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公开(公告)号：US12122940B2
公开(公告)日：2024-10-22
申请号：US18555049
申请日：2022-03-30
发明人： Toshinori Hattori
IPC分类号： C09D5/18 , B27D1/04 , B27K3/20 , B27K3/32 , B32B21/04 , B32B21/13 , B32B21/14 , C09D1/00 , C09D5/14 , C09D5/16 , C09D7/40 , C09D7/61 , C09D191/06 , C08K3/013 , C08K3/015 , C08K3/36
CPC分类号： C09D5/18 , B27D1/04 , B27K3/20 , B27K3/32 , B32B21/042 , B32B21/13 , B32B21/14 , C09D1/00 , C09D5/14 , C09D5/16 , C09D5/185 , C09D7/61 , C09D7/69 , C09D7/70 , C09D191/06 , B27K2240/30 , B32B2255/08 , B32B2255/26 , B32B2255/28 , B32B2260/026 , B32B2260/046 , B32B2307/3065 , B32B2307/7376 , B32B2419/00 , C08K3/013 , C08K3/015 , C08K3/36
摘要： To provide a board material processing composition allowing for production of a board material laminate that is non-combustible and is excellent in adhesion performance. In order to solve this problem, a board material processing composition inhibiting combustion of a board material due to heating, comprises: a carbonization promotion component, being inorganic, promoting carbonization of an organic component within the board material at the heating; a chain inhibition component, being inorganic, inhibiting a reaction chain to a neighboring component due to a product of endothermic decomposition generated at the heating; and binder particles, being inorganic and hydrophobic, bonding the organic component within the board material to the carbonization promotion component and the chain inhibition component, wherein the carbonization promotion component includes boric acid, the chain inhibition component includes ammonium dihydrogen phosphate, and the binder particles include silica sand.
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2.发明公开公开(公告)号：US20240093041A1
公开(公告)日：2024-03-21
申请号：US18520889
申请日：2023-11-28
发明人： Toshinori HATTORI
CPC分类号： C09D5/18 , B32B21/13 , C09D5/14 , C09D5/16 , C09D7/61 , C09D191/06 , B32B2255/08 , B32B2255/26 , B32B2255/28 , B32B2260/026 , B32B2260/046 , B32B2307/3065 , B32B2419/00 , C08K3/36
摘要： To provide a board material processing composition allowing for production of a board material laminate that is non-combustible and is excellent in adhesion performance. In order to solve this problem, a board material processing composition inhibiting combustion of a board material due to heating, comprises: a carbonization promotion component, being inorganic, promoting carbonization of an organic component within the board material at the heating; a chain inhibition component, being inorganic, inhibiting a reaction chain to a neighboring component due to a product of endothermic decomposition generated at the heating; and binder particles, being inorganic and hydrophobic, bonding the organic component within the board material to the carbonization promotion component and the chain inhibition component, wherein the carbonization promotion component includes boric acid, the chain inhibition component includes ammonium dihydrogen phosphate, and the binder particles include silica sand.
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3.发明公开公开(公告)号：US20240124718A1
公开(公告)日：2024-04-18
申请号：US18555049
申请日：2022-03-30
发明人： Toshinori HATTORI
IPC分类号： C09D5/18 , B27D1/04 , B27K3/20 , B27K3/32 , B32B21/04 , B32B21/14 , C09D1/00 , C09D7/40 , C09D7/61
CPC分类号： C09D5/185 , B27D1/04 , B27K3/20 , B27K3/32 , B32B21/042 , B32B21/14 , C09D1/00 , C09D7/61 , C09D7/69 , C09D7/70 , B27K2240/30 , B32B2307/3065 , B32B2307/7376
摘要： To provide a board material processing composition allowing for production of a board material laminate that is non-combustible and is excellent in adhesion performance. In order to solve this problem, a board material processing composition inhibiting combustion of a board material due to heating, comprises: a carbonization promotion component, being inorganic, promoting carbonization of an organic component within the board material at the heating; a chain inhibition component, being inorganic, inhibiting a reaction chain to a neighboring component due to a product of endothermic decomposition generated at the heating; and binder particles, being inorganic and hydrophobic, bonding the organic component within the board material to the carbonization promotion component and the chain inhibition component, wherein the carbonization promotion component includes boric acid, the chain inhibition component includes ammonium dihydrogen phosphate, and the binder particles include silica sand.
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