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公开(公告)号:US20050161798A1
公开(公告)日:2005-07-28
申请号:US10509689
申请日:2002-07-24
申请人: Keiji Ninomiya , Kenji Itoh , Hiroyuki Joba
发明人: Keiji Ninomiya , Kenji Itoh , Hiroyuki Joba
IPC分类号: H01L23/12 , H01L23/31 , H01L23/495 , H01L23/50 , H01L23/48
CPC分类号: H01L23/3107 , H01L23/49541 , H01L23/50 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/32245 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/48257 , H01L2224/49111 , H01L2224/49171 , H01L2224/73265 , H01L2924/01013 , H01L2924/01033 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: The present invention relates to a semiconductor device and, more particularly, has for its object to provide a technique for improving the performance of a semiconductor device having a ground terminal and a plurality of signal terminals arranged around the ground terminal. To attain the object, the present invention features isolation between a ground terminal (5, 35) connected to a functional block (11) and a ground terminal (6, 36) connected to a functional block (12). Thus, a ground potential applied to one of the functional blocks through the corresponding ground terminal is prevented from varying depending on the magnitude of a current flowing through the other functional block. This improves the performance of each functional block to improve the performance of the semiconductor device.
摘要翻译: 本发明涉及一种半导体器件,更具体地说,本发明的目的是提供一种用于提高具有接地端子和布置在接地端子周围的多个信号端子的半导体器件的性能的技术。 为了实现该目的,本发明的特征在于连接到功能块(11)的接地端子(5,35)与连接到功能块(12)的接地端子(6,36)之间的隔离。 因此,防止通过对应的接地端子施加到功能块之一的接地电位根据流过另一个功能块的电流的大小而变化。 这提高了每个功能块的性能,以提高半导体器件的性能。