公开(公告)号：US09795032B2

公开(公告)日：2017-10-17

申请号：US15325289

申请日：2015-07-10

Applicant: Material Concept, Inc.

Inventor： Junichi Koike ,  Daisuke Ando ,  Yuji Sutou

IPC: B32B15/04 ,  H05K1/09 ,  H05K3/38 ,  H05K1/03 ,  H05K3/10 ,  H05K1/11

CPC classification number: H05K1/09 ,  H01G2/06 ,  H01G4/008 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/11 ,  H05K3/10 ,  H05K3/388 ,  H05K3/389 ,  H05K3/4007 ,  H05K2201/0269 ,  H05K2201/0272 ,  H05K2203/086 ,  H05K2203/087

Abstract: To provide: an electronic component which comprises a copper electrode on an inorganic material substrate and wherein the adhesion strength between the substrate and the copper electrode is high, thereby achieving improved adhesion of the copper electrode; and a method for manufacturing this electronic component. An electronic component which comprises a copper electrode on an inorganic material substrate and wherein an interface layer containing copper, manganese, silicon and oxygen is provided at the interface between the substrate and the copper electrode, and the interface layer contains crystal grains that are mainly formed of copper and dispersed in the interface layer. A method for manufacturing this electronic component comprises: an interface layer formation step for forming an interface layer on the substrate; and an electrode formation step for forming the copper electrode on the interface layer.

公开(公告)号：US20170121571A1

公开(公告)日：2017-05-04

申请号：US15116081

申请日：2015-02-13

Applicant: DEXERIALS CORPORATION

Inventor： Hidetsugu NAMIKI ,  Shiyuki KANISAWA ,  Akira ISHIGAMI ,  Masaharu AOKI

IPC: C09J9/02 ,  C09J11/04 ,  H01L33/64 ,  C09J163/00 ,  C08K9/02 ,  C08K3/22 ,  H01L33/62 ,  H01L33/60

CPC classification number: C09J9/02 ,  C08K3/22 ,  C08K7/16 ,  C08K9/02 ,  C08K2003/0806 ,  C08K2003/2241 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/005 ,  C09J11/04 ,  C09J163/00 ,  C09J201/00 ,  H01B1/22 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L33/644 ,  H01L33/647 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81203 ,  H01L2933/0066 ,  H01L2933/0075 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0272 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/05341 ,  H01L2924/05432

Abstract: Provided is an anisotropic conductive adhesive in which excellent optical characteristics and heat dissipation characteristics are obtainable. The anisotropic conductive adhesive contains conductive particles each comprising a metal layer having Ag as a primary constituent formed on an outermost surface of a resin particle, solder particles having a smaller average particle diameter than the conductive particles, reflective insulating particles having a smaller average particle diameter than the solder particles and a binder into which the conductive particles solder particles and reflective insulating particles are dispersed. The conductive particles and the reflective insulating particles efficiently reflect light, thereby improving light-extraction efficiency of an LED mounting body. Additionally, inter-terminal solder bonding of the solder particles during compression bonding increases contact area between opposing terminals, thereby enabling achievement of high heat dissipation characteristics.

公开(公告)号：US09610655B2

公开(公告)日：2017-04-04

申请号：US14272127

申请日：2014-05-07

Applicant: LG INNOTEK CO., LTD.

Inventor： Deok Ki Hwang

IPC: B23K35/02 ,  B22F1/02 ,  B23K35/26 ,  B23K35/30 ,  B23K35/36 ,  B23K35/24 ,  B23K1/00 ,  H05K3/34 ,  H01L23/00 ,  B22F1/00 ,  B23K35/00 ,  C22C1/04

CPC classification number: B23K35/025 ,  B22F1/0003 ,  B22F1/025 ,  B22F2998/10 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/24 ,  B23K35/262 ,  B23K35/302 ,  B23K35/36 ,  B23K35/3612 ,  C22C1/0425 ,  C22C1/0483 ,  H01L24/14 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/06102 ,  H01L2224/27442 ,  H01L2224/27849 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29347 ,  H01L2224/29439 ,  H01L2224/32058 ,  H01L2224/32245 ,  H01L2224/83801 ,  H01L2924/01322 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0272 ,  H01L2924/00 ,  B22F9/04 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01029

Abstract: A solder paste includes a flux and powder mixed with the flux, where the powder includes first powder and second powder mixed with each other. The first powder may be a tin (Sn) and at least one metal dissolved in the tin (Sn), and the second powder may be a copper (Cu) powder, the surface of which is coated with silver (Ag).

公开(公告)号：US09044816B2

公开(公告)日：2015-06-02

申请号：US13404395

申请日：2012-02-24

Applicant: Kosuke Nakano ,  Hidekiyo Takaoka

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

IPC: B32B15/04 ,  B23K1/00 ,  B23K35/02 ,  B23K35/26 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  H05K3/34 ,  H01L23/00

CPC classification number: B23K35/025 ,  B23K1/00 ,  B23K1/0016 ,  B23K35/262 ,  B23K35/3613 ,  B23K35/362 ,  B23K2101/40 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/1132 ,  H01L2224/1329 ,  H01L2224/13294 ,  H01L2224/13311 ,  H01L2224/13347 ,  H01L2224/16503 ,  H01L2224/16507 ,  H01L2224/2732 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29347 ,  H01L2224/32503 ,  H01L2224/32507 ,  H01L2224/81192 ,  H01L2224/81211 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83211 ,  H01L2224/83447 ,  H01L2224/83815 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0272 ,  Y10T403/479 ,  Y10T428/31678 ,  H01L2924/01028 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01046 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/00012

Abstract: A solder paste including a metal component consisting of a first metal powder and a second metal powder having a melting point higher than that of the first metal, and a flux component. The first metal is Sn or an alloy containing Sn, and the second metal is a metal or alloy which forms an intermetallic compound having a melting point of 310° C. or higher with the first metal and has a lattice constant difference, i.e. a difference in between the lattice constant of the intermetallic compound and the lattice constant of the second metal component, of 50% or greater.

Abstract translation: 包括由第一金属粉末和熔点高于第一金属的第二金属粉末组成的金属成分的焊膏和焊剂成分。 第一金属是Sn或含有Sn的合金，第二金属是与第一金属形成熔点为310℃以上的金属间化合物的金属或合金，并且具有晶格常数差，即差 金属间化合物的晶格常数和第二金属成分的晶格常数之间的比例为50％以上。

公开(公告)号：US09011726B2

公开(公告)日：2015-04-21

申请号：US12067996

申请日：2006-09-29

Applicant: Toyoji Nagano ,  Kinji Oono ,  Shoko Kuwajima

Inventor： Toyoji Nagano ,  Kinji Oono ,  Shoko Kuwajima

IPC: H01B1/00 ,  H01B1/22 ,  H05K1/09

CPC classification number: H01B1/22 ,  H05K1/095 ,  H05K2201/0245 ,  H05K2201/0272

Abstract: Electrically conductive powder includes polyhedral large particles and flakey small particles. The aspect ratio of the small particles is not less than 3 and is at least 1.3 times greater than that of the large particles. The electrically conductive powder is surface treated with a fatty acid. The electrically conductive powder has good contact among the polyhedral large particles and the flakey small particles. An electrically conductive paste of the electrically conductive powder achieves excellent electrical and thermal conductivities because the particles are in contact not at points but through surfaces. The electrically conductive paste is capable of filling via-holes in a satisfactory manner.

Abstract translation: 导电粉末包括多面体大颗粒和片状小颗粒。 小颗粒的长宽比不小于3，比大颗粒的长宽比大至少1.3倍。 导电粉末用脂肪酸进行表面处理。 导电粉末在多面体大颗粒和片状小颗粒之间具有良好的接触。 导电粉末的导电糊料实现了优异的导电性和导热性，因为颗粒不是接触点而是通过表面接触。 导电浆料能以令人满意的方式填充通孔。

公开(公告)号：US20150103464A1

公开(公告)日：2015-04-16

申请号：US14150295

申请日：2014-01-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Bon Seok KOO ,  Byung Ho JUN ,  Jung Wook SEO

IPC: H05F3/04 ,  H01B1/22

CPC classification number: H05F3/04 ,  H01B1/22 ,  H01B3/004 ,  H05K1/0259 ,  H05K1/095 ,  H05K9/0067 ,  H05K2201/0245 ,  H05K2201/0272

Abstract: There is provided a static-protective component including: an insulating substrate; first and second electrodes disposed on the insulating substrate, having a gap of a predetermined interval therebetween; and a turn-on voltage controlling unit disposed at the gap and containing conductive particles and non-conductive particles each having a particle diameter of 120 nm to 1000 nm.

Abstract translation: 提供了一种静电保护部件，包括：绝缘基板; 设置在绝缘基板上的第一和第二电极，其间具有预定间隔的间隙; 以及设置在所述间隙处并且包含粒径为120nm至1000nm的导电颗粒和非导电颗粒的导通电压控制单元。

公开(公告)号：US08999204B2

公开(公告)日：2015-04-07

申请号：US13248924

申请日：2011-09-29

Applicant: Jae-Min Hong ,  Yong-Won Song ,  Yong-Ju Jung ,  Hee-Dok Choi ,  Won-Suk Han ,  Hak-Sung Kim

Inventor： Jae-Min Hong ,  Yong-Won Song ,  Yong-Ju Jung ,  Hee-Dok Choi ,  Won-Suk Han ,  Hak-Sung Kim

IPC: H01B1/16 ,  H01B1/22 ,  B05D5/12 ,  C09D11/52 ,  C09D11/106 ,  H05K1/09 ,  B41M3/00 ,  B41M7/00 ,  B82Y30/00 ,  H05K3/12

CPC classification number: H01B1/22 ,  B41M3/006 ,  B41M7/009 ,  B82Y30/00 ,  C09D11/106 ,  C09D11/52 ,  H05K1/095 ,  H05K3/1283 ,  H05K2201/0272 ,  H05K2203/107

Abstract: Disclosed is a conductive ink composition, a manufacturing method thereof, and a manufacturing method of a conductive thin film using the same, and more specifically, a conductive ink composition is provided that includes composite metal nanoparticles including first metal nanoparticles and second metal nanoparticles, and a polymer matrix. The polymer matrix is a composition including a polymer and a solvent, the first metal nanoparticles and the second metal nanoparticles are different metals, and the content of the composite metal nanoparticles is about 20 to about 25 wt %, the content of the polymer is about 5 to about 10 wt %, and the content of the solvent is about 65 to about 75 wt %, based on the total weight of the composition.

Abstract translation: 公开了一种导电性油墨组合物及其制造方法以及使用该导电性薄膜的导电性薄膜的制造方法，更具体地说，提供了包含第一金属纳米粒子和第二金属纳米粒子的复合金属纳米粒子的导电性油墨组合物，以及 聚合物基质。 聚合物基质是包含聚合物和溶剂的组合物，第一金属纳米颗粒和第二金属纳米颗粒是不同的金属，并且复合金属纳米颗粒的含量为约20至约25重量％，聚合物的含量约为 5至约10重量％，并且溶剂的含量为约65至约75重量％，基于组合物的总重量。

公开(公告)号：US08940193B2

公开(公告)日：2015-01-27

申请号：US13158356

申请日：2011-06-10

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: H01B1/06 ,  H01B1/12 ,  H01C7/10 ,  B05D5/12 ,  B82Y10/00 ,  H01B1/22 ,  H01B1/24 ,  H01C7/105 ,  H01C17/065 ,  H05K1/02 ,  H05K3/18 ,  H05K1/03 ,  H05K1/16

CPC classification number: H01C7/1006 ,  B82Y10/00 ,  H01B1/22 ,  H01B1/24 ,  H01C7/105 ,  H01C17/0652 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/188 ,  H05K2201/0248 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0272 ,  H05K2201/0738 ,  H05K2203/0723 ,  H05K2203/105 ,  Y10S977/742 ,  Y10S977/779 ,  Y10T428/30 ,  Y10T428/31678

Abstract: One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.

Abstract translation: 一个或多个实施例提供了一种使用具有半导体或导电材料的电压可切换介电材料的器件，该器件具有相对较高的纵横比，以便增强器件上的VSD材料的机械和电学特性。

公开(公告)号：US08756805B2

公开(公告)日：2014-06-24

申请号：US13256114

申请日：2010-03-09

Applicant: Norihiro Yamaguchi ,  Hiroaki Umeda ,  Ken Yukawa

Inventor： Norihiro Yamaguchi ,  Hiroaki Umeda ,  Ken Yukawa

IPC: H01K3/10

CPC classification number: H05K3/46 ,  H01B1/22 ,  H05K1/0298 ,  H05K1/095 ,  H05K3/0032 ,  H05K3/4069 ,  H05K3/462 ,  H05K2201/0191 ,  H05K2201/0272 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0278 ,  H05K2203/0425 ,  H05K2203/1105 ,  H05K2203/111 ,  H05K2203/1194 ,  H05K2203/1461 ,  H05K2203/1572 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method of manufacturing a multilayer board, including: forming a hole through a pre-preg by laser, filling the hole with conductive paste containing a resin component and metal powder, and arranging copper layer portions of patterned boards on and under the filled conductive paste and pressing the same, wherein in the conductive paste at least surface layers of the different metal powders are melted and alloyed, the pre-preg has a ratio A/B of at least 10 before being subjected to preheating, where A is a storage modulus at an inflection point where the storage modulus changes from increasing to decreasing and B is a storage modulus at an inflection point where the storage modulus changes from decreasing to increasing in a temperature rising from 60 to 200 degree C., and preheating the pre-preg before the drilling step to reduce the ratio A/B to below 10.

Abstract translation: 一种制造多层板的方法，包括：通过激光预预处理形成孔，用含有树脂成分和金属粉末的导电膏填充孔，并且在填充的导电糊料的上方和下方布置图案化板的铜层部分 并且对其进行压制，其中在所述导电浆料中，所述不同金属粉末的至少表面层熔融并合金化，所述预浸料在进行预热之前的比率A / B为至少10，其中A为储能模量 在储能模量从增加到降低的拐点处，B是在从60℃升至200℃的温度下储能模量从降低到升高的拐点处的储能模量，并预热预浸料 在钻井步骤之前将A / B比例降低到10以下。

公开(公告)号：US20140166347A1

公开(公告)日：2014-06-19

申请号：US13831720

申请日：2013-03-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yoon Su Kim ,  Sung Han ,  Jin Gu Kim ,  Young Do Kweon

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K3/383 ,  H05K1/097 ,  H05K3/125 ,  H05K2201/0215 ,  H05K2201/0272 ,  H05K2203/0307 ,  H05K2203/0773 ,  H05K2203/1131

Abstract: Disclosed herein is a printed circuit board, including: a base substrate; and a circuit pattern formed on the base substrate, including a conductive filler therein, and having roughness formed on a surface thereof.

Abstract translation: 本文公开了一种印刷电路板，包括：基底; 以及形成在基底基板上的电路图案，其中包括导电填料，并且在其表面上形成粗糙度。