摘要:
A metal nanoparticle composition includes an organic-stabilized metal nanoparticle and a solvent in which the solvent selected has the following Hansen solubility parameters: a dispersion parameter of about 16 MPa0.5 or more, and a sum of a polarity parameter and a hydrogen bonding parameter of about 8.0 MPa0.5 or less. The metal nanoparticle composition is suitable for printing conductive lines that are uniform, smooth and narrow on various substrate surfaces. The metal nanoparticle composition is able to form printed conductive features having a coffee ring effect ratio of about 1.2 to about 0.8, a surface roughness of about 15 or less and a line width of about 200 microns or less.
摘要:
A metal nanoparticle composition includes an organic-stabilized metal nanoparticle and a solvent in which the solvent selected has the following Hansen solubility parameters: a dispersion parameter of about 16 MPa0.5 or more, and a sum of a polarity parameter and a hydrogen bonding parameter of about 8.0 MPa0.5 or less. The metal nanoparticle composition is suitable for printing conductive lines that are uniform, smooth and narrow on various substrate surfaces. The metal nanoparticle composition is able to form printed conductive features having a coffee ring effect ratio of about 1.2 to about 0.8, a surface roughness of about 15 or less and a line width of about 200 microns or less.
摘要:
A composition that may be an electronic circuit element includes a metal nanoparticle, a silicone modified polyacrylate compound and a solvent. The silicone modified polyacrylate compound may be a silicone modified polyacrylate compound with at least one organic functional moiety. A method of forming conductive features on a substrate includes depositing a composition containing metal nanoparticles, a silicone modified polyacrylate compound and a solvent onto a substrate, and heating the deposited composition to a temperature from about 100° C. to about 200° C.
摘要:
A composition that may be an electronic circuit element includes a metal nanoparticle, a silicone modified polyacrylate compound and a solvent. The silicone modified polyacrylate compound may be a silicone modified polyacrylate compound with at least one organic functional moiety. A method of forming conductive features on a substrate includes depositing a composition containing metal nanoparticles, a silicone modified polyacrylate compound and a solvent onto a substrate, and heating the deposited composition to a temperature from about 100° C. to about 200° C.