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1.发明申请公开(公告)号：US20120237764A1
公开(公告)日：2012-09-20
申请号：US13421114
申请日：2012-03-15
IPC分类号： B32B7/12
CPC分类号： H01L21/6836 , C08K5/0075 , C08K9/10 , C08L2312/00 , C09J7/38 , C09J9/00 , C09J11/06 , C09J133/02 , C09J2203/326 , C09J2205/102 , C09J2205/11 , C09J2433/00 , H01L2221/68327 , Y10T428/28
摘要： In the production process of electronic parts, the static electricity generated when peeling a pressure-sensitive adhesive tape has interfered with the performance of the electronic parts. This problem has been solved by a pressure-sensitive adhesive tape for temporary fixing of electronic parts of the present invention including at least a supporting substrate film and a thermally expandable pressure-sensitive adhesive layer provided on one side of the substrate, wherein the thermally expandable pressure-sensitive adhesive layer contains thermally expandable microspheres and an ionic liquid; the content of the ionic liquid is 0.01 to 10 parts by weight based on 100 parts by weight of a polymer contained in the thermally expandable pressure-sensitive adhesive layer; the surface resistance of the thermally expandable pressure-sensitive adhesive layer is 1.0×1013 Ω/□ or less; and the ratio of the surface resistance after heating for foaming to that before the heating is 5.0 or less.
摘要翻译： 在电子零件的生产过程中，剥离压敏粘合带时产生的静电干扰了电子部件的性能。 通过用于临时固定本发明的电子部件的压敏粘合带已经解决了该问题，所述粘合带至少包括支撑基底膜和设置在基底的一侧上的可热膨胀的压敏粘合剂层，其中热膨胀 压敏粘合剂层包含热膨胀性微球和离子液体; 离子液体的含量相对于100重量份的热膨胀性压敏粘合剂层中所含的聚合物为0.01〜10重量份， 热膨胀性粘合剂层的表面电阻为1.0×10 13Ω·□以下。 发泡加热后的表面电阻与加热前的表面电阻的比率为5.0以下。
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2.发明申请公开(公告)号：US20100224316A1
公开(公告)日：2010-09-09
申请号：US12716306
申请日：2010-03-03
CPC分类号： H01G4/12 , C09J7/22 , C09J7/38 , C09J2205/302 , C09J2433/00 , C09J2467/006 , H01G4/308 , Y10T156/1052 , Y10T428/14 , Y10T428/266 , Y10T428/28 , Y10T428/2813 , Y10T428/2852 , Y10T428/31504
摘要： The invention relates to a heat-peelable pressure-sensitive adhesive sheet for cutting a laminated ceramic sheet, which is used for temporary fixing at cutting of the laminated ceramic sheet, the heat-peelable pressure-sensitive adhesive sheet including a base material and, formed on at least one surface of the base material, a heat-expandable pressure-sensitive adhesive layer containing a pressure-sensitive adhesive and a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a gel fraction of 50% by weight or more, and the heat-expandable pressure-sensitive adhesive layer has a glass transition temperature of −40° C. to 30° C.
摘要翻译： 本发明涉及一种用于切割叠层陶瓷片的热剥离性压敏粘合片，其用于在层压陶瓷片的切割时的临时固定，所述可热剥离的压敏粘合片包括基材，并形成 在基材的至少一个表面上，含有压敏粘合剂和发泡剂的热膨胀性压敏粘合剂层，其中热膨胀性压敏粘合剂层的凝胶分数为50重量％ 以上，热膨胀性粘合剂层的玻璃化转变温度为-40℃〜30℃。
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3.发明申请ADHESIVE SHEET, PROCESS FOR PRODUCING THE SAME, AND METHOD OF CUTTING MULTILAYERED CERAMIC SHEET 审中-公开粘合片及其制造方法以及切割多层陶瓷片的方法公开(公告)号：US20080038540A1
公开(公告)日：2008-02-14
申请号：US11838261
申请日：2007-08-14
申请人： Takamasa HIRAYAMA , Kazuyuki KIUCHI , Masaaki SATO , Yukio ARIMITSU , Daisuke SHIMOKAWA , Tomoko KISHIMOTO
发明人： Takamasa HIRAYAMA , Kazuyuki KIUCHI , Masaaki SATO , Yukio ARIMITSU , Daisuke SHIMOKAWA , Tomoko KISHIMOTO
CPC分类号： H01L21/6836 , C08K7/22 , C09J7/29 , C09J7/385 , C09J2201/162 , C09J2203/326 , C09J2205/106 , C09J2205/11 , C09J2433/00 , H01L21/6835 , H01L2221/68318 , H01L2221/68327 , H01L2924/19041 , H01L2924/30105 , Y10T83/0405 , Y10T428/25
摘要： The present invention relates to an adhesive sheet including a substrate and, an adherent layer containing heat-expandable microspheres, the adherent layer being disposed on at least one side of the substrate, in which the adherent layer has a thickness of 10 to 38 μm, and wherein the heat-expandable microspheres have a maximum particle diameter equal to or smaller than the thickness of the adherent layer and have a mode diameter of 5 to 30 μm. The adhesive sheet of the invention enables a high-accuracy processing in the step of processing an electronic part such as a small ceramic capacitor to thereby greatly improve product characteristics and productivity.
摘要翻译： 本发明涉及一种粘合片，其包括基材和包含热膨胀性微球的粘合层，所述粘合层设置在所述基材的至少一侧，所述粘合层的厚度为10至38μm， 并且其中所述热膨胀性微球具有等于或小于所述粘着层的厚度的最大粒径，并且具有5至30μm的模式直径。 本发明的粘合片能够在小型陶瓷电容器等电子部件的加工工序中进行高精度加工，从而大大提高产品特性和生产率。
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4.发明申请HEAT-PEELABLE PRESSURE-SENSITIVE ADHESIVE SHEET FOR CUTTING LAMINATED CERAMIC SHEET AND METHOD FOR CUT-PROCESSING LAMINATED CERAMIC SHEET 审中-公开用于切割层压陶瓷片的耐热压敏粘合片和切割加工层压陶瓷片的方法公开(公告)号：US20100215882A1
公开(公告)日：2010-08-26
申请号：US12709904
申请日：2010-02-22
CPC分类号： C09J133/08 , C08L33/064 , C08L33/08 , C09J5/00 , C09J7/22 , C09J7/38 , C09J2201/606 , C09J2203/326 , C09J2205/11 , C09J2205/302 , C09J2400/123 , C09J2433/00 , Y10T156/108 , Y10T428/1452
摘要： The invention relates to a heat-peelable pressure-sensitive adhesive sheet for cutting a laminated ceramic sheet, which is used for temporary fixing at cutting of the laminated ceramic sheet, the heat-peelable pressure-sensitive adhesive sheet including a base material and, formed on at least one surface of the base material, a heat-expandable pressure-sensitive adhesive layer containing a pressure-sensitive adhesive, a foaming agent and a tackifying resin, in which the heat-expandable pressure-sensitive adhesive layer has a gel fraction of 50% by weight or more, and the base polymer of the pressure-sensitive adhesive forming the heat-expandable pressure-sensitive adhesive layer has an acid value of 350 mg-KOH/g or less and the tackifying resin contained in the heat-expandable pressure-sensitive adhesive layer has an acid value of 80 mg-KOH/g or less.
摘要翻译： 本发明涉及一种用于切割叠层陶瓷片的热剥离性压敏粘合片，其用于在层压陶瓷片的切割时的临时固定，所述可热剥离的压敏粘合片包括基材，并形成 在基材的至少一个表面上，含有压敏粘合剂，发泡剂和增粘树脂的热膨胀性压敏粘合剂层，其中，热膨胀性压敏粘合剂层的凝胶分数为 50重量％以上，形成热膨胀性压敏粘合剂层的压敏粘合剂的基础聚合物的酸值为350mg-KOH / g以下，并且增粘树脂包含在热膨胀性粘合剂层中 压敏粘合剂层的酸值为80mg-KOH / g以下。
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公开(公告)号：US20120058336A1
公开(公告)日：2012-03-08
申请号：US13223777
申请日：2011-09-01
IPC分类号： B32B7/12
CPC分类号： H01L21/6836 , C08F290/067 , C08G18/4854 , C08G18/672 , C08G18/757 , C08G2170/40 , C09J5/06 , C09J7/35 , C09J175/16 , C09J2201/61 , C09J2203/326 , C09J2205/114 , C09J2205/302 , C09J2205/31 , C09J2433/00 , C09J2467/006 , C09J2475/00 , H01G4/30 , H01G13/00 , H01L2221/68336 , Y10T428/2878 , C08G18/48
摘要： The present invention provides a temporary fixing sheet which firmly holds a ceramic sheet in a cutting step for the ceramic sheet and the like, can provide high cutting accuracy, and then can efficiently and easily peel a chip from itself by being cooled to a predetermined temperature or lower, with a high degree of freedom in designing and adequate handleability. The temporary fixing sheet includes a supporting substrate and a temporary fixing layer provided on at least one face thereof, wherein the temporary fixing layer contains a urethane polymer and a vinyl polymer.
摘要翻译： 本发明提供了一种在陶瓷片等的切割步骤中牢固地保持陶瓷片的临时固定片，可以提供高切割精度，然后通过冷却到预定温度可以有效且容易地将其自身剥离 或更低，设计自由度高，操作性好。 临时固定片包括支撑基板和设置在其至少一个面上的临时固定层，其中临时固定层包含聚氨酯聚合物和乙烯基聚合物。
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公开(公告)号：US20120059124A1
公开(公告)日：2012-03-08
申请号：US13223841
申请日：2011-09-01
IPC分类号： C09J175/16 , C09J133/08
CPC分类号： H01L21/6836 , C08F283/008 , C08G18/4854 , C08G18/672 , C08G18/757 , C08G2170/40 , C09J5/06 , C09J7/35 , C09J175/16 , C09J2201/61 , C09J2203/326 , C09J2205/302 , C09J2205/31 , C09J2433/00 , C09J2467/006 , C09J2475/00 , H01G4/30 , H01G13/00 , H01L2221/68336 , C08G18/48
摘要： The present invention provides a temporary fixing sheet which firmly holds a ceramic sheet in a cutting step for the ceramic sheet and the like, can provide high cutting accuracy, then can efficiently and easily peel a chip from itself by being cooled to a predetermined temperature or lower, gives a high degree of freedom to designing and has adequate handleability. The temporary fixing sheet has a resin layer which contains a urethane polymer component and a vinyl polymer, develops the tack strength at a particular temperature equal to or higher than 40° C., and loses the tack strength at the particular temperature or lower.
摘要翻译： 本发明提供了一种在陶瓷片等的切割步骤中牢固地保持陶瓷片的临时固定片，可以提供高切割精度，然后可以通过冷却到预定温度来有效且容易地将其自身剥离，或 更低，给予设计的高度自由度并具有足够的可操作性。 临时固定片具有包含氨基甲酸酯聚合物组分和乙烯基聚合物的树脂层，在特定温度等于或高于40℃的情况下产生粘着强度，并且在特定温度或更低温度下失去粘着强度。
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