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公开(公告)号：US09553006B2
公开(公告)日：2017-01-24
申请号：US13599692
申请日：2012-08-30
申请人： Kevin Ptasienski , Kevin Robert Smith , Cal Thomas Swanson , Philip Steven Schmidt , Mohammad Nosrati , Jacob Robert Lindley , Allen Norman Boldt , Sanhong Zhang , Louis P. Steinhauser , Dennis Stanley Grimard
发明人： Kevin Ptasienski , Kevin Robert Smith , Cal Thomas Swanson , Philip Steven Schmidt , Mohammad Nosrati , Jacob Robert Lindley , Allen Norman Boldt , Sanhong Zhang , Louis P. Steinhauser , Dennis Stanley Grimard
CPC分类号： H01L21/67103 , H01L21/67098 , H01L21/67109 , H01L21/67248 , H01L21/6833 , H05B1/00 , H05B1/02 , H05B1/0202 , H05B1/0227 , H05B1/0233 , H05B3/02 , H05B3/06 , H05B3/20 , H05B2203/005 , H05B2203/013 , H05B2213/03 , Y10T156/10
摘要： An apparatus, such as a heater, is provided that includes a base member having at least one fluid passageway. A two-phase fluid is disposed within the fluid passageway, a pressure of the two-phase fluid being controlled such that the two-phase fluid provides at least one of heating and cooling to the base member. A tuning layer is secured to the base member, and the tuning layer includes a plurality of zones. Furthermore, a component, such as a chuck by way of example, is secured to the tuning layer.
摘要翻译： 提供了一种诸如加热器的装置，其包括具有至少一个流体通道的基座构件。 两相流体设置在流体通道内，两相流体的压力被控制，使得两相流体提供加热和冷却至少一个到基底构件。 调谐层被固定到基底构件上，调谐层包括多个区域。 此外，通过示例的方式将诸如卡盘的部件固定到调谐层。
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公开(公告)号：US20130228548A1
公开(公告)日：2013-09-05
申请号：US13599781
申请日：2012-08-30
申请人： Kevin Ptasienski , Allen Norman Boldt , Janet Lea Smith , Cal Thomas Swanson , Mohammad Nosrati , Kevin Robert Smith
发明人： Kevin Ptasienski , Allen Norman Boldt , Janet Lea Smith , Cal Thomas Swanson , Mohammad Nosrati , Kevin Robert Smith
IPC分类号： H01L21/683
CPC分类号： H01L21/67103 , H01L21/67098 , H01L21/67109 , H01L21/67248 , H01L21/6833 , H05B1/00 , H05B1/02 , H05B1/0202 , H05B1/0227 , H05B1/0233 , H05B3/02 , H05B3/06 , H05B3/20 , H05B2203/005 , H05B2203/013 , H05B2213/03 , Y10T156/10
摘要： Methods of manufacturing a heater are provided that generally include forming a laminate having a dielectric layer, a first double-sided adhesive dielectric layer, and a conductive layer. Next, a circuit pattern is created into the conductive layer, and then the circuit pattern is covered with a second double-sided adhesive dielectric layer. The second double-sided adhesive dielectric layer is covered with a sacrificial layer, and then the heater is formed, the heater comprising the dielectric layer, the first double-sided adhesive dielectric layer, the conductive layer, and the second double-sided adhesive dielectric layer. Subsequently, the sacrificial layer is removed.
摘要翻译： 提供制造加热器的方法，其通常包括形成具有介电层，第一双面粘合介电层和导电层的层压体。 接下来，在导电层中形成电路图案，然后用第二双面粘合介电层覆盖电路图案。 第二双面粘合介电层被牺牲层覆盖，然后形成加热器，加热器包括电介质层，第一双面粘合介电层，导电层和第二双面粘合介电层 层。 随后，除去牺牲层。
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公开(公告)号：US10049903B2
公开(公告)日：2018-08-14
申请号：US13599781
申请日：2012-08-30
申请人： Kevin Ptasienski , Allen Norman Boldt , Janet Lea Smith , Cal Thomas Swanson , Mohammad Nosrati , Kevin Robert Smith
发明人： Kevin Ptasienski , Allen Norman Boldt , Janet Lea Smith , Cal Thomas Swanson , Mohammad Nosrati , Kevin Robert Smith
IPC分类号： H01B13/00 , B44C1/22 , C03C15/00 , C03C25/68 , H01L21/67 , H05B3/20 , H05B1/02 , H05B1/00 , H05B3/02 , H01L21/683 , H05B3/06
摘要： Methods of manufacturing a heater are provided that generally include forming a laminate having a dielectric layer, a first double-sided adhesive dielectric layer, and a conductive layer. Next, a circuit pattern is created into the conductive layer, and then the circuit pattern is covered with a second double-sided adhesive dielectric layer. The second double-sided adhesive dielectric layer is covered with a sacrificial layer, and then the heater is formed, the heater comprising the dielectric layer, the first double-sided adhesive dielectric layer, the conductive layer, and the second double-sided adhesive dielectric layer. Subsequently, the sacrificial layer is removed.
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公开(公告)号：US20130220575A1
公开(公告)日：2013-08-29
申请号：US13599692
申请日：2012-08-30
申请人： Kevin Ptasienski , Kevin Robert SMITH , Cal Thomas Swanson , Philip Steven Schmidt , Mohammad Nosrati , Jacob Robert Lindley , Allen Norman Boldt , Sanhong Zhang , Louis P. Steinhauser , Dennis Stanley Grimard
发明人： Kevin Ptasienski , Kevin Robert SMITH , Cal Thomas Swanson , Philip Steven Schmidt , Mohammad Nosrati , Jacob Robert Lindley , Allen Norman Boldt , Sanhong Zhang , Louis P. Steinhauser , Dennis Stanley Grimard
IPC分类号： H01L21/67 , H05B1/02 , H01L21/683
CPC分类号： H01L21/67103 , H01L21/67098 , H01L21/67109 , H01L21/67248 , H01L21/6833 , H05B1/00 , H05B1/02 , H05B1/0202 , H05B1/0227 , H05B1/0233 , H05B3/02 , H05B3/06 , H05B3/20 , H05B2203/005 , H05B2203/013 , H05B2213/03 , Y10T156/10
摘要： An apparatus, such as a heater, is provided that includes a base member having at least one fluid passageway. A two-phase fluid is disposed within the fluid passageway, a pressure of the two-phase fluid being controlled such that the two-phase fluid provides at least one of heating and cooling to the base member. A tuning layer is secured to the base member, and the tuning layer includes a plurality of zones. Furthermore, a component, such as a chuck by way of example, is secured to the tuning layer.
摘要翻译： 提供了一种诸如加热器的装置，其包括具有至少一个流体通道的基座构件。 两相流体设置在流体通道内，两相流体的压力被控制，使得两相流体提供加热和冷却至少一个到基底构件。 调谐层被固定到基底构件上，调谐层包括多个区域。 此外，通过示例的方式将诸如卡盘的部件固定到调谐层。
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公开(公告)号：US20130161305A1
公开(公告)日：2013-06-27
申请号：US13599648
申请日：2012-08-30
申请人： Kevin PTASIENSKI , Kevin Robert Smith , Cal Thomas Swanson , Philip Steven Schmidt , Mohammad Nosrati , Jacob Lindley , Allen Norman Boldt , Sanhong Zhang , Louis P. Steinhauser , Dennis Stanley Grimard
发明人： Kevin PTASIENSKI , Kevin Robert Smith , Cal Thomas Swanson , Philip Steven Schmidt , Mohammad Nosrati , Jacob Lindley , Allen Norman Boldt , Sanhong Zhang , Louis P. Steinhauser , Dennis Stanley Grimard
CPC分类号： H01L21/67103 , H01L21/67098 , H01L21/67109 , H01L21/67248 , H01L21/6833 , H05B1/00 , H05B1/02 , H05B1/0202 , H05B1/0227 , H05B1/0233 , H05B3/02 , H05B3/06 , H05B3/20 , H05B2203/005 , H05B2203/013 , H05B2213/03 , Y10T156/10
摘要： An apparatus is provided, by way of example, a heater for use in semiconductor processing equipment that includes a base functional layer having at least one functional zone. A substrate is secured to the base functional layer, and a tuning layer is secured to the substrate opposite the base functional layer. The tuning layer includes a plurality of zones that is greater in number than the zones of the base functional layer, and the tuning layer has lower power than the base functional layer. Further, a component, such as a chuck by way of example, is secured to the tuning layer opposite the substrate. The substrate defines a thermal conductivity to dissipate a requisite amount of power from the base functional layer.
摘要翻译： 例如，提供一种用于半导体处理设备的加热器，该加热器包括具有至少一个功能区的基本功能层。 将基板固定到基底功能层，并且调谐层固定到与基底功能层相对的基板。 调谐层包括多个区域，其数量大于基底功能层的区域，并且调谐层具有比基底功能层低的功率。 此外，通过示例的方式将诸如卡盘的部件固定到与基板相对的调谐层。 衬底限定热导率以从基底功能层消散所需量的功率。
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公开(公告)号：US09263305B2
公开(公告)日：2016-02-16
申请号：US13599648
申请日：2012-08-30
申请人： Kevin Ptasienski , Kevin Robert Smith , Cal Thomas Swanson , Philip Steven Schmidt , Mohammad Nosrati , Jacob Robert Lindley , Allen Norman Boldt , Sanhong Zhang , Louis P. Steinhauser , Dennis Stanley Grimard
发明人： Kevin Ptasienski , Kevin Robert Smith , Cal Thomas Swanson , Philip Steven Schmidt , Mohammad Nosrati , Jacob Robert Lindley , Allen Norman Boldt , Sanhong Zhang , Louis P. Steinhauser , Dennis Stanley Grimard
CPC分类号： H01L21/67103 , H01L21/67098 , H01L21/67109 , H01L21/67248 , H01L21/6833 , H05B1/00 , H05B1/02 , H05B1/0202 , H05B1/0227 , H05B1/0233 , H05B3/02 , H05B3/06 , H05B3/20 , H05B2203/005 , H05B2203/013 , H05B2213/03 , Y10T156/10
摘要： An apparatus is provided, by way of example, a heater for use in semiconductor processing equipment that includes a base functional layer having at least one functional zone. A substrate is secured to the base functional layer, and a tuning layer is secured to the substrate opposite the base functional layer. The tuning layer includes a plurality of zones that is greater in number than the zones of the base functional layer, and the tuning layer has lower power than the base functional layer. Further, a component, such as a chuck by way of example, is secured to the tuning layer opposite the substrate. The substrate defines a thermal conductivity to dissipate a requisite amount of power from the base functional layer.
摘要翻译： 例如，提供一种用于半导体处理设备的加热器，该加热器包括具有至少一个功能区的基本功能层。 将基板固定到基底功能层，并且调谐层固定到与基底功能层相对的基板。 调谐层包括多个区域，其数量大于基底功能层的区域，并且调谐层具有比基底功能层低的功率。 此外，通过示例的方式将诸如卡盘的部件固定到与基板相对的调谐层。 衬底限定热导率以从基底功能层消散所需量的功率。
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