公开(公告)号：US06419462B1

公开(公告)日：2002-07-16

申请号：US09627779

申请日：2000-07-28

申请人： Kuniaki Horie ,  Yukio Fukunaga ,  Akihisa Hongo ,  Kiwamu Tsukamoto ,  Kenji Kamoda ,  Hirotake Yamagishi ,  Shinya Uemura

发明人： Kuniaki Horie ,  Yukio Fukunaga ,  Akihisa Hongo ,  Kiwamu Tsukamoto ,  Kenji Kamoda ,  Hirotake Yamagishi ,  Shinya Uemura

IPC分类号： F04B4310

CPC分类号： F04B13/00 ,  F04B43/02 ,  F04B43/073 ,  F04B43/113 ,  F04B53/143 ,  F04B2205/07

摘要： A positive displacement liquid-delivery apparatus includes a positive displacement pump 110 and a differential pressure control unit 142. The positive displacement pump 110 includes a liquid-delivery chamber 128 having a watertight housing 122 with one part formed of a flexible diaphragm 124, and a diaphragm driver 136 linked to the diaphragm 124 for deforming the same to discharge fluid from the liquid-delivery chamber 128. The differential pressure control unit 142 uniformly controls the differential pressure inside and outside the diaphragm 124 during the pumping process.

摘要翻译： 正排量输送装置包括容积泵110和差压控制单元142.正排量泵110包括具有防水外壳122的液体输送室128，其中一部分由柔性膜片124形成， 膜片驱动器136连接到隔膜124，用于使其变形以从液体输送室128排出流体。差压控制单元142在泵送过程期间均匀地控制膜片124内部和外部的压差。

公开(公告)号：US20090301395A1

公开(公告)日：2009-12-10

申请号：US12543832

申请日：2009-08-19

申请人： Masahiko SEKIMOTO ,  Yasuhiko Endo ,  Stephen Strausser ,  Takashi Takemura ,  Nobutoshi Saito ,  Fumio Kuriyama ,  Junichiro Yoshioka ,  Kuniaki Horie ,  Yoshio Minami ,  Kenji Kamoda

发明人： Masahiko SEKIMOTO ,  Yasuhiko Endo ,  Stephen Strausser ,  Takashi Takemura ,  Nobutoshi Saito ,  Fumio Kuriyama ,  Junichiro Yoshioka ,  Kuniaki Horie ,  Yoshio Minami ,  Kenji Kamoda

IPC分类号： B05C13/02

CPC分类号： C25D5/022 ,  C25D7/123 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/67173 ,  H01L21/6723 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2224/05647 ,  H01L2924/00014

摘要： A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section (28) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit (34) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film (504) on the surface of the seed layer formed on the substrate.

摘要翻译： 电镀装置具有灰化单元（300），其被配置为对施加在形成在基板（W）上的籽晶层（500）的表面上的抗蚀剂（502）和预润湿部分（26）进行灰化处理， 被配置为在灰化过程之后向基板的表面提供亲水性。 电镀装置包括预浸渍部分（28），其被配置为使基材的表面与处理溶液接触以清洁或活化形成在基材上的种子层的表面。 电镀装置还包括电镀单元（34），其被配置为在将抗蚀剂用作掩模的同时使基板的表面进入电镀槽中的镀液中，以在该表面上形成镀膜（504） 种子层形成在基底上。

公开(公告)号：US20130015075A1

公开(公告)日：2013-01-17

申请号：US13616050

申请日：2012-09-14

申请人： Masahiko SEKIMOTO ,  Yasuhiko Endo ,  Stephen Strausser ,  Takashi Takemura ,  Nobutoshi Saito ,  Fumio Kuriyama ,  Junichiro Yoshioka ,  Kuniaki Horie ,  Yoshio Minami ,  Kenji Kamoda

发明人： Masahiko SEKIMOTO ,  Yasuhiko Endo ,  Stephen Strausser ,  Takashi Takemura ,  Nobutoshi Saito ,  Fumio Kuriyama ,  Junichiro Yoshioka ,  Kuniaki Horie ,  Yoshio Minami ,  Kenji Kamoda

IPC分类号： C25D5/02 ,  C25D17/00

CPC分类号： C25D5/022 ,  C25D7/123 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/67173 ,  H01L21/6723 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2224/05647 ,  H01L2924/00014

摘要： A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section (28) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit (34) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film (504) on the surface of the seed layer formed on the substrate.