公开(公告)号：US20060237320A1

公开(公告)日：2006-10-26

申请号：US11113948

申请日：2005-04-25

Applicant: K.Y. Lin ,  Chuan-Ping Hou ,  Keng-Hong Lin ,  Po-Jen Shih ,  S.K. Chen ,  Chao-Lung Chen ,  Chen Cheng Chou ,  Chyi Chern ,  De-Dui Liao

Inventor： K.Y. Lin ,  Chuan-Ping Hou ,  Keng-Hong Lin ,  Po-Jen Shih ,  S.K. Chen ,  Chao-Lung Chen ,  Chen Cheng Chou ,  Chyi Chern ,  De-Dui Liao

IPC: C25D5/10

CPC classification number: C25D5/18 ,  C25D5/10 ,  C25D7/123 ,  H01L21/2885 ,  H01L21/32051 ,  H01L24/02 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/14

Abstract: A method for forming a metal layer having a predetermined thickness on an underlying material is disclosed. According to the method, the underlying material is electroplated to form the metal layer having a fraction of the predetermined thickness thereon. The step of electroplating is interrupted for a predetermined period of time. The step of electroplating is then resumed to form the metal layer having the predetermined thickness on the underlying material, thereby improving planarity of the metal layer.

Abstract translation: 公开了一种在下面的材料上形成具有预定厚度的金属层的方法。 根据该方法，将下面的材料电镀以形成其上具有预定厚度的一部分的金属层。 电镀步骤中断预定的时间。 然后恢复电镀步骤以在下层材料上形成具有预定厚度的金属层，从而改善金属层的平面度。