Microsystem with a flexible membrane pressure sensor
    2.
    发明授权
    Microsystem with a flexible membrane pressure sensor 失效
    微系统具有柔性膜压传感器

    公开(公告)号:US06431005B1

    公开(公告)日:2002-08-13

    申请号:US09060607

    申请日:1998-04-15

    CPC classification number: G06K9/0002 G01L9/0042 G01L9/0073

    Abstract: A pressure sensor cell has a substrate including at least a first electrode and a deformable membrane. The membrane is fixed by its peripheral edge to the substrate and is spaced from the substrate to define a closed chamber around at least a part of the first electrode. A second electrode is provided formed on a wall of the membrane. The second electrode faces the first electrode and is kept separate from the first electrode if no pressure is exerted on the membrane. Finally, an electronic circuit is placed in the substrate under the first electrode.

    Abstract translation: 压力传感器单元具有至少包括第一电极和可变形膜的基板。 膜通过其外围边缘固定到基底并且与基底间隔开以限定围绕第一电极的至少一部分的封闭腔室。 提供形成在膜的壁上的第二电极。 如果没有压力施加在膜上,则第二电极面对第一电极并与第一电极分离。 最后,在第一电极下方的基板中放置电子电路。

    Method and zone for sealing between two microstructure substrates
    3.
    发明授权
    Method and zone for sealing between two microstructure substrates 有权
    两个微结构基片之间密封的方法和区域

    公开(公告)号:US07700457B2

    公开(公告)日:2010-04-20

    申请号:US10500196

    申请日:2002-12-17

    CPC classification number: B81B7/0077

    Abstract: The invention concerns a sealing zone between two microstructure substrates. Said sealing zone comprises at least the following parts: on a first wafer level (20), a lower edging (22A) made of an adhesive material capable of causing the first substrate (20) to adhere to a sealing material, said sealing material being adapted to spontaneously diffuse jointly with the material of the second wafer level (30); on said lower edging (22A), a layer of said sealing material; and on said layer of sealing material, a protuberance (36) formed on said second wafer level (30) containing a certain amount of sealing material. The invention is applicable to microstructures comprising vacuum-operated components.

    Abstract translation: 本发明涉及两个微结构基片之间的密封区。 所述密封区域至少包括以下部分:在第一晶片级(20)上,由能够使第一基板(20)粘附到密封材料上的粘合剂材料制成的下边缘(22A),所述密封材料 适于与第二晶片级(30)的材料共同扩散; 在所述下边缘(22A)上形成一层所述密封材料; 并且在所述密封材料层上形成有包含一定量的密封材料的所述第二晶片级(30)上的突起(36)。 本发明适用于包括真空操作部件的微结构。

    Process for manufacturing a microsystem with a flexible membrane for a pressure sensor

    公开(公告)号:US06435033B1

    公开(公告)日:2002-08-20

    申请号:US09814780

    申请日:2001-03-22

    Abstract: A process for manufacturing a microsystem for a pressure sensor includes the steps of deposit and forming a first conducting layer on a support. Deposit and forming a layer of sacrificial material covering the first conducting layer. Deposit and forming a second conducting layer on the layer of sacrificial material in the region located above the first conducting layer. Forming a first membrane layer covering and surrounding the layer of sacrificial material and the second conducting layer. Eliminating the layer of sacrificial material and forming the first membrane layer.

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