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公开(公告)号：US06185481B2
公开(公告)日：2001-02-06
申请号：US08969361
申请日：1997-11-28
申请人： Yoshihiro Kondou , Tadakatsu Nakajima , Shigeo Ohashi , Susumu Iwai , Masayoshi Miyazaki , Shoohei Fuse , Kazuo Morita , Hidetada Fukunaka
发明人： Yoshihiro Kondou , Tadakatsu Nakajima , Shigeo Ohashi , Susumu Iwai , Masayoshi Miyazaki , Shoohei Fuse , Kazuo Morita , Hidetada Fukunaka
IPC分类号： G05B1300
CPC分类号： H05K7/20154 , H01L2924/0002 , H05K7/2019 , H01L2924/00
摘要： A semiconductor device provided with a first cooling fan and heat-radiating fins is mounted on a board, and there is provided a second cooling fan for supplying cooling air to the board, such that a flow passage is formed for directing the cooling air, supplied from the second cooling fan, toward the board through the first cooling fan.
摘要翻译： 设置有第一冷却风扇和散热翅片的半导体装置安装在基板上，并且设置有用于向板供给冷却空气的第二冷却风扇，从而形成用于引导冷却空气的流动通道，供给 从第二个冷却风扇，通过第一个冷却风扇朝向板子。
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公开(公告)号：USD432534S
公开(公告)日：2000-10-24
申请号：US109197
申请日：1999-08-12
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公开(公告)号：USD293242S
公开(公告)日：1987-12-15
申请号：US704723
申请日：1985-02-25
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公开(公告)号：US06438827B1
公开(公告)日：2002-08-27
申请号：US09491173
申请日：2000-01-25
申请人： Takuji Nakagawa , Yoshikazu Takagi , Masayoshi Miyazaki , Hideki Nakayama , Masaru Takahashi , Akira Nakamura
发明人： Takuji Nakagawa , Yoshikazu Takagi , Masayoshi Miyazaki , Hideki Nakayama , Masaru Takahashi , Akira Nakamura
IPC分类号： H01R4302
CPC分类号： H01G4/228 , H01F2027/295 , H01G4/232 , H05K3/3426 , Y02P70/613 , Y10T29/435 , Y10T29/4913 , Y10T29/49135 , Y10T29/49142 , Y10T29/49144 , Y10T29/49179
摘要： A ceramic electronic part includes at least one chip ceramic electronic part body having terminal electrodes and terminals provided on both sides. Each terminal is composed of a metal plate bent into a u shape. The outer face of a first leg of each bent terminal faces and is attached to a terminal electrode, and a second leg is attached to a substrate. The inner face of the bent terminal is provided with a solder-phobic surface not having affinity for solder, and the outer face of the bent terminal is provided with a solder-philic surface having high affinity for solder.
摘要翻译： 陶瓷电子部件包括至少一个芯片陶瓷电子部件体，其具有设置在两侧的端子电极和端子。 每个端子由弯曲成u形的金属板组成。 每个弯曲端子的第一腿的外表面面向并附接到端子电极，并且第二腿附接到基板。 弯曲端子的内表面设置有对焊料不具有亲和性的阻焊表面，并且弯曲端子的外表面具有对焊料具有高亲和力的耐焊接表面。
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公开(公告)号：US6046902A
公开(公告)日：2000-04-04
申请号：US121498
申请日：1998-07-23
申请人： Takuji Nakagawa , Yoshikazu Takagi , Masayoshi Miyazaki , Hideki Nakayama , Masaru Takahashi , Akira Nakamura
发明人： Takuji Nakagawa , Yoshikazu Takagi , Masayoshi Miyazaki , Hideki Nakayama , Masaru Takahashi , Akira Nakamura
CPC分类号： H01G4/228 , H01G4/232 , H05K3/3426 , H01F2027/295 , Y02P70/613 , Y10T29/435 , Y10T29/4913 , Y10T29/49135 , Y10T29/49142 , Y10T29/49144 , Y10T29/49179
摘要： A ceramic electronic part includes at least one chip ceramic electronic part body having terminal electrodes and terminals provided on both sides. Each terminal is composed of a metal plate bent into a U shape. The outer face of a first leg of each bent terminal faces and is attached to a terminal electrode, and a second leg is attached to a substrate. The inner face of the bent terminal is provided with a solder-phobic surface not having affinity for solder, and the outer face of the bent terminal is provided with a solder-philic surface having high affinity for solder.
摘要翻译： 陶瓷电子部件包括至少一个芯片陶瓷电子部件体，其具有设置在两侧的端子电极和端子。 每个端子由弯曲成U形的金属板组成。 每个弯曲端子的第一腿的外表面面向并附接到端子电极，并且第二腿附接到基板。 弯曲端子的内表面设置有对焊料不具有亲和性的阻焊表面，并且弯曲端子的外表面具有对焊料具有高亲和力的耐焊接表面。
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