Epoxy resin compositions curable above 160 F. and below 250 F.
    2.
    发明授权
    Epoxy resin compositions curable above 160 F. and below 250 F. 失效
    环氧树脂组合物可在160°F以上和250°F以下固化。

    公开(公告)号:US4749729A

    公开(公告)日:1988-06-07

    申请号:US812345

    申请日:1985-12-23

    摘要: New and improved heat curable compositions are disclosed comprising epoxidic prepolymers and mono- and di-imidazole-carboxamides. The compositions are stable at room temperature, but cure readily at moderate temperatures of substantially less than about 250.degree. F., preferably at about 180.degree. F. to about 200.degree. F. and especially preferably at about 160.degree. F. to about 180.degree. F. The cured neat resins are useful as adhesives and as matrix resins in reinforced composites, with excellent physical properties.

    摘要翻译: 公开了新的和改进的可热固化组合物,其包含环氧预聚物和单 - 和二 - 咪唑 - 甲酰胺。 组合物在室温下是稳定的,但在基本上小于约250°F,优选约180°F至约200°F,特别优选约160°F至约180°的中等温度下易于固化。 F.固化的纯树脂可用作增强复合材料中的粘合剂和基体树脂,具有优异的物理性能。