公开(公告)号：US5428503A

公开(公告)日：1995-06-27

申请号：US317614

申请日：1994-09-26

申请人： Hitoshi Matsushima ,  Toshihiro Komatu ,  Yoshihiro Kondou ,  Toshio Hatada ,  Susumu Iwai ,  Tetsuro Honma ,  Toshiki Iino ,  Takao Ohba ,  Akira Yamagiwa

发明人： Hitoshi Matsushima ,  Toshihiro Komatu ,  Yoshihiro Kondou ,  Toshio Hatada ,  Susumu Iwai ,  Tetsuro Honma ,  Toshiki Iino ,  Takao Ohba ,  Akira Yamagiwa

IPC分类号： H05K7/20

CPC分类号： H05K7/20154 ,  Y10S165/908

摘要： A cooling apparatus for electronic equipment for improving the reliability of the equipment by making uniform the temperature distribution of heat generating devices mounted on the electronic equipment, more particularly on a computer and for reducing the working process required at the time of performing a maintenance of a printed circuit board in the electronic equipment by stacking, in a frame, the electronic printed circuit boards on which the heat generating devices, such as a CPU and memories, are mounted at predetermined intervals. The cooling apparatus has a fan fastened to one wall surface of a chamber and a plurality of jet cooling devices formed on the surface opposing the wall surface. The jet cooling devices are formed in parallel to the printed circuit boards. The jet cooling devices are slits, or nozzles or jet stream ducts extending among the printed circuit boards and are so formed as to supply cooling air in a jet stream state to each heat generating device. Therefore, the cooling air can be concentrated to locally cool the printed circuit board including the device that generates heat of a large heating value. Hence, the temperature rise in the heat generating devices can be made uniform.

摘要翻译： 一种用于电子设备的冷却装置，用于通过使安装在电子设备上的发热装置的温度分布均匀，更具体地在计算机上，并且为了减少进行维护时所需的工作过程而提高设备的可靠性 电子设备中的印刷电路板通过在框架中堆叠以预定间隔安装诸如CPU和存储器的发热装置的电子印刷电路板。 冷却装置具有固定在室的一个壁表面上的风扇和形成在与壁表面相对的表面上的多个喷射冷却装置。 喷射冷却装置与印刷电路板平行地形成。 喷射冷却装置是在印刷电路板之间延伸的狭缝或喷嘴或喷射流管道，并且形成为将喷射流状态的冷却空气供应到每个发热装置。 因此，冷却空气可以集中以局部冷却印刷电路板，包括产生大热值的热的装置。 因此，能够使发热元件的温度上升均匀。

公开(公告)号：US5195576A

公开(公告)日：1993-03-23

申请号：US659671

申请日：1991-02-25

申请人： Toshio Hatada ,  Hitoshi Matsushima ,  Yoshihiro Kondou ,  Hiroshi Inoue ,  Kanji Otsuka ,  Yuji Shirai ,  Takao Ohba ,  Akira Yamagiwa

发明人： Toshio Hatada ,  Hitoshi Matsushima ,  Yoshihiro Kondou ,  Hiroshi Inoue ,  Kanji Otsuka ,  Yuji Shirai ,  Takao Ohba ,  Akira Yamagiwa

IPC分类号： H01L23/473 ,  F28F3/02 ,  H01L23/367 ,  H01L23/467 ,  H05K7/10 ,  H05K7/20

CPC分类号： F28F3/022 ,  H01L23/3672 ,  H01L23/3677 ,  H01L23/467 ,  H05K7/1015 ,  H01L2224/45015 ,  H01L2224/49109 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01068 ,  H01L2924/16195

摘要： An LSI cooling apparatus having various structures is used in electronic devices such as computer systems. In particular, the LSI cooling of apparatus is suitable for cooling of LSIs having high heat generating densities. In a cooling apparatus of the present invention, a heat sink is constructed to be small in pressure loss and excellent in cooling performance. This is because the heat sink comprises thin wire fins so set that the Reynold's number may not exceed 40. As a result, LSIs generating a large amount of heat can be cooled. Further, a heat sink having rigidity can be obtained by disposing wide-width wire drawn substances in thin wires or by using supports. Further, a computer comprising LSIs equipped with heat sinks can cope with various cooling air sending methods and it can be cooled with low noises.

摘要翻译： 具有各种结构的LSI冷却装置用于诸如计算机系统的电子设备中。 特别地，装置的LSI冷却适用于具有高发热密度的LSI的冷却。 在本发明的冷却装置中，散热器的压力损失小，冷却性能优异。 这是因为散热器包括细线散热片，使得雷诺数不得超过40个。结果，可以冷却产生大量热量的LSI。 此外，通过将宽幅拉丝物质设置在细线中或通过使用支撑体，可以获得具有刚性的散热器。 此外，包括散热器的LSI的计算机可以应对各种冷却空气送出方法，并且可以以低噪声进行冷却。

公开(公告)号：US06185481B2

公开(公告)日：2001-02-06

申请号：US08969361

申请日：1997-11-28

申请人： Yoshihiro Kondou ,  Tadakatsu Nakajima ,  Shigeo Ohashi ,  Susumu Iwai ,  Masayoshi Miyazaki ,  Shoohei Fuse ,  Kazuo Morita ,  Hidetada Fukunaka

发明人： Yoshihiro Kondou ,  Tadakatsu Nakajima ,  Shigeo Ohashi ,  Susumu Iwai ,  Masayoshi Miyazaki ,  Shoohei Fuse ,  Kazuo Morita ,  Hidetada Fukunaka

IPC分类号： G05B1300

CPC分类号： H05K7/20154 ,  H01L2924/0002 ,  H05K7/2019 ,  H01L2924/00

摘要： A semiconductor device provided with a first cooling fan and heat-radiating fins is mounted on a board, and there is provided a second cooling fan for supplying cooling air to the board, such that a flow passage is formed for directing the cooling air, supplied from the second cooling fan, toward the board through the first cooling fan.

摘要翻译： 设置有第一冷却风扇和散热翅片的半导体装置安装在基板上，并且设置有用于向板供给冷却空气的第二冷却风扇，从而形成用于引导冷却空气的流动通道，供给 从第二个冷却风扇，通过第一个冷却风扇朝向板子。

公开(公告)号：US5361188A

公开(公告)日：1994-11-01

申请号：US115669

申请日：1993-09-02

申请人： Yoshihiro Kondou ,  Hitoshi Matsushima ,  Toshio Hatada ,  Hiroshi Inouye ,  Toshihiro Komatsu ,  Takao Ohba ,  Akira Yamagiwa

发明人： Yoshihiro Kondou ,  Hitoshi Matsushima ,  Toshio Hatada ,  Hiroshi Inouye ,  Toshihiro Komatsu ,  Takao Ohba ,  Akira Yamagiwa

IPC分类号： H05K7/20 ,  H01L23/467

CPC分类号： H01L23/467 ,  H05K7/20563 ,  H01L2224/32 ,  H01L2224/73253 ,  Y10S165/908

摘要： In a cooling apparatus of an electronic equipment, a plurality each of integrated circuit devices and large-scale integrated circuit devices are mounted onto a plurality of substrates, respectively, and a cooling fan supplies cooling air from outside to each of these integrated circuit devices. A duct having a comb-tooth shape suitable for encompassing each substrate and defining flow paths along the substrates introduces the cooling air supplied by the cooling fan to each of the integrated circuit devices. The duct includes a plurality of small holes disposed at positions corresponding to the positions of the integrated circuit devices on the substrates and having open areas corresponding to the heating values of the integrated circuit devices. The small holes flow the cooling air supplied by the cooling fan as jet streams to the integrated circuit devices. This jet stream cooling improves cooling performance and can make uniform the temperature distribution of the integrated circuit devices.

摘要翻译： 在电子设备的冷却装置中，分别将多个集成电路装置和大型集成电路装置安装在多个基板上，并且冷却风扇从外部向这些集成电路装置中的每一个提供冷却空气。 具有适于包围每个基板并且沿着基板限定流动路径的梳齿形状的管道将由冷却风扇供应的冷却空气引入到每个集成电路装置。 导管包括多个小孔，其设置在与基板上的集成电路器件的位置对应的位置处，并且具有与集成电路器件的发热值对应的开放区域。 这些小孔将作为喷射流的冷却风扇供给的冷却空气流向集成电路装置。 这种喷射流冷却改善了冷却性能，并且可以使集成电路器件的温度分布均匀。