摘要:
A surface inspecting apparatus includes an illumination optical system irradiating linearly polarized light to a wafer surface under a plurality of inspection conditions; an imaging optical system capturing an image of the wafer formed by polarization components having an oscillation direction different from that of the linearly polarized light as part of reflected light from the wafer surface irradiated by the linearly polarized light under the plurality of inspection conditions; and an image-processing apparatus for extracting for individual pixels an image having the smallest signal intensity from among images of the wafer captured under the plurality of inspection conditions by the imaging optical system, and for inspecting for the presence of defects in a repeated pattern of the wafer based on an inspection image of the wafer generated by connecting each of the extracted pixels.
摘要:
A surface inspection device (1) includes: a stage (10) for supporting a wafer (W); an illumination system (20) for illuminating with ultraviolet light a surface of the wafer (W) supported by the stage (10); a light reception system (30) for forming an image on a predetermined imaging surface with the light from the surface of the wafer (W); a camera unit (34) for capturing an image of the wafer (W) formed on the imaging surface by the light reception system (30); a pixel compensation drive unit (35) for performing pixel compensation; a control unit (40) for controlling the operation of the pixel compensation drive unit (35) and the camera unit (34) so that the camera unit (34) captures images of a plurality of wafers (W) while performing pixel compensation using the pixel compensation drive unit (35); and an image processing unit (45) for generating a synthesized image of the wafer (W) by successively arranging the pixels in the plurality of images captured by the camera unit (34) in the order based on the pixel compensation.
摘要:
There is provided a surface inspecting apparatus capable of performing inspection at higher speed and with higher accuracy. A surface inspecting apparatus (1) is provided with an illumination optical system (30) for irradiating linearly polarized light to a surface of a wafer (10) under a plurality of inspection conditions; an imaging optical system (40) for capturing an image of the wafer (10) formed by polarization components having an oscillation direction that is different from that of the linearly polarized light as part of reflected light from the surface of the wafer (10) irradiated by the linearly polarized light under the plurality of inspection conditions; and an image-processing apparatus (50) for extracting for individual pixels an image having the smallest signal intensity from among images of the wafer (10) captured under the plurality of inspection conditions by the imaging optical system (40), and for inspecting for the presence of defects in a repeated pattern of the wafer (10) on the basis of an inspection image of the wafer (10) generated by connecting each of the extracted pixels.
摘要:
A defect inspection apparatus for inspecting a defect of a substrate as an object to be inspected comprises an illumination optical system for illuminating the substrate, a receiving optical system for receiving diffracted light from the substrate and a polarizing element provided in either one of the illumination optical system or the receiving optical system.
摘要:
A surface inspection apparatus and a surface inspection method aim to securely deal with finer repetition pitch without shortening the wavelength of illumination light. To this end, the apparatus includes a unit illuminating repetitive pattern(s) formed on the substrate surface to be inspected with linearly polarized light, a unit setting to an oblique angle an angle between the direction of an intersecting line of a vibration plane of the linearly polarized light on the substrate surface and the repetition direction of repetitive pattern(s), a unit extracting a polarized light component perpendicular to the vibration plane of the linearly polarized light, from light having been emitted from the repetitive pattern(s) in a specular direction, and a unit detecting a defect of the repetitive pattern(s) according to the light intensity of the polarized light component.
摘要:
The surface inspection apparatus according to the present invention obtains images of a test piece by capturing images of the test piece with an image-capturing device while varying at least one apparatus condition (e.g., the wafer tilt angle) through apparatus condition adjustment and determines an optimal setting at which a surface inspection is to be conducted on the test piece based upon the images thus obtained. As a result, the optimal setting for the inspection can be accurately ascertained with ease even when the pitch of a pattern formed at the surface of the test piece is not known, thereby making it possible to perform a surface inspection while sustaining high levels of accuracy and efficiency at all times.
摘要:
A surface inspection apparatus (1) has a stage (5) for supporting a wafer (10) on which predetermined patterns have been formed by exposure using an exposure device (100); an illumination system (20) for irradiating an illuminating light on the surface of the wafer (10) supported by the stage (5); an imaging device (35) for detecting light from the surface of the wafer (10) on which illuminating light has been irradiated, and outputting a detection signal; and an image processing unit (40) for determining the focus state during exposure, on the basis of the detection signal sent from the imaging device (35).
摘要:
A surface inspection apparatus includes: an irradiation unit; a detection unit configured to detect a first detection signal according to a first light beam and a second detection signal according to a second light beam; a providing unit which is configured to provide a first reference data and a second reference data; and a determination unit which is configured to determine a processing condition of the pattern in the substrate as an inspection object substrate, based on consistency between the first detection signal and the first reference data, and consistency between the second detection signal and the second reference data.
摘要:
An apparatus and a method for defect inspection enables a reduction in the amount of noise light from an underlying layer and a good defect inspection reliably. The apparatus includes an illumination device that irradiates, with illumination light, a substrate to be inspected including a resist layer having cyclic patterns formed on the upper layer, and an optical image forming system that forms an image of the substrate to be inspected according to light that emerges from the substrate to be inspected by the irradiation with illumination light. The wavelength of the illumination light is set so that intensity of the light from the surface of the resist layer, among the light emerged from the substrate to be inspected, is greater than that of light that has passed through the surface of the cyclic pattern layer formed below the resist layer.
摘要:
A surface inspection apparatus and a surface inspection method aim to securely deal with finer repetition pitch without shortening the wavelength of illumination light. To this end, the apparatus includes a unit illuminating repetitive pattern(s) formed on the substrate surface to be inspected with linearly polarized light, a unit setting to an oblique angle an angle between the direction of an intersecting line of a vibration plane of the linearly polarized light on the substrate surface and the repetition direction of repetitive pattern(s), a unit extracting a polarized light component perpendicular to the vibration plane of the linearly polarized light, from light having been emitted from the repetitive pattern(s) in a specular direction, and a unit detecting a defect of the repetitive pattern(s) according to the light intensity of the polarized light component.