High Transverse Thermal Conductivity Fiber Reinforced Polymeric Composites
    1.
    发明申请
    High Transverse Thermal Conductivity Fiber Reinforced Polymeric Composites 审中-公开
    高横向导热纤维增强聚合复合材料

    公开(公告)号:US20120153216A1

    公开(公告)日:2012-06-21

    申请号:US13332350

    申请日:2011-12-20

    Applicant: Matthew Wrosch

    Inventor: Matthew Wrosch

    CPC classification number: B82Y30/00 C09K5/14

    Abstract: High thermal conductivity sintered metallic networks are provided for enhancing the transverse thermal conductivity of fiber reinforced polymeric materials. The approach establishes sintered metallic networks in both the intratow and interlaminar regions of a FRP part after appropriate thermal processing Dispersing metallic nanoparticles into a fluxing polymeric resin, and optionally mixing in low and high melting point metallic particles, can establish continuous metallurgical networks through the thickness of a FRP laminate. The fluxing polymeric resin has the dual benefit of reducing native oxides on the metallic fillers to aid the sintering reactions, and also to tailor the rheological properties to yield usable material embodiments with limited impact on material density. The high intrinsic thermal conductivity of the metallic networks yields a FRP part with enhanced transverse thermal conductivity.

    Abstract translation: 提供高导热性烧结金属网络用于提高纤维增强聚合材料的横向热导率。 该方法在适当的热处理后,在FRP部分的内部和内部区域建立烧结金属网络将金属纳米粒子分散到助熔聚合物树脂中,并且任选地在低熔点和高熔点金属颗粒中混合,可以通过厚度建立连续的冶金网络 的FRP层压板。 助熔聚合物树脂具有减少金属填料上的天然氧化物以辅助烧结反应的双重优点,并且还可以调整流变性能以产生对材料密度有有限影响的可用材料实施方案。 金属网络的高固有热导率产生具有增强的横向热导率的FRP部分。

    Thermally conductive adhesive composition and process for device attachment
    2.
    发明授权
    Thermally conductive adhesive composition and process for device attachment 失效
    导热粘合剂组合物和装置连接方法

    公开(公告)号:US07888411B2

    公开(公告)日:2011-02-15

    申请号:US12071280

    申请日:2008-02-19

    Abstract: A thermally conductive adhesive composition includes a powder of a high melting point metal or metal alloy, a powder of a low melting point metal or metal alloy, and a polymerizable fluxing polymer matrix composition having a polyepoxide polymer resin and a low-melting solid or liquid acid-anhydride and a polymer diluent or diluents with carbon carbon double bonds and/or functional hydroxyl groups. The ratio by weight of the low melting point powder to high melting point powder ranges from about 0.50 to about 0.80, and may range from about 0.64 to about 0.75, and may be 0.665. Heretofore unpredicted substantially higher thermal conductivity improvements in performance have been found using these ratios of low melting point powder to high melting point powder.

    Abstract translation: 导热粘合剂组合物包括高熔点金属或金属合金的粉末,低熔点金属或金属合金的粉末,以及具有聚环氧化物聚合物树脂和低熔点固体或液体的可聚合助熔聚合物基质组合物 酸酐和聚合物稀释剂或具有碳碳双键和/或官能羟基的稀释剂。 低熔点粉末与高熔点粉末的重量比为约0.50至约0.80,并且可以为约0.64至约0.75,并且可为0.665。 迄今为止,已经发现使用这些低熔点粉末与高熔点粉末的比例,实质上更高的导热性能改善。

    Thermally conductive adhesive composition and process for device attachment
    3.
    发明申请
    Thermally conductive adhesive composition and process for device attachment 失效
    导热粘合剂组合物和装置连接方法

    公开(公告)号:US20080207814A1

    公开(公告)日:2008-08-28

    申请号:US12071280

    申请日:2008-02-19

    Abstract: A thermally conductive adhesive composition includes a powder of a high melting point metal or metal alloy, a powder of a low melting point metal or metal alloy, and a polymerizable fluxing polymer matrix composition having a polyepoxide polymer resin and a low-melting solid or liquid acid-anhydride and a polymer diluent or diluents with carbon carbon double bonds and/or functional hydroxyl groups. The ratio by weight of the low melting point powder to high melting point powder ranges from about 0.50 to about 0.80, and may range from about 0.64 to about 0.75, and may be 0.665. Heretofore unpredicted substantially higher thermal conductivity improvements in performance have been found using these ratios of low melting point powder to high melting point powder.

    Abstract translation: 导热粘合剂组合物包括高熔点金属或金属合金的粉末,低熔点金属或金属合金的粉末,以及具有聚环氧化物聚合物树脂和低熔点固体或液体的可聚合助熔聚合物基质组合物 酸酐和聚合物稀释剂或具有碳碳双键和/或官能羟基的稀释剂。 低熔点粉末与高熔点粉末的重量比为约0.50至约0.80,并且可以为约0.64至约0.75,并且可为0.665。 迄今为止,已经发现使用这些低熔点粉末与高熔点粉末的比例,实质上更高的导热性能改善。

    Gas barrier
    4.
    发明申请
    Gas barrier 审中-公开
    气体屏障

    公开(公告)号:US20070135552A1

    公开(公告)日:2007-06-14

    申请号:US11298916

    申请日:2005-12-09

    Abstract: Nanoparticles of amorphous aluminum oxynitride or silicon oxynitride having a very high aspect ratio are used to fill polymeric materials to provide products that have an extremely low WVTR/OTR. Such products are particularly effective for incorporation into organic light-emitting devices or the like which are susceptible to degradation from moisture and/or oxygen. Pressure sensitive and/or thermosetting adhesives filled with such particles create excellent sealants. Polymeric sheets or films made from resin in which these nanoparticles are dispersed, or intimately associated with, before extrusion exhibit very low WVTR/OTR.

    Abstract translation: 使用具有非常高纵横比的无定形氮氧化铝或氮氧化硅的纳米颗粒来填充聚合材料以提供具有极低WVTR / OTR的产品。 这些产品对于并入易受水分和/或氧气降解的有机发光器件等中特别有效。 用这种颗粒填充的压敏和/或热固性粘合剂产生优异的密封剂。 由树脂制成的聚合物薄片或薄膜,其中这些纳米颗粒在挤出前分散或紧密相关,显示非常低的WVTR / OTR。

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