公开(公告)号：US20100024990A1

公开(公告)日：2010-02-04

申请号：US12421097

申请日：2009-04-09

申请人： Lawrence J. Maher

发明人： Lawrence J. Maher

IPC分类号： B32B37/10

CPC分类号： B29C65/7841 ,  B29C66/532 ,  B29C66/81457 ,  B29C65/00

摘要： A press pad for bonding substrates into a radio-frequency and/or intermediate-frequency module. The module has a plurality of channels, each of which has an adhesive film for bonding the substrate. The press pad has a pad body conformal to the substrate and pairs of lateral protrusions extending from central axes of opposing surfaces of the pad body. The protrusions are in the forms of semicircular bumps or fins extending perpendicular to the opposing surfaces. Therefore, the lateral extent of the press pad within the channel is minimized, such that the misalignment and inclination of the press pad is minimized. Further, the lateral protrusions are fabricated from material operative to resist lateral pressure, such that deformation of the press pad caused by lateral pressure is also prevented. Therefore, pressure gradient and pressure loss are prevented.

摘要翻译： 一种用于将基板接合到射频和/或中频模块中的压垫。 模块具有多个通道，每个通道具有用于粘合基板的粘合膜。 压垫具有与基板共形的垫体，以及从垫体的相对表面的中心轴延伸的一对侧向突起。 突出物是垂直于相对表面延伸的半圆形凸起或翅片的形式。 因此，通道内的压垫的横向范围最小化，使得压垫的未对准和倾斜最小化。 此外，横向突起由可操作以抵抗横向压力的材料制成，从而也防止了由侧向压力引起的压垫的变形。 因此，防止压力梯度和压力损失。

公开(公告)号：US07534320B2

公开(公告)日：2009-05-19

申请号：US11274848

申请日：2005-11-15

申请人： Lawrence J. Maher

发明人： Lawrence J. Maher

IPC分类号： B32B37/00

CPC分类号： B29C65/7841 ,  B29C66/532 ,  B29C66/81457 ,  B29C65/00

摘要： A press pad for bonding substrates into a radio-frequency and/or intermediate-frequency module. The module has a plurality of channels, each of which has an adhesive film for bonding the substrate. The press pad has a pad body conformal to the substrate and pairs of lateral protrusions extending from central axes of opposing surfaces of the pad body. The protrusions are in the forms of semicircular bumps or fins extending perpendicular to the opposing surfaces. Therefore, the lateral extent of the press pad within the channel is minimized, such that the misalignment and inclination of the press pad is minimized. Further, the lateral protrusions are fabricated from material operative to resist lateral pressure, such that deformation of the press pad caused by lateral pressure is also prevented. Therefore, pressure gradient and pressure loss are prevented.

摘要翻译： 一种用于将基板接合到射频和/或中频模块中的压垫。 模块具有多个通道，每个通道具有用于粘合基板的粘合膜。 压垫具有与基板共形的垫体，以及从垫体的相对表面的中心轴延伸的一对侧向突起。 突出物是垂直于相对表面延伸的半圆形凸起或翅片的形式。 因此，通道内的压垫的横向范围最小化，使得压垫的未对准和倾斜最小化。 此外，横向突起由可操作以抵抗横向压力的材料制成，从而也防止了由侧向压力引起的压垫的变形。 因此，防止压力梯度和压力损失。

公开(公告)号：US07332374B2

公开(公告)日：2008-02-19

申请号：US11270842

申请日：2005-11-09

申请人： Lawrence J. Maher ,  Robert Churchill

发明人： Lawrence J. Maher ,  Robert Churchill

IPC分类号： H01L21/76

CPC分类号： H05K7/142 ,  H05K1/142 ,  H05K3/0061 ,  H05K3/007 ,  H05K3/386 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/167

摘要： A method is provided for manufacturing electronic module assemblies comprising a plurality of substrates and a housing. The method comprises providing an alignment plate having a plurality of protrusions disposed through an upper surface thereof, wherein the protrusions are positioned on the alignment plate according to a predetermined substrate layout pattern; positioning the substrates on the alignment plate in between respective ones of the protrusions such that repeatable gaps may be created between the substrates; applying strips of tape over common edges of the substrates to form a sheet of substrates; removing the sheet from the alignment plate; trimming excess tape from the sheet; cleaning the housing and sheet; placing an epoxy preform within the housing; placing the sheet of substrates onto the preform while aligning key artwork from the sheet to housing walls, pins or tabs integrally formed within the housing; securing the sheet of substrates within the housing using spot tape; vacuum curing the module assembly; and removing the tape from the module assembly.

摘要翻译： 提供了一种用于制造包括多个基板和壳体的电子模块组件的方法。 该方法包括提供一个具有穿过其上表面设置的多个突起的对准板，其中根据预定的基板布局图案将突起定位在对准板上; 将基板定位在相应的突起之间的对准板上，使得可在基板之间产生可重复的间隙; 在基片的共同边缘上施加条带以形成一片基片; 从对准板上取下纸张; 从纸张中修剪多余的胶带; 清洁外壳和板材; 将环氧预成型件放置在所述壳体内; 将片材的基片放置在预成型件上，同时将来自片材的关键艺术品与壳体内整体形成的壳体壁，销或翼片对准; 使用斑点胶带将基片片固定在外壳内; 真空固化模块总成; 并从模块组件中取出磁带。

公开(公告)号：US5730853A

公开(公告)日：1998-03-24

申请号：US641996

申请日：1996-04-25

申请人： Carl R. Smith ,  Marvin J. Back ,  Breton Johnson ,  John R. De Valle ,  Lawrence J. Maher

发明人： Carl R. Smith ,  Marvin J. Back ,  Breton Johnson ,  John R. De Valle ,  Lawrence J. Maher

IPC分类号： C23C26/00 ,  C23C28/02 ,  C25D5/12 ,  C25D5/34 ,  H05K1/05 ,  H05K3/44 ,  B05D1/36 ,  C25D5/44

CPC分类号： C23C26/00 ,  C23C28/023 ,  C25D5/12 ,  C25D5/34 ,  H05K1/05 ,  H05K3/44

摘要： A method for plating a graphite aluminum metal matrix composite material with nickel and gold utilizes the steps of: cleaning a surface of the metal matrix composite material so as to substantially remove grease and particulates therefrom; forming a layer of copper upon the surface of the metal matrix composite material; heating the copper layer to drive out entrapped fluids; applying acid to the copper layer to remove oxidation therefrom; forming a layer of nickel upon at least a portion of the layer of copper; heating the nickel layer to relieve stress therein; and electrolytically forming a layer of gold upon at least a portion of the layer of nickel.

摘要翻译： 一种用镍和金镀覆石墨铝金属基质复合材料的方法，采用以下步骤：清洗金属基质复合材料的表面，从而基本上除去油脂和微粒; 在金属基复合材料的表面上形成铜层; 加热铜层以驱除夹带的流体; 向铜层施加酸以除去氧化物; 在铜层的至少一部分上形成镍层; 加热镍层以减轻其中的应力; 并且在所述镍层的至少一部分上电解形成金层。