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1.发明授权Transponder inlay with antenna breaking layer for a document for personal identification, and a method for producing a transponder inlay 有权用于个人识别的文档的天线断层的发送应答器，以及用于产生应答器嵌入的方法公开(公告)号：US08640961B2
公开(公告)日：2014-02-04
申请号：US13248052
申请日：2011-09-29
CPC分类号： B42D25/22 , B42D25/00 , B42D25/47 , B42D2033/46 , G06K19/02 , G06K19/07758 , Y10T156/10 , Y10T156/1057
摘要： In various embodiments, a transponder inlay for a document for personal identification may include a cover; an adhesive layer arranged on the cover; a chip arranged on the adhesive layer; an antenna connected to the chip; and a top layer on the adhesive layer, wherein the top layer has a top and a bottom and wherein the bottom of the top layer is connected to the cover by means of the adhesive layer and wherein the antenna is arranged on the top of the top layer such that the antenna is at least to some extent physically separated from the adhesive layer by the top layer.
摘要翻译： 在各种实施例中，用于个人识别的文档的应答器嵌体可以包括盖子; 布置在所述盖上的粘合剂层; 布置在粘合剂层上的芯片; 连接到芯片的天线; 以及所述粘合剂层上的顶层，其中所述顶层具有顶部和底部，并且其中所述顶层的底部通过所述粘合剂层连接到所述盖，并且其中所述天线布置在所述顶部的顶部 使得天线至少在某种程度上由顶层与粘合剂层物理分离。
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2.发明授权公开(公告)号：US08272574B2
公开(公告)日：2012-09-25
申请号：US12570993
申请日：2009-09-30
CPC分类号： G06K19/07749 , B32B38/10 , B32B2305/347 , B32B2425/00 , B32B2519/02 , Y10T156/10
摘要： A document for personal identification, having a chip module including the following components: a chip and a leadframe, wherein the chip is connected to the leadframe, an outer cover, wherein the outer cover is connected to a transponder substrate. A first component of the chip module is connected to the outer cover and a second component of the chip module is connected to the transponder substrate in such a way that, in the case of separation of outer cover and transponder substrate, the first component of the chip module is separated from the second component of the chip module.
摘要翻译： 一种用于个人识别的文档，具有包括以下部件的芯片模块：芯片和引线框架，其中芯片连接到引线框架，外盖，其中外盖连接到应答器基板。 芯片模块的第一部件连接到外盖，并且芯片模块的第二部件以这样的方式连接到应答器基板，使得在分离外盖和应答器基板的情况下，第一部件 芯片模块与芯片模块的第二组件分离。
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3.发明申请TRANSPONDER INLAY FOR A DOCUMENT FOR PERSONAL IDENTIFICATION, AND A METHOD FOR PRODUCING A TRANSPONDER INLAY 有权用于个人身份识别的文档的传输器接口和用于生成传送器内嵌的方法公开(公告)号：US20120074228A1
公开(公告)日：2012-03-29
申请号：US13248052
申请日：2011-09-29
IPC分类号： G06K19/02 , B32B37/14 , B32B38/04 , G06K19/077 , B32B37/12
CPC分类号： B42D25/22 , B42D25/00 , B42D25/47 , B42D2033/46 , G06K19/02 , G06K19/07758 , Y10T156/10 , Y10T156/1057
摘要： In various embodiments, a transponder inlay for a document for personal identification may include a cover; an adhesive layer arranged on the cover; a chip arranged on the adhesive layer; an antenna connected to the chip; and a top layer on the adhesive layer, wherein the top layer has a top and a bottom and wherein the bottom of the top layer is connected to the cover by means of the adhesive layer and wherein the antenna is arranged on the top of the top layer such that the antenna is at least to some extent physically separated from the adhesive layer by the top layer.
摘要翻译： 在各种实施例中，用于个人识别的文档的应答器嵌体可以包括盖子; 布置在所述盖上的粘合剂层; 布置在粘合剂层上的芯片; 连接到芯片的天线; 以及所述粘合剂层上的顶层，其中所述顶层具有顶部和底部，并且其中所述顶层的底部通过所述粘合剂层连接到所述盖，并且其中所述天线布置在所述顶部的顶部 使得天线至少在某种程度上由顶层与粘合剂层物理分离。
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4.发明申请DOCUMENT FOR PERSONAL IDENTIFICATION AND A METHOD FOR PRODUCING A DOCUMENT FOR PERSONAL IDENTIFICATION 有权用于个人身份识别的文档和用于生成用于个人身份识别的文档的方法公开(公告)号：US20100084474A1
公开(公告)日：2010-04-08
申请号：US12570993
申请日：2009-09-30
CPC分类号： G06K19/07749 , B32B38/10 , B32B2305/347 , B32B2425/00 , B32B2519/02 , Y10T156/10
摘要： A document for personal identification, having a chip module including the following components: a chip and a leadframe, wherein the chip is connected to the leadframe, an outer cover, wherein the outer cover is connected to a transponder substrate. A first component of the chip module is connected to the outer cover and a second component of the chip module is connected to the transponder substrate in such a way that, in the case of separation of outer cover and transponder substrate, the first component of the chip module is separated from the second component of the chip module.
摘要翻译： 一种用于个人识别的文档，具有包括以下部件的芯片模块：芯片和引线框架，其中芯片连接到引线框架，外盖，其中外盖连接到应答器基板。 芯片模块的第一部件连接到外盖，并且芯片模块的第二部件以这样的方式连接到应答器基板，使得在分离外盖和应答器基板的情况下，第一部件 芯片模块与芯片模块的第二组件分离。
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