公开(公告)号：US07507642B2

公开(公告)日：2009-03-24

申请号：US11747575

申请日：2007-05-11

申请人： Hideo Yamagata ,  Takeyoshi Koumoto ,  Kenji Atsuumi ,  Yoichi Negoro ,  Tatsushiro Hirata ,  Takashi Noguchi

发明人： Hideo Yamagata ,  Takeyoshi Koumoto ,  Kenji Atsuumi ,  Yoichi Negoro ,  Tatsushiro Hirata ,  Takashi Noguchi

IPC分类号： H01L21/322 ,  H01L21/22 ,  H01L21/38

CPC分类号： H01L21/02505 ,  C30B25/02 ,  C30B29/52 ,  H01L21/02381 ,  H01L21/0245 ,  H01L21/02488 ,  H01L21/02502 ,  H01L21/0251 ,  H01L21/02532 ,  H01L21/0262 ,  H01L21/02636 ,  H01L29/66242

摘要： In a vapor-phase growth method in which a silicon-germanium mixed crystal layer is deposited on a semiconductor substrate, the vapor-phase growth method comprises a first step of introducing silicon raw material gas into a reaction furnace in such a manner that a silicon raw material gas partial pressure increases in proportion to a time to thereby deposit a first semiconductor layer of a silicon layer on the semiconductor substrate under reduced pressure, a second step of introducing silicon raw material gas and germanium raw material gas into the reaction furnace in such a manner that a desired germanium concentration may be obtained to thereby deposit a second semiconductor layer of a silicon-germanium mixed crystal layer on the first semiconductor layer under reduced pressure and a third step of introducing silicon raw material gas into the reaction furnace under reduced pressure to thereby deposit a third semiconductor layer of a silicon layer on the second semiconductor layer. Thus, there can be obtained a semiconductor layer in which a misfit dislocation can be improved.

摘要翻译： 在半导体基板上沉积硅 - 锗混晶层的气相生长方法中，气相生长方法包括将硅原料气体引入反应炉的第一步骤，即将硅 原料气体分压与时间成比例地增加，从而在半导体衬底上沉积硅层的第一半导体层减压，第二步是将硅原料气体和锗原料气体引入反应炉中 可以获得期望的锗浓度，从而在减压下在第一半导体层上沉积硅 - 锗混合晶体层的第二半导体层，并且在减压下将硅原料气体引入反应炉中的第三步骤 从而在第二半导体层上沉积硅层的第三半导体层。 因此，可以获得其中可以提高失配位错的半导体层。

公开(公告)号：US20070287268A1

公开(公告)日：2007-12-13

申请号：US11747575

申请日：2007-05-11

申请人： Hideo Yamagata ,  Takeyoshi Koumoto ,  Kenji Atsuumi ,  Yoichi Negoro ,  Tatsushiro Hirata ,  Takashi Noguchi

发明人： Hideo Yamagata ,  Takeyoshi Koumoto ,  Kenji Atsuumi ,  Yoichi Negoro ,  Tatsushiro Hirata ,  Takashi Noguchi

IPC分类号： H01L21/322

CPC分类号： H01L21/02505 ,  C30B25/02 ,  C30B29/52 ,  H01L21/02381 ,  H01L21/0245 ,  H01L21/02488 ,  H01L21/02502 ,  H01L21/0251 ,  H01L21/02532 ,  H01L21/0262 ,  H01L21/02636 ,  H01L29/66242

摘要： In a vapor-phase growth method in which a silicon-germanium mixed crystal layer is deposited on a semiconductor substrate, the vapor-phase growth method comprises a first step of introducing silicon raw material gas into a reaction furnace in such a manner that a silicon raw material gas partial pressure increases in proportion to a time to thereby deposit a first semiconductor layer of a silicon layer on the semiconductor substrate under reduced pressure, a second step of introducing silicon raw material gas and germanium raw material gas into the reaction furnace in such a manner that a desired germanium concentration may be obtained to thereby deposit a second semiconductor layer of a silicon-germanium mixed crystal layer on the first semiconductor layer under reduced pressure and a third step of introducing silicon raw material gas into the reaction furnace under reduced pressure to thereby deposit a third semiconductor layer of a silicon layer on the second semiconductor layer. Thus, there can be obtained a semiconductor layer in which a misfit dislocation can be improved.

摘要翻译： 在半导体基板上沉积硅 - 锗混晶层的气相生长方法中，气相生长方法包括将硅原料气体引入反应炉的第一步骤，即将硅 原料气体分压与时间成比例地增加，从而在半导体衬底上沉积硅层的第一半导体层减压，第二步是将硅原料气体和锗原料气体引入反应炉中 可以获得期望的锗浓度，从而在减压下在第一半导体层上沉积硅 - 锗混合晶体层的第二半导体层，并且在减压下将硅原料气体引入反应炉中的第三步骤 从而在第二半导体层上沉积硅层的第三半导体层。 因此，可以获得其中可以提高失配位错的半导体层。

公开(公告)号：US07303979B2

公开(公告)日：2007-12-04

申请号：US10818821

申请日：2004-04-06

申请人： Hideo Yamagata ,  Takeyoshi Koumoto ,  Kenji Atsuumi ,  Yoichi Negoro ,  Tatsushiro Hirata ,  Takashi Noguchi

发明人： Hideo Yamagata ,  Takeyoshi Koumoto ,  Kenji Atsuumi ,  Yoichi Negoro ,  Tatsushiro Hirata ,  Takashi Noguchi

IPC分类号： H01L21/322

CPC分类号： H01L21/02505 ,  C30B25/02 ,  C30B29/52 ,  H01L21/02381 ,  H01L21/0245 ,  H01L21/02488 ,  H01L21/02502 ,  H01L21/0251 ,  H01L21/02532 ,  H01L21/0262 ,  H01L21/02636 ,  H01L29/66242

摘要： In a vapor-phase growth method in which a silicon-germanium mixed crystal layer is deposited on a semiconductor substrate, the vapor-phase growth method comprises a first step of introducing silicon raw material gas into a reaction furnace in such a manner that a silicon raw material gas partial pressure increases in proportion to a time to thereby deposit a first semiconductor layer of a silicon layer on the semiconductor substrate under reduced pressure, a second step of introducing silicon raw material gas and germanium raw material gas into the reaction furnace in such a manner that a desired germanium concentration may be obtained to thereby deposit a second semiconductor layer of a silicon-germanium mixed crystal layer on the first semiconductor layer under reduced pressure and a third step of introducing silicon raw material gas into the reaction furnace under reduced pressure to thereby deposit a third semiconductor layer of a silicon layer on the second semiconductor layer. Thus, there can be obtained a semiconductor layer in which a misfit dislocation can be improved.

摘要翻译： 在半导体基板上沉积硅 - 锗混晶层的气相生长方法中，气相生长方法包括将硅原料气体引入反应炉的第一步骤，即将硅 原料气体分压与时间成比例地增加，从而在半导体衬底上沉积硅层的第一半导体层减压，第二步是将硅原料气体和锗原料气体引入反应炉中 可以获得期望的锗浓度，从而在减压下在第一半导体层上沉积硅 - 锗混合晶体层的第二半导体层，并且在减压下将硅原料气体引入反应炉中的第三步骤 从而在第二半导体层上沉积硅层的第三半导体层。 因此，可以获得其中可以提高失配位错的半导体层。

公开(公告)号：US07157344B2

公开(公告)日：2007-01-02

申请号：US10204386

申请日：2001-12-20

申请人： Hideo Yamagata ,  Takeyoshi Koumoto ,  Kenji Atsuumi ,  Yoichi Negoro ,  Tatsushiro Hirata ,  Takashi Noguchi

发明人： Hideo Yamagata ,  Takeyoshi Koumoto ,  Kenji Atsuumi ,  Yoichi Negoro ,  Tatsushiro Hirata ,  Takashi Noguchi

IPC分类号： H01L21/331

CPC分类号： H01L21/02505 ,  C30B25/02 ,  C30B29/52 ,  H01L21/02381 ,  H01L21/0245 ,  H01L21/02488 ,  H01L21/02502 ,  H01L21/0251 ,  H01L21/02532 ,  H01L21/0262 ,  H01L21/02636 ,  H01L29/66242

摘要： In a vapor-phase growth method in which a silicon-germanium mixed crystal layer is deposited on a semiconductor substrate, the vapor-phase growth method comprises a first step of introducing silicon raw material gas into a reaction furnace in such a manner that a silicon raw material gas partial pressure increases in proportion to a time to thereby deposit a first semiconductor layer of a silicon layer on the semiconductor substrate under reduced pressure, a second step of introducing silicon raw material gas and germanium raw material gas into the reaction furnace in such a manner that a desired germanium concentration may be obtained to thereby deposit a second semiconductor layer of a silicon-germanium mixed crystal layer on the first semiconductor layer under reduced pressure and a third step of introducing silicon raw material gas into the reaction furnace under reduced pressure to thereby deposit a third semiconductor layer of a silicon layer on the second semiconductor layer. Thus, there can be obtained a semiconductor layer in which a misfit dislocation can be improved.