公开(公告)号：US20130015075A1

公开(公告)日：2013-01-17

申请号：US13616050

申请日：2012-09-14

申请人： Masahiko SEKIMOTO ,  Yasuhiko Endo ,  Stephen Strausser ,  Takashi Takemura ,  Nobutoshi Saito ,  Fumio Kuriyama ,  Junichiro Yoshioka ,  Kuniaki Horie ,  Yoshio Minami ,  Kenji Kamoda

发明人： Masahiko SEKIMOTO ,  Yasuhiko Endo ,  Stephen Strausser ,  Takashi Takemura ,  Nobutoshi Saito ,  Fumio Kuriyama ,  Junichiro Yoshioka ,  Kuniaki Horie ,  Yoshio Minami ,  Kenji Kamoda

IPC分类号： C25D5/02 ,  C25D17/00

CPC分类号： C25D5/022 ,  C25D7/123 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/67173 ,  H01L21/6723 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2224/05647 ,  H01L2924/00014

摘要： A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section (28) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit (34) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film (504) on the surface of the seed layer formed on the substrate.

公开(公告)号：US20090301395A1

公开(公告)日：2009-12-10

申请号：US12543832

申请日：2009-08-19

申请人： Masahiko SEKIMOTO ,  Yasuhiko Endo ,  Stephen Strausser ,  Takashi Takemura ,  Nobutoshi Saito ,  Fumio Kuriyama ,  Junichiro Yoshioka ,  Kuniaki Horie ,  Yoshio Minami ,  Kenji Kamoda

发明人： Masahiko SEKIMOTO ,  Yasuhiko Endo ,  Stephen Strausser ,  Takashi Takemura ,  Nobutoshi Saito ,  Fumio Kuriyama ,  Junichiro Yoshioka ,  Kuniaki Horie ,  Yoshio Minami ,  Kenji Kamoda

IPC分类号： B05C13/02

CPC分类号： C25D5/022 ,  C25D7/123 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/67173 ,  H01L21/6723 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2224/05647 ,  H01L2924/00014

摘要： A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section (28) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit (34) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film (504) on the surface of the seed layer formed on the substrate.

摘要翻译： 电镀装置具有灰化单元（300），其被配置为对施加在形成在基板（W）上的籽晶层（500）的表面上的抗蚀剂（502）和预润湿部分（26）进行灰化处理， 被配置为在灰化过程之后向基板的表面提供亲水性。 电镀装置包括预浸渍部分（28），其被配置为使基材的表面与处理溶液接触以清洁或活化形成在基材上的种子层的表面。 电镀装置还包括电镀单元（34），其被配置为在将抗蚀剂用作掩模的同时使基板的表面进入电镀槽中的镀液中，以在该表面上形成镀膜（504） 种子层形成在基底上。

公开(公告)号：US20060141157A1

公开(公告)日：2006-06-29

申请号：US10544623

申请日：2004-05-25

申请人： Masahiko Sekimoto ,  Yasuhiko Endo ,  Stephen Strausser ,  Takashi Takemura ,  Nobutoshi Saito ,  Fumio Kuriyama ,  Junichiro Yoshioka ,  Kuniaki Horie ,  Yoshio Minami

发明人： Masahiko Sekimoto ,  Yasuhiko Endo ,  Stephen Strausser ,  Takashi Takemura ,  Nobutoshi Saito ,  Fumio Kuriyama ,  Junichiro Yoshioka ,  Kuniaki Horie ,  Yoshio Minami

IPC分类号： B05D1/32 ,  B05D3/00 ,  B05D1/18 ,  B05C11/00 ,  B05C3/00 ,  B05D5/00

CPC分类号： C25D5/022 ,  C25D7/123 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/67173 ,  H01L21/6723 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2224/05647 ,  H01L2924/00014

摘要： A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section (28) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit (34) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film (504) on the surface of the seed layer formed on the substrate.

摘要翻译： 电镀装置具有灰化单元（300），其被配置为对施加在形成在基板（W）上的籽晶层（500）的表面上的抗蚀剂（502）和预润湿部分（26）进行灰化处理， 被配置为在灰化过程之后向基板的表面提供亲水性。 电镀装置包括预浸渍部分（28），其被配置为使基材的表面与处理溶液接触以清洁或活化形成在基材上的种子层的表面。 电镀装置还包括电镀单元（34），其被配置为在将抗蚀剂用作掩模的同时使基板的表面进入电镀槽中的镀液中，以在该表面上形成镀膜（504） 种子层形成在基底上。

公开(公告)号：US20060081478A1

公开(公告)日：2006-04-20

申请号：US11251799

申请日：2005-10-18

申请人： Tsuyoshi Sahoda ,  Tsutomu Nakada ,  Nobutoshi Saito ,  Junichiro Yoshioka ,  Fumio Kuriyama ,  Masunobu Onozawa

发明人： Tsuyoshi Sahoda ,  Tsutomu Nakada ,  Nobutoshi Saito ,  Junichiro Yoshioka ,  Fumio Kuriyama ,  Masunobu Onozawa

IPC分类号： C25D5/20 ,  C25D17/00 ,  C25B9/00

CPC分类号： H01L21/76877 ,  C25D5/08 ,  C25D5/18 ,  C25D7/123 ,  C25D17/001 ,  C25D17/008 ,  C25D17/02 ,  C25D21/10 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/76849 ,  H01L23/53238 ,  H01L24/11 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953

摘要： A plating apparatus employs a dipping method with good gas-bubble releasability and, by regulating the flow of plating solution in a plating tank, can enhance the in-plane uniformity of a thickness of a plated film. The plating apparatus includes a plating tank for holding a plating solution, a plating solution jet nozzle having a slit-like plating solution jet orifice for jetting the plating solution toward a surface to be plated of an object to be plated disposed in the plating tank, and a plating solution supply section for supplying the plating solution to the plating solution jet nozzle.

摘要翻译： 电镀装置采用具有良好的气泡剥离性的浸渍方法，并且通过调节电镀槽中的电镀液的流动，可以提高镀膜厚度的面内均匀性。 电镀装置包括用于保持电镀液的电镀槽，具有狭缝状电镀液喷射孔的电镀液喷射喷嘴，用于将电镀液朝向被镀设置在电镀槽内的被镀物体的表面喷射， 以及用于将电镀液供给到电镀液喷嘴的电镀液供给部。

公开(公告)号：US20050092600A1

公开(公告)日：2005-05-05

申请号：US11002060

申请日：2004-12-03

申请人： Junichiro Yoshioka ,  Seiji Katsuoka ,  Masahiko Sekimoto ,  Yasuhiko Endo ,  Yugang Guo

发明人： Junichiro Yoshioka ,  Seiji Katsuoka ,  Masahiko Sekimoto ,  Yasuhiko Endo ,  Yugang Guo

IPC分类号： C25D7/12 ,  C25D17/06 ,  C25D19/00 ,  H01L21/00 ,  H01L21/60 ,  H01L21/683 ,  H01L21/687 ,  C25D17/00

CPC分类号： H01L21/67126 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  H01L21/68721 ,  H01L21/68764 ,  H01L21/68785

摘要： A substrate holder holds a substrate while hermetically sealing an outer circumferential edge and a reverse side of the substrate and exposing a surface of the substrate. The substrate holder has a base and a cover having an opening defined therein and positioned to place the substrate between the base and the cover. An attracting mechanism couples the base and the cover to each other to hold the substrate between the base and the cover, with the surface of the substrate being exposed through the opening.

摘要翻译： 衬底保持器保持衬底，同时气密地密封衬底的外周边缘和反面，并暴露衬底的表面。 衬底保持器具有基部和盖，其具有限定在其中的开口并且定位成将基板放置在基部和盖之间。 吸引机构将基部和盖彼此连接以将基板保持在基部和盖之间，其中基板的表面通过开口露出。

公开(公告)号：US06844274B2

公开(公告)日：2005-01-18

申请号：US10638523

申请日：2003-08-12

申请人： Junichiro Yoshioka ,  Seiji Katsuoka ,  Masahiko Sekimoto ,  Yasuhiko Endo ,  Yugang Guo

发明人： Junichiro Yoshioka ,  Seiji Katsuoka ,  Masahiko Sekimoto ,  Yasuhiko Endo ,  Yugang Guo

IPC分类号： C25D7/12 ,  C25D17/06 ,  C25D19/00 ,  H01L21/00 ,  H01L21/60 ,  H01L21/683 ,  H01L21/687 ,  B25B11/00 ,  C25B9/00

CPC分类号： H01L21/67126 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  H01L21/68721 ,  H01L21/68764 ,  H01L21/68785

摘要： A substrate holder holds a substrate while hermetically sealing an outer circumferential edge and a reverse side of the substrate and exposing a surface of the substrate. The substrate holder has a base and a cover having an opening defined therein and positioned to place the substrate between the base and the cover. An attracting mechanism couples the base and the cover to each other to hold the substrate between the base and the cover, with the surface of the substrate being exposed through the opening.

公开(公告)号：US08133376B2

公开(公告)日：2012-03-13

申请号：US12871083

申请日：2010-08-30

申请人： Junichiro Yoshioka ,  Seiji Katsuoka ,  Masahiko Sekimoto ,  Yasuhiko Endo ,  Yugang Guo

发明人： Junichiro Yoshioka ,  Seiji Katsuoka ,  Masahiko Sekimoto ,  Yasuhiko Endo ,  Yugang Guo

IPC分类号： C25D7/12

CPC分类号： H01L21/67126 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  H01L21/68721 ,  H01L21/68764 ,  H01L21/68785

摘要： A plating method and a plating apparatus, which has a plurality of plating units, for plating a substrate. Each of the plating units includes a plating tank for containing a plating solution therein, a water cleaning tank, disposed adjacent to said plating tank for cleaning the substrate with water, a substrate holder for holding the substrate in a vertical orientation, a vertical displacing mechanism for vertically dipping the substrate holder and a substrate held thereby in the plating solution in the plating tank, and a lateral displacing mechanism or a back-and-forth displacing mechanism for moving the substrate holder while holding the substrate in a vertical orientation between the plating tank and the water cleaning tank. The plating unit also includes a loading/unloading station for loading and unloading the substrate, and a transfer device for transferring the substrate between the plating unit and the loading/unloading station.

摘要翻译： 一种电镀方法和电镀装置，其具有用于电镀基板的多个电镀单元。 每个电镀单元包括用于在其中容纳电镀液的电镀槽，与所述电镀槽相邻设置的用于清洁衬底的水的清洗槽，用于将衬底保持在垂直取向的衬底保持器，垂直位移机构 用于将衬底保持器和由此保持在电镀液中的电镀溶液中的衬底垂直浸入电镀槽中，以及横向移位机构或前后移位机构，用于使衬底保持器移动，同时将衬底沿着垂直取向保持在电镀 水箱和清水箱。 电镀单元还包括用于装载和卸载基板的装载/卸载站，以及用于在电镀单元和装载/卸载站之间传送基板的传送装置。

公开(公告)号：US07807027B2

公开(公告)日：2010-10-05

申请号：US11002060

申请日：2004-12-03

申请人： Junichiro Yoshioka ,  Seiji Katsuoka ,  Masahiko Sekimoto ,  Yasuhiko Endo ,  Yugang Guo

发明人： Junichiro Yoshioka ,  Seiji Katsuoka ,  Masahiko Sekimoto ,  Yasuhiko Endo ,  Yugang Guo

IPC分类号： C25D17/00

CPC分类号： H01L21/67126 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  H01L21/68721 ,  H01L21/68764 ,  H01L21/68785

摘要： A plating method and a plating apparatus, which has a plurality of plating units, for plating a substrate. Each of the plating units includes a plating tank for containing a plating solution therein, a water cleaning tank, disposed adjacent to said plating tank for cleaning the substrate with water, a substrate holder for holding the substrate in a vertical orientation, a vertical displacing mechanism for vertically dipping the substrate holder and a substrate held thereby in the plating solution in the plating tank, and a lateral displacing mechanism or a back-and-forth displacing mechanism for moving the substrate holder while holding the substrate in a vertical orientation between the plating tank and the water cleaning tank. The plating unit also includes a loading/unloading station for loading and unloading the substrate, and a transfer device for transferring the substrate between the plating unit and the loading/unloading station.

摘要翻译： 一种电镀方法和电镀装置，其具有用于电镀基板的多个电镀单元。 每个电镀单元包括用于在其中容纳电镀液的电镀槽，与所述电镀槽相邻设置的用于清洁衬底的水的清洗槽，用于将衬底保持在垂直取向的衬底保持器，垂直位移机构 用于将衬底保持器和由此保持在镀液中的衬底垂直浸入电镀槽中，以及横向移位机构或前后移位机构，用于使衬底保持器移动，同时将衬底沿着垂直取向保持在电镀 水箱和清水箱。 电镀单元还包括用于装载和卸载基板的装载/卸载站，以及用于在电镀单元和装载/卸载站之间传送基板的传送装置。

公开(公告)号：US20050014368A1

公开(公告)日：2005-01-20

申请号：US10482476

申请日：2003-06-20

申请人： Junichiro Yoshioka ,  Kuniaki Horie ,  Yugang Guo ,  Satoshi Morikami

发明人： Junichiro Yoshioka ,  Kuniaki Horie ,  Yugang Guo ,  Satoshi Morikami

IPC分类号： C25D7/12 ,  C25D17/06 ,  H01L21/00 ,  H01L21/288 ,  H01L21/60 ,  H01L21/687 ,  H01L21/302

CPC分类号： C25D17/001 ,  C25D7/12 ,  C25D7/123 ,  C25D17/004 ,  C25D17/005 ,  C25D17/06 ,  C25D17/08 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/67126 ,  H01L21/67253 ,  H01L21/6838 ,  H01L21/687 ,  H01L21/68728 ,  H01L21/68764 ,  H01L21/76879 ,  H01L24/11 ,  H01L24/742 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11462 ,  H01L2224/13099 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2224/05599

摘要： The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of it easily and securely, and also a plating apparatus provided with the substrate holder. A substrate holder (18), includes: a fixed holding member (54) and a movable holding member (58) for holding a substrate (W) therebetween; a sealing member (68) mounted to the fixed holding member (54) or the movable holding member (58); and a suction pad (94) for attracting a back surface of the substrate (W) held between the fixed holding member (54) and the movable holding member (58).

摘要翻译： 本发明提供一种能够通过密封构件进行更完全的密封的基板保持件，并且能够容易且牢固地将基板从其中取出，以及设置有基板保持件的电镀装置。 一种基板保持架（18），包括：固定保持部件（54）和用于在其间保持基板（W）的可动保持部件（58） 安装到固定保持构件（54）或可动保持构件（58）上的密封构件（68）; 以及用于吸引保持在固定保持部件（54）与可动保持部件（58）之间的基板（W）的背面的吸盘（94）。

公开(公告)号：US08337680B2

公开(公告)日：2012-12-25

申请号：US13017294

申请日：2011-01-31

申请人： Junichiro Yoshioka ,  Kuniaki Horie ,  Yugang Guo ,  Satoshi Morikami

发明人： Junichiro Yoshioka ,  Kuniaki Horie ,  Yugang Guo ,  Satoshi Morikami

IPC分类号： C25B9/02

CPC分类号： C25D17/001 ,  C25D7/12 ,  C25D7/123 ,  C25D17/004 ,  C25D17/005 ,  C25D17/06 ,  C25D17/08 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/67126 ,  H01L21/67253 ,  H01L21/6838 ,  H01L21/687 ,  H01L21/68728 ,  H01L21/68764 ,  H01L21/76879 ,  H01L24/11 ,  H01L24/742 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11462 ,  H01L2224/13099 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2224/05599

摘要： The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.

摘要翻译： 本发明提供一种能够利用密封构件进行更完全的密封的衬底保持器，并且可以容易且牢固地将衬底从衬底保持器中取出，以及设置有衬底保持器的电镀设备。 衬底保持器包括：固定保持构件和用于在其间保持衬底的可动保持构件; 安装到所述固定保持构件或所述可动保持构件的密封构件; 以及用于吸引保持在固定保持构件和可动保持构件之间的基板的背面的吸盘。