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公开(公告)号:US4254172A
公开(公告)日:1981-03-03
申请号:US34146
申请日:1979-04-27
CPC分类号: H05K1/056 , H05K3/445 , H05K2201/0195 , H05K2201/09581 , H05K2203/0759 , H05K2203/105 , H05K2203/1355 , H05K2203/1438 , Y10S428/901 , Y10T428/24273 , Y10T428/24322 , Y10T428/24777 , Y10T428/2495
摘要: A baseboard having through-holes for a printed circuit board which baseboard is made from a metal as a substrate, comprising at least one resin coat layer formed on the overall surface of the metal substrate including the inner wall surfaces of the through-holes and having, at the circumferential angular portions of the through-holes, a thickness larger than that on said upper and said lower surface of the metal substrate, and featured by its increased insulation characteristics at the circumferential angular portions of the through-holes.
摘要翻译: 一种具有用于印刷电路板的通孔的基板,该基板由作为基板的金属制成,包括形成在包括通孔的内壁表面的金属基板的整个表面上的至少一个树脂涂层,并且具有 在通孔的圆周角部分处的厚度大于金属基板的所述上表面和所述下表面上的厚度,其特征在于在通孔的圆周角部分增加绝缘特性。
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公开(公告)号:US4188415A
公开(公告)日:1980-02-12
申请号:US833359
申请日:1977-09-14
CPC分类号: H05K1/056 , H05K3/445 , H05K2201/0195 , H05K2201/09581 , H05K2203/0759 , H05K2203/105 , H05K2203/1355 , H05K2203/1438 , Y10S428/901 , Y10T428/24273 , Y10T428/24322 , Y10T428/24777 , Y10T428/2495
摘要: A baseboard having through-holes for a printed circuit board which baseboard is made from a metal as a substrate, comprising at least one resin coat layer formed on the overall surface of the metal substrate including the inner wall surfaces of the through-holes and having, at the circumferential angular portions of the through-holes, a thickness larger than that on said upper and said lower surface of the metal substrate, and featured by its increased insulation characteristics at the circumferential angular portions of the through-holes, and a method of producing the same.
摘要翻译: 一种具有用于印刷电路板的通孔的基板,该基板由作为基板的金属制成,包括形成在包括通孔的内壁表面的金属基板的整个表面上的至少一个树脂涂层,并且具有 在通孔的圆周角部分处的厚度大于金属基板的所述上表面和所述下表面上的厚度,并且其特征在于在通孔的周向角部分处的增加的绝缘特性,以及方法 生产相同。
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