公开(公告)号：US4772496A

公开(公告)日：1988-09-20

申请号：US875034

申请日：1986-06-16

申请人： Masahiko Maeda ,  Kenzi Fuzitani ,  Yoshihiro Moteki

发明人： Masahiko Maeda ,  Kenzi Fuzitani ,  Yoshihiro Moteki

IPC分类号： H05K1/00 ,  H05K1/03 ,  H05K3/00 ,  C08L23/08

CPC分类号： H05K1/0326 ,  H05K1/036 ,  H05K3/0014 ,  H05K3/0064 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2203/1327 ,  Y10S428/901 ,  Y10T428/1359 ,  Y10T428/24917 ,  Y10T428/31692 ,  Y10T428/31699

摘要： A molded product having a printed circuit board on a thermoplastic layer is disclosed, the printed circuit board comprising a conductive metal layer and a thin-wall body containing a crosslinked product of a mixture of (A) 1 to 99 wt % of an ethylenic copolymer containing at least one monomer unit selected from the group consisting of monocarboxylic acid unit, dicarboxylic acid unit, acid anhydride unit thereof and half ester unit thereof and (B) 99 to 1 wt % of an ethylenic copolymer containing at least one monomer unit selected from the group consisting of hydroxyl unit, amino unit and oxirane unit.

摘要翻译： 公开了一种在热塑性层上具有印刷电路板的模制产品，印刷电路板包括导电金属层和薄壁体，该薄壁体含有（A）1-99重量％乙烯共聚物 含有选自单羧酸单元，二羧酸单元，其酸酐单元和其半酯单元的至少一种单体单元和（B）99至1重量％的含有至少一个选自以下的单体单元的乙烯共聚物： 由羟基单元，氨基单元和环氧乙烷单元组成的组。