公开(公告)号：US08524361B2

公开(公告)日：2013-09-03

申请号：US12716306

申请日：2010-03-03

申请人： Kazuki Soejima ,  Takamasa Hirayama ,  Daisuke Shimokawa ,  Masaaki Sato ,  Yukio Arimitsu

发明人： Kazuki Soejima ,  Takamasa Hirayama ,  Daisuke Shimokawa ,  Masaaki Sato ,  Yukio Arimitsu

IPC分类号： B32B7/12 ,  B32B15/04

CPC分类号： H01G4/12 ,  C09J7/22 ,  C09J7/38 ,  C09J2205/302 ,  C09J2433/00 ,  C09J2467/006 ,  H01G4/308 ,  Y10T156/1052 ,  Y10T428/14 ,  Y10T428/266 ,  Y10T428/28 ,  Y10T428/2813 ,  Y10T428/2852 ,  Y10T428/31504

摘要： The invention relates to a heat-peelable pressure-sensitive adhesive sheet for cutting a laminated ceramic sheet, which is used for temporary fixing at cutting of the laminated ceramic sheet, the heat-peelable pressure-sensitive adhesive sheet including a base material and, formed on at least one surface of the base material, a heat-expandable pressure-sensitive adhesive layer containing a pressure-sensitive adhesive and a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a gel fraction of 50% by weight or more, and the heat-expandable pressure-sensitive adhesive layer has a glass transition temperature of −40° C. to 30° C.

摘要翻译： 本发明涉及一种用于切割叠层陶瓷片的热剥离性压敏粘合片，其用于在层压陶瓷片的切割时的临时固定，所述可热剥离的压敏粘合片包括基材，并形成 在基材的至少一个表面上，含有压敏粘合剂和发泡剂的热膨胀性压敏粘合剂层，其中热膨胀性压敏粘合剂层的凝胶分数为50重量％ 以上，热膨胀性粘合剂层的玻璃化转变温度为-40℃〜30℃。

公开(公告)号：US20120237764A1

公开(公告)日：2012-09-20

申请号：US13421114

申请日：2012-03-15

申请人： Kazuki SOEJIMA ,  Daisuke SHIMOKAWA ,  Takamasa HIRAYAMA

发明人： Kazuki SOEJIMA ,  Daisuke SHIMOKAWA ,  Takamasa HIRAYAMA

IPC分类号： B32B7/12

CPC分类号： H01L21/6836 ,  C08K5/0075 ,  C08K9/10 ,  C08L2312/00 ,  C09J7/38 ,  C09J9/00 ,  C09J11/06 ,  C09J133/02 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/11 ,  C09J2433/00 ,  H01L2221/68327 ,  Y10T428/28

摘要： In the production process of electronic parts, the static electricity generated when peeling a pressure-sensitive adhesive tape has interfered with the performance of the electronic parts. This problem has been solved by a pressure-sensitive adhesive tape for temporary fixing of electronic parts of the present invention including at least a supporting substrate film and a thermally expandable pressure-sensitive adhesive layer provided on one side of the substrate, wherein the thermally expandable pressure-sensitive adhesive layer contains thermally expandable microspheres and an ionic liquid; the content of the ionic liquid is 0.01 to 10 parts by weight based on 100 parts by weight of a polymer contained in the thermally expandable pressure-sensitive adhesive layer; the surface resistance of the thermally expandable pressure-sensitive adhesive layer is 1.0×1013 Ω/□ or less; and the ratio of the surface resistance after heating for foaming to that before the heating is 5.0 or less.

摘要翻译： 在电子零件的生产过程中，剥离压敏粘合带时产生的静电干扰了电子部件的性能。 通过用于临时固定本发明的电子部件的压敏粘合带已经解决了该问题，所述粘合带至少包括支撑基底膜和设置在基底的一侧上的可热膨胀的压敏粘合剂层，其中热膨胀 压敏粘合剂层包含热膨胀性微球和离子液体; 离子液体的含量相对于100重量份的热膨胀性压敏粘合剂层中所含的聚合物为0.01〜10重量份， 热膨胀性粘合剂层的表面电阻为1.0×10 13Ω·□以下。 发泡加热后的表面电阻与加热前的表面电阻的比率为5.0以下。

公开(公告)号：US20100224316A1

公开(公告)日：2010-09-09

申请号：US12716306

申请日：2010-03-03

申请人： Kazuki SOEJIMA ,  Takamasa HIRAYAMA ,  Daisuke SHIMOKAWA ,  Masaaki SATO ,  Yukio ARIMITSU

发明人： Kazuki SOEJIMA ,  Takamasa HIRAYAMA ,  Daisuke SHIMOKAWA ,  Masaaki SATO ,  Yukio ARIMITSU

IPC分类号： B32B38/10 ,  C09J7/02 ,  B32B5/00

CPC分类号： H01G4/12 ,  C09J7/22 ,  C09J7/38 ,  C09J2205/302 ,  C09J2433/00 ,  C09J2467/006 ,  H01G4/308 ,  Y10T156/1052 ,  Y10T428/14 ,  Y10T428/266 ,  Y10T428/28 ,  Y10T428/2813 ,  Y10T428/2852 ,  Y10T428/31504

摘要： The invention relates to a heat-peelable pressure-sensitive adhesive sheet for cutting a laminated ceramic sheet, which is used for temporary fixing at cutting of the laminated ceramic sheet, the heat-peelable pressure-sensitive adhesive sheet including a base material and, formed on at least one surface of the base material, a heat-expandable pressure-sensitive adhesive layer containing a pressure-sensitive adhesive and a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a gel fraction of 50% by weight or more, and the heat-expandable pressure-sensitive adhesive layer has a glass transition temperature of −40° C. to 30° C.

摘要翻译： 本发明涉及一种用于切割叠层陶瓷片的热剥离性压敏粘合片，其用于在层压陶瓷片的切割时的临时固定，所述可热剥离的压敏粘合片包括基材，并形成 在基材的至少一个表面上，含有压敏粘合剂和发泡剂的热膨胀性压敏粘合剂层，其中热膨胀性压敏粘合剂层的凝胶分数为50重量％ 以上，热膨胀性粘合剂层的玻璃化转变温度为-40℃〜30℃。

公开(公告)号：US20130240141A1

公开(公告)日：2013-09-19

申请号：US13418751

申请日：2012-03-13

申请人： Kazuki SOEJIMA ,  Shinji HOSHINO ,  Takamasa HIRAYAMA ,  Kazuyuki KIUCHI

发明人： Kazuki SOEJIMA ,  Shinji HOSHINO ,  Takamasa HIRAYAMA ,  Kazuyuki KIUCHI

IPC分类号： C09J5/00

CPC分类号： H01L21/568 ,  C09J5/06 ,  C09J7/38 ,  C09J2201/134 ,  C09J2203/326 ,  C09J2205/11 ,  C09J2205/302 ,  C09J2483/00 ,  H01L21/6836 ,  H01L24/19 ,  H01L24/96 ,  H01L2221/68327 ,  H01L2224/24137 ,  H01L2924/181 ,  H01L2924/00

摘要： The present invention provides a heat-resistant pressure-sensitive adhesive tape for the production of a semiconductor device, including a base material layer and a pressure-sensitive adhesive layer formed on each side of the base material layer, in which at least the pressure-sensitive adhesive layer at a side on which a semiconductor chip is to be encapsulated with a resin contains a silicone pressure-sensitive adhesive. The heat-resistant pressure-sensitive adhesive tape is used for temporarily fixing a chip in a method for producing a substrateless semiconductor package which does not use a metal lead frame.

摘要翻译： 本发明提供一种用于制造半导体器件的耐热粘合带，其包括在基材层的每一侧上形成的基材层和压敏粘合剂层，其中， 在其上用树脂封装半导体芯片的一侧的粘合剂层包含硅氧烷压敏粘合剂。 耐热粘合带用于在不使用金属引线框架的无基板半导体封装的制造方法中临时固定芯片。