Method and apparatus for fixturing substrate assemblies for electrolytic
plating
    2.
    发明授权
    Method and apparatus for fixturing substrate assemblies for electrolytic plating 失效
    用于固定用于电解电镀的基板组件的方法和装置

    公开(公告)号:US5871629A

    公开(公告)日:1999-02-16

    申请号:US716487

    申请日:1996-09-18

    摘要: A fixture for securing a pin grid array (PGA) and grounding all circuits or pins in the PGA for electrolytic plating provides a series of parallel wires that are inserted between every other gap between the PGA pin rows. The cross section of each wire is constructed to provide a first cross sectional width at one location that is less than or equal to the PGA gap width for insertion into the PGA gap and a second cross sectional width, at an angle to the first cross sectional width, that is greater than the gap width. With this arrangement, the wire can be inserted in the gap with the first cross sectional width traversing the gap and then rotated to bring the wider, second cross sectional width into spreading engagement with the pins for a reliable mechanical and conductive contact.

    摘要翻译: 用于固定针栅阵列(PGA)并将PGA中的所有电路或引脚接地用于电解电镀的夹具提供一系列平行导线,插入PGA引脚列之间的每隔一个间隙。 每个导线的横截面被构造成在一个位置处提供小于或等于用于插入PGA间隙的PGA间隙宽度的第一横截面宽度和与第一横截面呈角度的第二横截面宽度 宽度大于间隙宽度。 利用这种布置,线可以插入到具有穿过间隙的第一横截面宽度的间隙中,然后旋转以使较宽的第二横截面宽度与销扩展接合以获得可靠的机械和导电接触。