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1.发明授权Method for validating printed circuit board materials for high speed applications 失效用于高速应用的印刷电路板材料的验证方法公开(公告)号：US07701222B2
公开(公告)日：2010-04-20
申请号：US11875001
申请日：2007-10-19
Applicant: Moises Cases , Bradley Donald Herrman , Kent Barclay Howieson , Erdem Matoglu , Bhyrav Murthy Mutnury , Pravin Patel , Nam Huu Pham , Caleb James Wesley
Inventor： Moises Cases , Bradley Donald Herrman , Kent Barclay Howieson , Erdem Matoglu , Bhyrav Murthy Mutnury , Pravin Patel , Nam Huu Pham , Caleb James Wesley
CPC classification number: G01N25/72 , G01J5/0096 , G01R31/2818 , G01R31/2837 , G01R31/309
Abstract: A method for testing a printed circuit board to determining the dielectric loss associated with the circuit board material relative to a standard. Dielectric losses in the material generate heat when a high frequency electronic signal, such as a microwave frequency signal, is communicated through a microstrip that is embedded within the printed circuit board. The temperature or spectrum at the surface of printed circuit board is measured and compared against the temperature or spectrum of the standard to determine whether the material under test is acceptable. While various temperature measurement devices may be used, the temperature is preferably measured without contacting the surface, such as using an infrared radiation probe.
Abstract translation: 一种用于测试印刷电路板以确定与电路板材料相关的介电损耗相对于标准的方法。 当诸如微波频率信号的高频电子信号通过嵌入在印刷电路板内的微带传输时，材料中的介电损耗产生热量。 测量印刷电路板表面的温度或光谱，并与标准品的温度或光谱进行比较，以确定被测材料是否可接受。 尽管可以使用各种温度测量装置，但是优选地在不接触表面的情况下测量温度，例如使用红外辐射探针。
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公开(公告)号：US07525319B1
公开(公告)日：2009-04-28
申请号：US12200208
申请日：2008-08-28
Applicant: Rubina Firdaus Ahmed , Moises Cases , Bradley Donald Herrman , Kent Barclay Howieson , Bhyrav Murthy Mutnury , Pravin Patel , Peter Robert Seidel
Inventor： Rubina Firdaus Ahmed , Moises Cases , Bradley Donald Herrman , Kent Barclay Howieson , Bhyrav Murthy Mutnury , Pravin Patel , Peter Robert Seidel
CPC classification number: G01R31/046
Abstract: A method of electrically qualifying high speed printed circuit board (PCB) connectors includes mounting a PCB connector on a test card, sending bit patterns through a first portion of the test card, evaluating a waveform on a sense signal on a second portion of the test card for the bit patterns launched on said first portion of the test card to measure common mode noise, and comparing the measured common mode noise of the second portion of the test card to a golden standard performed on a pre-qualified connector. The first portion of the test card comprises connectors to inject bit patterns. The second portion of the test card includes a split plane which induces common mode noise on a sense signal, the sense signal, and a termination pack. If the measured common mode noise on the PCB connector is worse than the golden standard, then the PCB connector is disqualified. If the measured common mode noise on the PCB connector is as good as or better than the golden standard, then the PCB connector is qualified. A first section of the PCB connector connects to the first portion of the test card and a second section of the PCB connector connects to the second portion of the test card. Transmission lines in the test card and the sense line are tightly coupled by shortening a distance between the sense line and the transmission lines.
Abstract translation: 电气限定高速印刷电路板（PCB）连接器的方法包括将PCB连接器安装在测试卡上，通过测试卡的第一部分发送位模式，在测试的第二部分上评估感测信号上的波形 在测试卡的所述第一部分上发射的位模式的卡用于测量共模噪声，以及将测试卡的第二部分的测量的共模噪声与在预先标定的连接器上执行的黄金标准进行比较。 测试卡的第一部分包括用于注入位模式的连接器。 测试卡的第二部分包括在感测信号，感测信号和终端包上引起共模噪声的分离平面。 如果PCB连接器上测得的共模噪声比黄金标准差，则PCB连接器不合格。 如果PCB连接器上测得的共模噪声与黄金标准一样好或更好，则PCB连接器是合格的。 PCB连接器的第一部分连接到测试卡的第一部分，并且PCB连接器的第二部分连接到测试卡的第二部分。 通过缩短感测线和传输线之间的距离，测试卡和感测线中的传输线紧密耦合。
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3.发明申请Method for Validating Printed Circuit Board Materials for High Speed Applications 失效用于验证高速应用的印刷电路板材料的方法公开(公告)号：US20090102487A1
公开(公告)日：2009-04-23
申请号：US11875001
申请日：2007-10-19
Applicant: Moises Cases , Bradley Donald Herrman , Kent Barclay Howieson , Erdem Matoglu , Bhyrav Murthy Mutnury , Pravin Patel , Nam Huu Pham , Celeb James Wesley
Inventor： Moises Cases , Bradley Donald Herrman , Kent Barclay Howieson , Erdem Matoglu , Bhyrav Murthy Mutnury , Pravin Patel , Nam Huu Pham , Celeb James Wesley
CPC classification number: G01N25/72 , G01J5/0096 , G01R31/2818 , G01R31/2837 , G01R31/309
Abstract: A method for testing a printed circuit board to determining the dielectric loss associated with the circuit board material relative to a standard. Dielectric losses in the material generate heat when a high frequency electronic signal, such as a microwave frequency signal, is communicated through a microstrip that is embedded within the printed circuit board. The temperature or spectrum at the surface of printed circuit board is measured and compared against the temperature or spectrum of the standard to determine whether the material under test is acceptable. While various temperature measurement devices may be used, the temperature is preferably measured without contacting the surface, such as using an infrared radiation probe.
Abstract translation: 一种用于测试印刷电路板以确定与电路板材料相关的介电损耗相对于标准的方法。 当诸如微波频率信号的高频电子信号通过嵌入在印刷电路板内的微带传输时，材料中的介电损耗产生热量。 测量印刷电路板表面的温度或光谱，并与标准品的温度或光谱进行比较，以确定被测材料是否可接受。 尽管可以使用各种温度测量装置，但是优选地在不接触表面的情况下测量温度，例如使用红外辐射探针。
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