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    Die carrier
    5.
    发明申请
    Die carrier 有权
    模具载体

    公开(公告)号：US20050136704A1

    公开(公告)日：2005-06-23

    申请号：US11032846

    申请日：2005-01-10

    申请人： Seang Malathong ,  Martin Hemmerling

    发明人： Seang Malathong ,  Martin Hemmerling

    IPC分类号： H01R33/76 ,  G01R1/04 ,  H01R12/00

    CPC分类号： G01R1/0466

    摘要： A die carrier is disclosed which is specifically designed for use in a TSOP socket. More specifically, the die carrier has a carrier substrate with carrier contacts thereon that are dimensioned specifically to match the positioning of the upper and lower socket contacts. The carrier substrate, being 145 microns thick, can also fit between the upper and lower socket contacts. A carrier base support component is located below a portion only of the carrier substrate, and does not impair insertion of the carrier substrate into the relatively small spacing between the upper and lower socket contacts. Damage to the carrier substrate is avoided by clamping edges of the carrier substrate from opposing sides between the upper and lower socket contacts. There are no screws or nuts within the carrier base support component that may increase its size and prevent it from being inserted into the socket. A double-sided, robust electrical connection is made by each respective pair of upper and lower socket contacts.

    摘要翻译： 公开了专门设计用于TSOP插座的模具载体。 更具体地，模具载体具有其上具有载体接触的载体基板，其尺寸特别地匹配上部和下部插座触头的定位。 145μm厚的载体衬底也可以装配在上和下插座触点之间。 载体基部支撑部件位于仅载体基板的一部分的下方，并且不会妨碍载体基板在上部和下部插座触点之间相对小的间隔中的插入。 通过将载体基板的边缘从上部和下部插座触头之间的相对侧夹紧来避免对载体基板的损坏。 载体基座支撑部件内没有螺丝或螺母，可能会增加其尺寸并防止其插入插座。 双面，坚固的电气连接由每对相应的上，下插座触点组成。