for the presence of defects in a repeated pattern of the wafer (10) on the basis of an inspection image of the wafer (10) generated by connecting each of the extracted pixels.

    摘要翻译: 提供了能够以更高的速度和更高精度进行检查的表面检查装置。 表面检查装置(1)设置有用于在多个检查条件下将线偏振光照射到晶片(10)的表面的照明光学系统(30) 作为从被照射的晶片(10)的表面的反射光的一部分,拍摄由具有与线偏振光不同的振荡方向的偏振分量形成的晶片(10)的图像的成像光学系统(40) 在多个检查条件下通过线偏振光; 以及图像处理装置(50),用于通过成像光学系统(40)从在多个检查条件下捕获的晶片(10)的图像中提取具有最小信号强度的图像的各个像素,并且用于检查 基于通过连接每个所提取的像素产生的晶片(10)的检查图像,在晶片(10)的重复图案中存在缺陷。

    Defect inspection apparatus, defect inspection method and method of inspecting hole pattern
    4.
    发明授权
    Defect inspection apparatus, defect inspection method and method of inspecting hole pattern 有权
    缺陷检查装置,缺陷检查方法和检查孔图案的方法

    公开(公告)号:US07643137B2

    公开(公告)日:2010-01-05

    申请号:US11243425

    申请日:2005-10-05

    IPC分类号: G01N21/00

    CPC分类号: G01N21/95692

    摘要: A defect inspection apparatus for inspecting a defect of a substrate as an object to be inspected comprises an illumination optical system for illuminating the substrate, a receiving optical system for receiving diffracted light from the substrate and a polarizing element provided in either one of the illumination optical system or the receiving optical system.

    摘要翻译: 用于检查作为待检查对象的基板的缺陷的缺陷检查装置包括用于照射基板的照明光学系统,用于从基板接收衍射光的接收光学系统和设置在照明光学器件中的任一个中的偏振元件 系统或接收光学系统。

    Surface inspection apparatus and surface inspection method

    公开(公告)号:US20060192953A1

    公开(公告)日:2006-08-31

    申请号:US11410944

    申请日:2006-04-26

    IPC分类号: G01N21/88

    摘要: A surface inspection apparatus and a surface inspection method aim to securely deal with finer repetition pitch without shortening the wavelength of illumination light. To this end, the apparatus includes a unit illuminating repetitive pattern(s) formed on the substrate surface to be inspected with linearly polarized light, a unit setting to an oblique angle an angle between the direction of an intersecting line of a vibration plane of the linearly polarized light on the substrate surface and the repetition direction of repetitive pattern(s), a unit extracting a polarized light component perpendicular to the vibration plane of the linearly polarized light, from light having been emitted from the repetitive pattern(s) in a specular direction, and a unit detecting a defect of the repetitive pattern(s) according to the light intensity of the polarized light component.

    Surface inspection apparatus
    6.
    发明授权

    公开(公告)号:US06654113B2

    公开(公告)日:2003-11-25

    申请号:US09950074

    申请日:2001-09-12

    IPC分类号: G01N2188

    摘要: The surface inspection apparatus according to the present invention obtains images of a test piece by capturing images of the test piece with an image-capturing device while varying at least one apparatus condition (e.g., the wafer tilt angle) through apparatus condition adjustment and determines an optimal setting at which a surface inspection is to be conducted on the test piece based upon the images thus obtained. As a result, the optimal setting for the inspection can be accurately ascertained with ease even when the pitch of a pattern formed at the surface of the test piece is not known, thereby making it possible to perform a surface inspection while sustaining high levels of accuracy and efficiency at all times.

    Defect inspection apparatus and defect inspection method
    9.
    发明申请
    Defect inspection apparatus and defect inspection method 有权
    缺陷检查装置和缺陷检查方法

    公开(公告)号:US20080316475A1

    公开(公告)日:2008-12-25

    申请号:US12222500

    申请日:2008-08-11

    IPC分类号: G01N21/88

    CPC分类号: G01N21/956

    摘要: An apparatus and a method for defect inspection enables a reduction in the amount of noise light from an underlying layer and a good defect inspection reliably. The apparatus includes an illumination device that irradiates, with illumination light, a substrate to be inspected including a resist layer having cyclic patterns formed on the upper layer, and an optical image forming system that forms an image of the substrate to be inspected according to light that emerges from the substrate to be inspected by the irradiation with illumination light. The wavelength of the illumination light is set so that intensity of the light from the surface of the resist layer, among the light emerged from the substrate to be inspected, is greater than that of light that has passed through the surface of the cyclic pattern layer formed below the resist layer.

    摘要翻译: 用于缺陷检查的装置和方法能够可靠地减少来自下层的噪声光的量和良好的缺陷检查。 该装置包括照明装置,照明装置照射包括具有形成在上层上的循环图案的抗蚀剂层的被检查基板,以及形成根据光检查的基板的图像的光学图像形成系统 从通过照射光的照射检查的基板出现。 照明光的波长被设定为使得从被检查的基板出射的光中的来自抗蚀剂层的表面的光的强度大于通过循环图案层的表面的光的强度 形成在抗蚀剂层下面。

    Surface inspection apparatus and surface inspection method
    10.
    发明授权
    Surface inspection apparatus and surface inspection method 有权
    表面检查装置和表面检查方法

    公开(公告)号:US07298471B2

    公开(公告)日:2007-11-20

    申请号:US11410944

    申请日:2006-04-26

    IPC分类号: G01N21/00

    摘要: A surface inspection apparatus and a surface inspection method aim to securely deal with finer repetition pitch without shortening the wavelength of illumination light. To this end, the apparatus includes a unit illuminating repetitive pattern(s) formed on the substrate surface to be inspected with linearly polarized light, a unit setting to an oblique angle an angle between the direction of an intersecting line of a vibration plane of the linearly polarized light on the substrate surface and the repetition direction of repetitive pattern(s), a unit extracting a polarized light component perpendicular to the vibration plane of the linearly polarized light, from light having been emitted from the repetitive pattern(s) in a specular direction, and a unit detecting a defect of the repetitive pattern(s) according to the light intensity of the polarized light component.

    摘要翻译: 表面检查装置和表面检查方法旨在可靠地处理更精细的重复间距而不缩短照明光的波长。 为此,该装置包括以线性偏振光照射形成在要检查的基板表面上的重复图案的单元,该单元设置为倾斜角度,该倾斜角度与第一振动平面的相交线的方向之间的角度 基板表面上的线偏振光和重复图案的重复方向,从垂直于线偏振光的振动平面的偏振光分量中提取出的光从具有重复图案的光中发出的光 镜面方向,以及根据偏振光分量的光强度检测重复图案的缺陷的单元。